DIGITIMES Semiconductors news

Apr 23

SK Hynix to shift over half of NAND output to 321-layer chips

SK Hynix said it plans to expand production of its latest 321-layer NAND chips, as demand for AI applications leads to increased adoption of high-capacity enterprise storage.

SpaceX eyes GPU push as Tesla taps Samsung for chip upgrade

Apr 23

Tesla tap Intel's advanced 14A chip for Terafab project

Apr 23

TSMC to open Arizona packaging facility by 2029, signals caution on high-NA EUV

Apr 23

Texas Instruments signals broad recovery across industrial and data center markets with cautious optimism

Apr 23

MORE NEWS

IC MANUFACTURINGStrait of Hormuz disruption puts semiconductor supply chains at risk as photoresist shortages grow

Apr 24, 15:57

Geopolitical tensions in the Middle East and the blockade of the Strait of Hormuz since early March 2026 are beginning to ripple through the global semiconductor supply chain, threatening shortages of a critical chipmaking material: photoresists.

IC DESIGN, DISTRIBUTIONSTMicroelectronics tops 1Q26 guidance, sees data center revenue surpass US$1 billion by 2027

Apr 24, 15:50

STMicroelectronics reported first-quarter 2026 revenue of US$3.10 billion, up 23% year over year, with results coming in above the midpoint of its guidance as growth in personal electronics and computing helped offset continued softness in automotive and industrial markets.

IC MANUFACTURINGTSMC CoPoS equipment orders face reshuffle with legal turmoil at Taiwanese equipment maker

Apr 24, 15:46

The semiconductor packaging equipment sector is experiencing order shifts linked to significant executive changes at a key Taiwanese supplier, raising concerns over TSMC's chip-on-wafer-on-substrate (CoWoS) and chip-on-panel-on-substrate (CoPoS) advanced packaging equipment orders. Industry sources indicate that ASE Technology Holding's equipment orders may also be affected as the supply chain undergoes potential realignment.

MEMORY CHIPSSK Hynix deepens TSMC ties with HBM4, advances memory-logic integration

Apr 24, 11:25

SK Hynix showcased its latest high-bandwidth memory (HBM) technologies at TSMC's North America Technology Symposium 2026, highlighting closer collaboration with the foundry and outlining a strategy focused on integrating memory and logic.

IC MANUFACTURINGTexas Instruments eyes further price hikes amid strong data center, industrial chip demand

Apr 24, 11:13

Texas Instruments (TI) reported robust results for the first quarter of 2026 on April 23, driven by surging AI data center demand and a notable rebound in industrial control applications. TI stressed that while industrial demand has yet to reach its previous peak, the current recovery trend is positive, signaling continued growth prospects ahead.

PASSIVE, PCB, OTHER IC COMPONENTSAI PCB supply crunch squeezes margins on rising materials and energy costs

Apr 24, 11:07

A tightening supply of high-end materials is emerging as a key constraint just as PCB specifications and manufacturing processes move into a new upgrade cycle. Shortages span from T-glass fiberglass cloth for IC substrates to longer lead times for copper-clad laminates (CCL), with prices for multiple upstream inputs rising in tandem.

PASSIVE, PCB, OTHER IC COMPONENTSZhen Ding to invest CNY40 billion in Huai'an to expand high-end PCB capacity

Apr 24, 10:59

Zhen Ding Technology has broken ground on its HD campus at the Huai'an Technology City in China, as it accelerates investment to expand high-end printed circuit board (PCB) capacity targeting artificial intelligence (AI) applications.

PASSIVE, PCB, OTHER IC COMPONENTSMCU supplier Artery weighs price hikes on AI capacity squeeze, new applications drive growth

Apr 24, 10:44

Microcontroller supplier Artery Technology (Arterytek or Arterychip) delivered a strong start to 2026, posting first-quarter consolidated revenue of NT$653 million (approx. US$20.1 million), a record high for a single quarter. Full-year revenue is projected to grow by up to 60%, driven by a combination of new product launches and expanded demand from existing customers.

IC MANUFACTURINGTexas Instruments says edge AI opportunities extend beyond robots

Apr 24, 10:32

In an April 23 interview, Amichai Ron of Texas Instruments (TI) warned that edge AI will reshape devices worldwide, extending far beyond robotics and driving greater semiconductor demand as AI integrates into long-lived products, implying that global markets must prepare for increased connectivity, sensorization, and chip requirements, along with regulatory and logistical adjustments.

IC DESIGN, DISTRIBUTIONExclusive: Google ramps new TPU servers, Taiwan suppliers gain share

Apr 24, 10:10

Google's unveiling of its eighth-generation tensor processing unit (TPU) at Cloud Next 2026 is expected to drive the next wave of growth in the application-specific integrated circuit (ASIC) server supply chain, with Taiwanese manufacturers expanding their role, according to supply chain sources.

IC MANUFACTURINGSMIC returns to advanced packaging, scales team to boost AI chip strategy

Apr 24, 10:04

China's leading foundry, SMIC, is quietly recalibrating its strategy, moving beyond its long-standing focus on front-end wafer manufacturing to accelerate investments in advanced packaging.

More coverage

TOPICS

TSMC UPDATES

JAPAN ADVANCED SEMICONDUCTOR MANUFACTURING, INC. (JASM)

INTERVIEWS