DIGITIMES Semiconductors news

Jul 24

AMD redraws server chip strategy as AI workloads evolve

AMD has launched its sixth-generation EPYC Venice server processor as the foundation of its next-generation AI data center platform, while CEO Lisa Su said the company is reshaping its roadmap for a world where AI workloads are spreading from training models to enterprise agents. The shift matters globally because it signals that data centers may need more balanced upgrades to CPU, GPUs, and networking.

India's chip plants face harder test: finding repeat customers

Jul 24

TSMC's Arizona expansion moves past initial hurdles as fabs and packaging ramp up

Jul 24

Rapidus expands Hokkaido chip hub with packaging and analysis

Jul 24

Intel reportedly considers SK Hynix for Ohio fab partnership

Jul 24

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IC DESIGN, DISTRIBUTIONRebellions readies Rebel100 shipments as AI inference demand grows

Jul 27, 13:58

South Korean AI chip designer Rebellions plans to begin shipping its next-generation Rebel100 accelerator in the second half of 2026, betting that wider use of AI agents and commercial AI services will shift more infrastructure spending from model training toward inference.

IC MANUFACTURINGWIN Semiconductors sees optical communications ramp accelerate AI revenue contribution

Jul 27, 13:03

Gallium arsenide (GaAs) foundry WIN Semiconductors (WIN) expects infrastructure revenue to continue growing in the third quarter of 2026, driven by demand from low Earth orbit (LEO) satellites and other aerospace applications, while shipments of smartphone power amplifiers (PAs) and Wi-Fi products are expected to remain broadly flat or post modest growth.

IC MANUFACTURINGIndia's Paras Defense semiconductor unit to invest in Madhya Pradesh OSAT facility

Jul 27, 12:52

Indian defense engineering company Paras Defense and Space Technologies said its semiconductor subsidiary, Paras Semiconductors, will invest INR62 billion (approx. US$643.79 million) to establish a semiconductor packaging and testing facility in Madhya Pradesh, as the country expands efforts to build a domestic chip manufacturing ecosystem, according to Reuters, The Economic Times, and Data Quest.

IC DESIGN, DISTRIBUTIONIndia's NIELIT and SCL expand access to indigenous semiconductor design kit through eChipHub

Jul 27, 12:19

India's National Institute of Electronics and Information Technology (NIELIT) and the Semiconductor Laboratory (SCL) have collaborated to make SCL's indigenous 1.2-micrometer Process Design Kit (PDK) available through the eChipHub platform, supporting semiconductor design education and research as part of the country's India Semiconductor Mission.

IC DESIGN, DISTRIBUTIONQualcomm tells customers chip prices will rise by double digits from September

Jul 27, 12:02

Qualcomm plans to raise chip prices by a double-digit percentage from September 1, passing higher supplier costs into a smartphone market already strained by memory shortages and AI-related competition for semiconductor capacity.

IC DESIGN, DISTRIBUTIONIndieSemiC, Semtech partner on RISC-V IoT platform as India expands semiconductor design ecosystem

Jul 27, 12:01

Gujarat-based fabless semiconductor startup IndieSemiC has partnered with US-based semiconductor supplier Semtech Corporation to develop a new RISC-V-based system-in-package (SiP) platform that combines general-purpose computing with long-range wireless connectivity for Internet of Things (IoT) applications, according to announcements by DeshGujarat and The Economic Times.

IC MANUFACTURINGSamsung, Hyundai expand AI push from chips to robotics

Jul 27, 11:26

Samsung Electronics and Hyundai Motor Group used the San Francisco AI Summit to outline separate artificial intelligence (AI) expansion plans spanning semiconductors, autonomous driving and robotics.

MEMORY CHIPSWeekly news roundup: Samsung and SK Hynix favor DDR5, Intel accelerates 18A, Alibaba deepens CXMT ties

Jul 27, 11:14

AI infrastructure, memory and advanced chipmaking led this week's tech agenda, with Intel, Samsung, SK Hynix, CXMT, Alibaba and Foxconn reshaping capacity and supply chains. Below are the most-read DIGITIMES stories from the week of July 20-26, 2026.

MEMORY CHIPSCXMT's US$8.6 billion IPO sets off new spending cycle across China's DRAM supply chain

Jul 27, 10:56

China's leading DRAM producer CXMT listed on Shanghai's STAR Market on July 27 after raising about CNY57.9 billion (approx. US$8.6 billion), the board's largest initial public offering to date. The deal gives the memory chipmaker fresh capital to expand capacity, develop advanced processes and accelerate new products, while creating a substantial demand pipeline for China's semiconductor equipment, materials, packaging and memory-module suppliers.

IC MANUFACTURINGIDMs target AI margins, boosting Taiwan power suppliers

Jul 27, 09:10

International IDMs such as Texas Instruments (TI) and STMicroelectronics are leaning into AI data-center demand, while the market's shift toward 400V and 800V power architectures is creating a longer runway for power semiconductors. Industry sources said the move could benefit Taiwanese suppliers in midrange products, with pricing gains extending into the second half of 2025 and, in some cases, 2027.

IC DESIGN, DISTRIBUTIONAMD widens robotics push with Taiwan IPC partners as it targets Nvidia lead

Jul 27, 09:10

AMD is deepening its robot and physical AI ambitions, and the move could matter far beyond Taiwan's industrial PC sector. By building a broader partner network in edge AI and robotics, the chipmaker aims to challenge Nvidia as global developers and manufacturers seek cheaper, faster paths to autonomous systems.

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