Samsung Electro-Mechanics (Semco) is gaining pricing power as AI server demand extends multilayer ceramic capacitor (MLCC) lead times beyond a year. Shortages now span consumer, automotive and industrial products, prompting customers to secure 2027 supplies.
The US Federal Communications Commission (FCC) has banned two electronic devices from entering the US market because both contain surveillance chips made by Huawei's HiSilicon. The move marks the first time the FCC has used a new rule targeting devices whose chipmakers are deemed national security risks.
Samsung Electronics has ordered additional equipment to fill the remaining space at its first foundry fab in Taylor, Texas, a move that would lift the plant's 2nm capacity to 20,000 wafers per month in the second half of 2027, ZDNet Korea reported on October 23, citing industry sources.
Rapidus chairman Tetsuro Higashi said the Japanese chipmaker remains broadly on track to begin mass production of 2nm chips in the second half of 2027. Winning customers remains a key challenge, and initial demand is expected to come mainly from the United States, where demand related to artificial intelligence is strong.
The US Federal Communications Commission (FCC) granted Intel a waiver to its ban on foreign-made mobile robots, which will allow it to update its fleet of autonomous guided vehicles (AGVs). Intel had earlier petitioned the agency for an exemption, saying that not doing so would threaten chip production in the country.
JCET Group lifted third-quarter revenue 13.53% year-over-year to CNY11.43 billion (approx. US$1.71 billion) and net profit attributable to shareholders 59.99% to CNY773 million. For the first nine months of 2026, revenue rose 7.96% to CNY30.95 billion, while net profit climbed 69.58% to CNY1.62 billion. Profit excluding non-recurring gains and losses increased 99.17% to CNY1.56 billion.
The US Department of Commerce has signed letters of intent with four companies to provide up to US$389 million in federal research and development awards under the CHIPS and Science Act, targeting the semiconductors and materials used to control, convert, and deliver power. The department announced the agreements on October 22, 2026.
Tesla and Nvidia are reportedly investing a combined KRW3.7 trillion (US$2.8 billion) to help Samsung Electro-Mechanics expand Ajinomoto Build-up Film (ABF) substrate production facilities in South Korea. The move reflects growing efforts by global technology companies to secure stable supplies of high-performance semiconductor substrates for AI applications.
Huawei Technologies has secured a seven-year, CNY15 billion (approx. US$2.3 billion) offshore yuan loan from six Chinese banks, as rising research spending and memory costs weigh on its cash flow. The financing, arranged by domestic lenders, is Huawei's first offshore syndicated borrowing since 2020, Bloomberg reported, citing a person familiar with the matter.
As AI data centers accelerate construction, supply-chain competition is expanding beyond servers and fully integrated racks to the integrated delivery of computing modules and site engineering. Nvidia unveiled its DSX POD reference design based on the Vera Rubin platform at GTC Berlin, with partners installing, integrating, and validating equipment inside containerized modules before transporting them to customer sites for final assembly and operation.
Solidigm, the US-based subsidiary established by SK Hynix, has officially halted its review of potential pre-IPO and IPO options.
More coverage
