South Korean outsourced semiconductor assembly and test (OSAT) provider LB Semicon is expanding power semiconductor backend capacity at its Gumi plant as it steps up efforts to reduce its reliance on display driver integrated circuits (DDIs) and a highly concentrated customer base, backed by new business from Qualcomm and Renesas and KRW30 billion (approx. US$22.3 million) in planned equipment investment.

Samsung Electronics has reportedly begun front-end wafer mass production of its next-generation Exynos 2700 mobile application processor, with production volume planned at more than 10% above that of the Exynos 2600 as the company prepares to expand use of its in-house chips across the Galaxy S27 lineup.

China's WG Tech has reportedly begun the second phase of investment in its through-glass via (TGV) glass substrate production line, with total future capacity projected to reach 1 million square meters a year. Analysts say Chinese makers have moved ahead of South Korean rivals by building production lines first, then accelerating product output and customer validation, giving China an early lead in glass substrate commercialization.

Semiconductors and AI data centers share a striking number of similarities.

Memory chip profitability has surged as core operations improve sharply, with some Winbond employees reportedly receiving NT$500,000 to NT$1 million (US$15,733.41–31,466.83) in cash bonuses, helping reverse the company's recent loss-making image. The move underscores growing confidence in the memory outlook and a widening talent battle in Taiwan's tech sector.

Samsung Electronics has set up a Quantum Design Lab in the Boston area of Massachusetts and started hiring for it, marking a new phase in the company's push into quantum computing. The effort places the South Korean tech giant closer to US research hubs and signals a broader attempt to connect semiconductor expertise with quantum development.

Japan's Kyushu Semiconductor Industry Exhibition, known as K-Semi, grew 36% at this year's edition in Fukuoka, held from September 30 to October 1, 2026, as chip makers expanded their presence in Kyushu. The event also added a semiconductor design zone for the first time and was held alongside the debut Kyushu Next-Generation Energy Exhibition, or K-Ene.

Companies in the Southern Taiwan Science Park (STSP) posted record revenue of NT$2.495124 trillion (US$78.59 billion) in the first eight months of 2026, up 36.5% from a year earlier, according to the STSP Bureau. The bureau said the growth reflected the global AI boom and the park's expanding role in the high-tech supply chain.

Severe floods triggered by days of extreme rain in Thailand have paralyzed transport in Bangkok and several other areas, disrupting local auto and components supply chains and drawing attention to damage at Taiwanese companies with factories in the country. The flooding has also slowed shipments from Taiwan PCB makers in Thailand as road and airport transport remain affected.

Chunghwa Precision Test Tech (CHPT), a supplier of semiconductor test interfaces, posted record revenue for September and the third quarter of 2026 as demand for AI-related chip testing kept capacity utilization high. Revenue for the first nine months of the year also reached a record.

Researchers in Taiwan are intensifying efforts to turn 2D semiconductor materials from basic science into practical applications, with a series of studies published in Nature. The latest work, published in the October 1 issue of the leading scientific journal, follows another Nature paper published on July 1, 2026, underscoring the push in Taiwan's academia to speed up research in next-generation semiconductors.