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Taiwan Semiconductor Manufacturing Company (TSMC) reported a first-quarter 2026 revenue of US$35.90 billion, a 40.6% jump from a year earlier, as insatiable demand for artificial intelligence (AI) processors pushed the world's largest contract chipmaker to its highest-ever gross margin.

China's domestic GPU industry is entering a new phase of rapid commercialization, as leading startups post strong revenue growth while intensifying investment in research, patents, and ecosystem development.

Tesla has finalized the design of its next-generation AI5 chip, marking a milestone in its in-house semiconductor development. CEO Elon Musk confirmed the tape-out in a post on X, saying the design has been sent to foundry partners for fabrication. Musk also said Tesla is developing follow-on processors, including AI6 and Dojo3.

Cadence Design Systems and Nvidia have expanded their partnership to accelerate the use of artificial intelligence (AI) across semiconductor design, robotics, and large-scale AI infrastructure, the companies said at CadenceLIVE Silicon Valley 2026. The collaboration aims to combine Cadence's electronic design automation (EDA) software with Nvidia's accelerated computing and AI platforms to improve engineering productivity and reduce development cycles.
A wave of departures among core engineers at Samsung Electronics' System LSI division is raising concerns over a potential leadership gap at its non-memory chip unit, particularly in areas tied to Exynos processors and ISOCELL image sensors.
The global memory industry delivered its strongest first-quarter performance on record in 2026, defying the traditional seasonal slowdown as strong AI demand drove supply shortages and accelerated an upcycle. Revenue across the supply chain rose sharply year over year, with many upstream and downstream players reporting growth that doubled or more.
As AI servers rapidly increase demand for high bandwidth and large-capacity memory, Renesas Electronics noted that, driven by strong demand in China and expanding capacity, its Memory Interface Division (MID) business in China is expected to achieve 100% growth in 2026.
Japanese materials giant JSR has established an advanced planarization process solution joint research center in Taiwan, with JSR representative director and CEO Hank Hori personally attending the launch. Also present were Derek Witty, general manager of Applied Materials; Erix Yu, President of Applied Materials Taiwan; and Simon Jang, vice president of Advanced Tool and Module Development of Technology Development under the R&D at TSMC.

ASE Holdings has secured Innolux's Fab 5, with the company announcing on April 15 that its semiconductor unit's board had approved the NT$14.85 billion (US$460 million) acquisition.

Agentic AI is pulling CPUs back to the center of the AI stack, turning them into a renewed battleground for chipmakers. After Arm moved into AGI-focused CPU design, Nvidia has followed with a stake in SiFive, a RISC-V IP provider, signaling a broader shift in how control of AI infrastructure is being contested.

Samsung Electronics is aiming to produce its first samples of next-generation high-bandwidth memory (HBM4E) as early as May, with plans to deliver the chips to Nvidia after internal validation, according to Chosun Biz.