MediaTek reported its September and third-quarter 2026 revenue results, with September revenue of NT$55.40 billion (approx. US$1.74 billion), down 13.69% from the previous month and up 1.97% from a year earlier. Third-quarter revenue reached NT$168.06 billion, up 10.43% quarter over quarter and 18.27% year over year, beating the upper end of its revenue forecast by about 5.2% and allowing the company to deliver the performance typically expected during the traditional peak season.

GF said on October 8, 2026, that it has signed a multi-year, US$2 billion manufacturing agreement with TSMC to produce silicon interposers for TSMC's CoWoS ecosystem at its Malta, New York fab, which GF says will become the first US-based source of silicon interposers supporting advanced packaging.

Samsung Electronics' next-generation 12-layer HBM4E product, a type of high-bandwidth memory (HBM), has reportedly cleared customer quality validation from Nvidia and major hyperscale data center operators. If confirmed, the result would strengthen Samsung's bid to supply memory for next-gen AI accelerators, though order timing and mass production plans remain unclear.

AI chip manufacturing demands are accelerating development of advanced logic and packaging technologies, prompting Applied Materials and Intel to expand their collaboration on next-generation transistors, interconnects, and advanced packaging.

Memory module makers Innodisk and Apacer both reported year-over-year and month-over-month revenue growth for September 2026, supported by steady demand from industrial control, edge computing and AI smart connectivity applications. Their cumulative revenue for the first three quarters of the year also set strong growth records.

Semiconductor test interface maker WinWay Technology said AI and high-performance computing (HPC) demand, along with production-efficiency gains on some lines, drove shipments higher in 2026. The company surpassed NT$10 billion (approx. US$314.7 million) in cumulative revenue in September, a milestone it originally expected to hit in 2027, and reported record third-quarter sales as the semiconductor supply chain continued to benefit from strong AI-related spending.

Inpaq, part of the PSA Group, said it will eliminate the chief executive officer (CEO) position effective immediately as it adjusts its organizational structure and management responsibilities. In a related personnel change, Joyin chair Jui-Tsung Chang will serve as general manager, while former CEO and president Eunice Chen will remain a company director.

Lam Research is launching its first country-specific semiconductor venture fund in South Korea after shipping its 15,000th locally manufactured processing chamber, deepening its manufacturing and technology ties with one of the world's major chipmaking hubs.

SpaceX is reportedly seeking US$40 billion in financing to purchase Nvidia chips, a massive capital commitment driven by surging artificial intelligence (AI) computing demand. Viewed alongside Elon Musk's Terafab semiconductor manufacturing initiative, however, the move suggests a dual-track strategy: relying on Nvidia for near-term computing capacity while gradually reducing dependence on external suppliers over the longer term.

The US and 14 other economies issued a joint statement after the G20 trade ministers' meeting in Milwaukee, pledging to work together on structural overcapacity and excess production in key industries. They singled out autos, EVs, batteries, chemicals, semiconductors and solar panels.