TSMC's July 16 earnings call is likely to test how far the chipmaker can extend its already upbeat guidance, as investors look for signs that AI demand, flagship smartphone launches, and broader wafer orders can offset inflation, materials shortages, and mounting manufacturing complexity. The market is watching for another upgrade to revenue, spending, and margin targets.
CXMT's STAR Market IPO suggests China's largest DRAM maker is prioritizing commodity memory over an aggressive near-term push into high-bandwidth memory (HBM). This eases concerns that Chinese suppliers are about to challenge the dominance of Samsung Electronics, SK Hynix, and Micron in AI memory.
Rockchip Electronics has forecast strong growth in revenue and profit for the first half of 2026, citing sustained demand for its AIoT chip platforms despite supply chain pressures affecting the broader electronics industry.
Apple's decision to extend its wireless transmission and RF chip supply agreement with Broadcom through 2031 signals that its shift to fully in-house connectivity is a project measured in years, not quarters. For global consumers, the move suggests Apple will likely continue mixing its own chips with those from outside suppliers to maintain performance and reliability.
The 2026 smartphone market is facing a dark outlook as memory prices rise and shortages tighten supply, weighing on low- and mid-range handsets and hitting power amplifier (PA) shipments. Supply-chain companies said weaker gross margins are prompting brand owners to cut production and delay new model launches, while consumer caution is also dragging on demand.
SK Group chairman Tae-Won Chey is reportedly set to travel to the US for SK Hynix's American depositary receipt (ADR) listing on Nasdaq, where he will personally attend the celebration in New York. The move is being seen as more than a capital market event, as it marks an important moment in SK Hynix's effort to reposition itself from a traditional memory maker into a core company in AI infrastructure.
Rising demand for AI chips is changing how foundries set prices, giving TSMC and Samsung Electronics more leverage while forcing new entrants such as Rapidus to compete carefully on cost.
Samsung Electronics and SK Hynix may take longer than expected to adopt hybrid bonding in next-generation high-bandwidth memory, as industry sources cited by ZDNetKorea say the near-term case for the technology has weakened even though its long-term relevance remains intact.
