PCB maker Zhen Ding Technology (ZDT) said business momentum is accelerating as demand strengthens during the traditional peak season. In addition to continued stocking for new mobile communications products, combined revenue from servers, optical modules, and IC substrates more than tripled from a year earlier, with growth accelerating further and lifting August revenue above NT$20 billion (≈US$634 million).
This week, DIGITIMES heads to Shenzhen to cover an expo showcasing the world of optoelectronics, a class of technologies that serves as the link between electricity and light. In today's era of pervasive digital connectivity, from smart glasses to cars to phones, this event is expected to give us a glimpse into the hardware supply chain behind these devices, and increasingly behind the global AI infrastructure build-out.
A US push for additional Korean semiconductor manufacturing investment has entered bilateral negotiations just as the first project under South Korea's US$200 billion strategic-investment mechanism approaches selection.
Samsung Electronics has moved to accelerate its silicon photonics push by using the same test partners selected by Taiwan Semiconductor Manufacturing Co. for key validation work, according to The Elec. The effort is aimed at completing wafer-level testing for photonic integrated circuits, or PICs, by 2026 and preparing for silicon photonics foundry services planned for 2027.
Chinese DRAM maker ChangXin Memory Technologies (CXMT) expects global memory supply to remain tight through the second half of 2026, with AI-driven demand supporting prices while the company expands capacity, upgrades processes and pushes further into server memory.
ChenFull Precision has expanded rapidly in recent years from traditional precision manufacturing operations such as welding and surface treatment into the semiconductor process equipment supply chain. Its overall business portfolio is also shifting increasingly toward semiconductors, with the company formally reclassified as a semiconductor stock on the Taipei Stock Exchange in 2025.
ASML issued joint statements with Intel Foundry, TSMC and Samsung Electronics on September 8, converging the three leading-edge chipmakers on a transition from the semiconductor industry's decades-old 6-inch photomask to a larger 12-inch format for High NA EUV lithography. Only TSMC attached a schedule to it.
Co-packaged optics (CPO) has officially entered the mass-production deployment stage, but the critical testing processes responsible for safeguarding yield continue to face different challenges across Insertion 1 through Insertion 4.
Nvidia is reportedly shifting its Rubin Ultra AI accelerator toward an eight-high high-bandwidth memory (HBM) configuration, down from an earlier 12-high design, as rising memory costs put greater emphasis on bandwidth efficiency and overall system economics.
Intel's PC CPU prices have continued to rise since the end of 2025, and supply chain sources said the company is expected to raise them by another 10%. Its low-margin small-core line is likely heading toward end-of-life (EOL) as CEO Lip-Bu Tan reshapes the business to cut low-margin products and lift overall profitability.
The 27th China International Optoelectronic Exposition (CIOE 2026) will run September 9-11 in Shenzhen, bringing together more than 5,000 exhibitors from over 30 countries and regions as AI infrastructure, high-speed optical communications and AR/VR applications reshape the optoelectronics industry.
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