DIGITIMES Semiconductors news

Aug 3

Intel offers bonuses to speed up Ohio fab construction and reaches EMIB-T yields of 90%

Intel is awarding bonuses for overtime work as it seeks to complete the construction of its Ohio fab complex by 2031. Meanwhile, the company has made progress on the development of its next-generation packaging technology, embedded multi-die interconnect bridge-through-silicon via (EMIB-T), positioning it to compete with TSMC.

CXMT closes in on LPDDR6 mass production, challenging Samsung, SK Hynix

Aug 3

MA-tek sells Shanghai unit, expands AI market push in Japan and the US

Aug 3

TSMC Kumamoto fab faces first major quake test with chip-material supplies secured

Aug 3

Samsung's GaN rumored setbacks threaten foundry launch, leaving it racing to close reliability gap

Aug 3

MORE NEWS

IC MANUFACTURINGKumamoto semiconductor production recovers, TSMC's Japan subsidiary returns to normal operations

Aug 4, 12:09

TSMC has announced that Japan Advanced Semiconductor Manufacturing (JASM), its subsidiary in Kikuyo, Kumamoto Prefecture, has resumed normal operations following production disruptions caused by the recent Kumamoto earthquake.

MEMORY CHIPSCXMT reportedly weighs second Beijing DRAM fab as Chinese cities compete for memory chip investment

Aug 4, 11:52

China's leading DRAM maker ChangXin Memory Technologies (CXMT) is considering building a second 12-inch memory chip fabrication plant in Beijing's Yizhuang district while holding early-stage financing talks with entities backed by the Beijing municipal government, according to a Reuters report. The proposed project would further expand the company's manufacturing footprint as AI-driven demand continues to tighten global memory supply.

PASSIVE, PCB, OTHER IC COMPONENTSTaiwan specialty chemical firm expands Taiwan, China capacity on AI materials boom, eyes 20% revenue gain in 2026

Aug 4, 11:46

Taiwan-based specialty chemicals supplier Johnson Fine Chemical expects robust growth in electronic materials demand driven by AI, high-performance computing (HPC) and advanced communications applications. The company is expanding production capacity in both Taiwan and China and plans to raise prices for selected products by 10-20% in the third quarter of 2026 to offset higher raw material costs. Management forecasts revenue growth of about 20% in 2026 from a year earlier, with profits also expected to increase, while 2027 is projected to deliver even stronger results.

PASSIVE, PCB, OTHER IC COMPONENTSKinsus boosts spending as global IC substrate supply stays tight

Aug 4, 11:11

Kinsus said stronger second-quarter results and fresh capital spending reflect continued strain in the global IC substrate market, where demand from AI, CPU, GPU, and ASIC customers is keeping capacity tight. For global readers, the company's expansion plan points to prolonged supply constraints and firmer pricing ahead.

IC MANUFACTURINGTaiwan-Japan semiconductor ties go beyond supply chain partnerships

Aug 4, 10:57

Cooperation between Taiwan and Japan in semiconductors will go beyond supply-chain partnerships towards joint technological innovation and talent development, according to Taiwan's former Minister of Economic Affairs Jyh-huei Kuo.

MEMORY CHIPSTeam Group 2Q26 profit surges more than 200-fold, expects DRAM shortage to persist through 2027

Aug 4, 10:54

Memory module maker Team Group posted record profit in the first half of 2026, as surging demand and a persistent DRAM supply-demand gap lifted earnings to all-time highs.

IC MANUFACTURINGKey material shortages prompt suppliers to prioritize three customer groups

Aug 4, 10:41

Taiwanese research institute Chung-Hua Institution for Economic Research (CIER) released Taiwan's manufacturing purchasing managers' index (PMI) for July 2026 on August 3. The seasonally adjusted PMI rose 0.8pp to 61.5%, marking the tenth consecutive month of growth and the fastest pace of expansion since September 2021. The six-month outlook index also edged up 0.3pp to 64.5%, remaining above the 60.0% expansion threshold for a seventh consecutive month.

IC DESIGN, DISTRIBUTIONMediaTek sees SerDes 448G as copper's final battleground

Aug 4, 10:27

The question of where the limits of cloud AI high-speed interconnects will fall has been a major market focus over the past six months. MediaTek addressed the issue for the first time in its 2026 second-quarter earnings call, saying its work on the more advanced SerDes 448G specification is roughly halfway complete.

MEMORY CHIPS2027 memory capacity reportedly sold out as buyers quietly lock in supply

Aug 4, 10:04

Tight memory supply is expected to persist into 2027, with industry sources saying manufacturers have already completed much of their capacity-allocation negotiations for next year.

IC MANUFACTURINGOnsemi expects AI data-center revenue to more than double in 2026 as cyclical recovery takes hold

Aug 4, 09:37

Onsemi's second-quarter results pointed to a broadening recovery in semiconductor demand, with AI data-center applications emerging as the company's fastest-growing business, while the automotive and industrial markets are showing signs of stabilization. The outlook suggests that improving utilization and product mix could support further margin expansion, though the absence of a major upside surprise in third-quarter guidance suggests a broader inventory-replenishment cycle has yet to begin.

IC DESIGN, DISTRIBUTIONChina’s in-house auto chip push could reshape costs, supply chains, and regulatory risks

Aug 4, 09:14

As Chinese automakers accelerate in-house chip development, the strategy is increasingly about more than smart vehicles. It is also tied to supply chain self-reliance, overseas expansion, and the longer-term push into artificial intelligence robots, even as advanced chips still rely on external foundries.

More coverage

TOPICS

TSMC UPDATES

JAPAN ADVANCED SEMICONDUCTOR MANUFACTURING, INC. (JASM)

INTERVIEWS