Memory pricing pressure continues to intensify. Contract prices have already recorded substantial gains for two consecutive quarters in the first half of 2026. The pace of quarterly increases may now moderate as the pricing base climbs higher. Still, the memory industry remains firmly in a seller's market. Supply constraints have spread beyond high-bandwidth memory (HBM) and premium DRAM products to virtually all memory categories. Industry sources expect pricing increases to vary by product segment, but the long-term upward trend remains intact, with overall memory prices potentially rising another 60–75% in the second half of the year.

Apple's next iPhone Pro lineup could be heading toward one of its sharpest pricing tests in years, as surging memory costs threaten to raise hardware expenses just as the company pushes deeper into on-device AI.

For more than a decade, Apple built one of the industry's most profitable business models by using its purchasing power to drive down memory and component costs before turning hardware upgrades into high-margin revenue. The AI-driven boom in HBM and DRAM is now challenging that strategy.

AI demand in 2026 is no longer confined to GPUs, but is broadening into ASICs, networking, PMICs, and a wide range of peripheral ICs, tightening capacity across both 8-inch mature processes and 12-inch advanced nodes. CoWoS's advanced packaging and HBM capacity are also set for a prolonged supply shortage, effectively rewriting the foundry industry's business cycle.

Samsung Electronics is moving forward again on its 1.4nm foundry process, but on a slower schedule than originally planned, The Bell reported, citing industry sources.

Nexchip Semiconductor has filed for a Hong Kong listing to fund expansion, following rapid revenue growth and a stronger market position. The prospectus highlights its scale in display driver chips and image sensors, while also warning investors about customer concentration, heavy capital needs, and exposure to shifting trade policy.

Reports in South Korea that SK Hynix is slowing the pace of converting production lines to sixth-generation high-bandwidth memory, or HBM4, and shifting more capacity toward commodity DRAM have drawn market attention.