Qualcomm has secured a role in SpaceX's planned US terrestrial mobile network, turning Starlink Mobile's ambitions for integrated satellite and ground-based connectivity into a named infrastructure deployment. Announced November 4, the multi-year agreement calls for rollout to begin in 2027, with tens of thousands of sites planned over the life of the deal.

FPT has begun trial operations at a semiconductor testing and packaging plant in Vietnam's Bac Ninh province, initially focusing on chip testing as it prepares to expand into packaging technologies. The facility has six production lines and a maximum designed capacity of 300 million chips annually, the company said in a November 3 release.

GlobalFoundries' third quarter showed the contract chipmaker's revenue base shifting from smartphones to AI-related networking, and that shift is now boosting profitability. Revenue rose 13% from a year earlier to US$1.9 billion for the three months ended September 30, according to the company's November 4 earnings release, while IFRS gross margin widened to 30.1%.

Qualcomm's fiscal fourth quarter showed a company whose growth now comes almost entirely from outside the smartphone, but not yet at a scale that can offset a shrinking handset business. Revenue fell 8% from a year earlier to US$10.3 billion for the three months ended September 27, according to the company's November 4 earnings release, as a memory-driven downturn in phone demand weighed on its largest product line while automotive chips grew sharply.

Arm's September quarter showed demand for its technology moving toward data centers while its smartphone royalty base slowed. Revenue rose 27% from a year earlier to a record US$1.44 billion for the fiscal second quarter ended September 30, according to the company's November 4 shareholder letter. Still, the gain came mostly from licensing deals rather than from the per-chip royalties that make up Arm's recurring income.

Airoha, a MediaTek subsidiary, expects its optical communications business to deliver another multiple-fold increase in 2027 as 100G pulse-amplitude modulation (PAM4) digital signal processor (DSP) shipments ramp and its 200G product targets tape-out by the end of the year. The company also reported record quarterly revenue and profit in the third quarter of 2026, driven by its wired networking infrastructure and wireless edge AI businesses.

China's efforts to build a complete domestic chip-design software stack are gathering pace through acquisitions and strategic investments. Empyrean Technology's latest transactions target gaps in verification, placement and routing, and logic optimisation, strengthening its challenge to established electronic design automation (EDA) suppliers.

HCLTech said AI chips will need about 1.5 years to move into mass adoption beyond cloud infrastructure, as the industry develops integrated semiconductor platforms to support large-scale AI deployment. The company made the remarks in a white paper released with Omdia on November 3, which highlights Taiwan's key role in powering the next phase of AI infrastructure growth.

ASML and TSMC announced plans in September 2026, ahead of the SPIE BACUS symposium, to advance high-numerical-aperture extreme ultraviolet (High NA EUV) lithography by replacing the decades-old 6-inch photomask format with larger 12-inch masks. TSMC plans to introduce High NA EUV into advanced-node volume production from 2030, establish a 12-inch mask pilot line and begin production-line and ecosystem qualification by 2031, and achieve full readiness for 12-inch-mask High NA EUV systems supporting advanced-node manufacturing by 2033.

Murata Manufacturing and Samsung Electro-Mechanics (Semco) have reportedly secured silicon capacitor production capacity from Winbond Electronics to meet demand from their end customers, as the Taiwanese memory maker expands into components used in AI advanced packaging.

MediaTek announced that Navid Shahriari will join the company on November 9 as Senior Vice President, reporting to the General Manager and Chief Operating Officer.