DIGITIMES Semiconductors news

Feb 12

TSMC's advanced process drives AI profits; SMIC, UMC, VIS face growth pressure

Amazon, Google, Meta, and Microsoft are set to sharply increase AI capital expenditure in 2026, with total investments reaching US$670 billion. This surge has sparked market concerns about an AI bubble, though Nvidia CEO Jensen Huang called the CSPs' spending "reasonable and necessary." The semiconductor industry sees a clear divide: TSMC is profiting heavily from AI demand, while Semiconductor Manufacturing International Corporation (SMIC), United Microelectronics Corporation (UMC), and Vanguard International Semiconductor (VIS) face growth challenges.

GlobalFoundries accelerates silicon photonics targets; eyes US$1 Billion revenue run rate by 2028

Feb 12

SMIC warns AI pull-forward is rewriting chip cycle, lifts mature-node pricing

Feb 12

China claims five places in 2025 global OSAT top 10

Feb 12

Micron begins high-volume HBM4 shipments as supply stays tight and capex rises

Feb 12

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IC MANUFACTURINGA tariff truce with teeth: US–Taiwan pact shields chips from Section 232 shocks

Feb 13, 09:00

US Ambassador Jamieson Greer oversaw the signing of a comprehensive Agreement on Reciprocal Trade between the US and Taiwan on February 12, 2026. The agreement, reached under the auspices of the American Institute in Taiwan (AIT) and the Taipei Economic and Cultural Representative Office in the US (TECRO), is designed to eliminate tariff and non-tariff barriers while enhancing the resilience of high-technology supply chains.

PASSIVE, PCB, OTHER IC COMPONENTSE-glass capacity cuts trigger production shifts for Taiwan CCL makers

Feb 13, 07:58

The global AI data center boom is straining not only high-end computing chips but also adjacent industries such as memory and upstream glass fiber cloth, where significant capacity squeezes are rippling through to downstream customers' production layouts worldwide.

MEMORY CHIPSWinbond's two-year sell-out signals memory cycle shift and US$1.35bn capex push

Feb 13, 07:57

Winbond Electronics is entering a powerful demand cycle, with tight supply conditions across DRAM, NOR flash, and SLC NAND extending beyond the near term and reshaping customer behaviour across the memory supply chain.

MEMORY CHIPSKioxia forecasts up to 77% operating profit surge on AI-driven NAND price rally

Feb 13, 07:56

Driven by expanding memory demand from AI servers and rising average selling prices, Japan-based NAND flash and SSD maker Kioxia expects solid growth in fiscal year 2025 (April 2025-March 2026), supported by momentum in the final quarter (January-March 2026).

MEMORY CHIPSHBM4 first-mover fog: Samsung and Micron duel for supremacy amid Nvidia supply tension

Feb 12

Samsung Electronics has officially commenced the mass production and commercial shipment of its HBM4 memory, marking a pivotal moment in the global semiconductor landscape.

IC MANUFACTURINGTower Semiconductor revamps strategy after Intel deal collapses

Feb 12

Intel's decision to walk away from its September 2023 agreement for Fab 11X in New Mexico has prompted Tower Semiconductor to revamp its manufacturing roadmap, scrap the facility from its 2028 model, and redirect customers — marking a strategic reset for the specialty foundry partner.

PASSIVE, PCB, OTHER IC COMPONENTSTariff shifts and supply-chain realignment set to make Taiwan top US PCB supplier

Feb 12

Geopolitical tensions stemming from the US-China trade war and global tariff barriers are driving major changes across the printed circuit board (PCB) industry, prompting structural shifts in Taiwan–US import-export dynamics and the accelerated diversification of manufacturing networks.

IC MANUFACTURINGApplied Materials settles with BIS for US$252.5 million over SMIC shipments

Feb 12

Applied Materials, a Santa Clara-based semiconductor equipment maker, has reached a US$252.5 million settlement with the US Department of Commerce's Bureau of Industry and Security (BIS) to resolve allegations of illegal exports to China. The penalty represents the second-highest civil fine ever imposed by the BIS and the maximum amount permitted by statute — equal to twice the value of the illegal transactions.

IC MANUFACTURINGWinsemi revenue falls 5% in 2025, speeds pivot to AI optical and LEO satellite markets

Feb 12

Win Semiconductors (Winsemi), a GaAs wafer foundry, held its earnings conference on February 11. Its fourth-quarter 2025 consolidated revenue reached NT$4.79 billion (approx. US$152.65 million), up 7% quarter-over-quarter and 29% year-over-year, slightly above expectations. Full-year 2025 revenue totaled NT$16.64 billion, down 5% year-over-year.

PASSIVE, PCB, OTHER IC COMPONENTSTaiwan PCB industry unites at Apex Expo for US advanced packaging push

Feb 12

Amid mounting tariff pressures and geopolitical risks, the Taiwan Printed Circuit Association (TPCA) announced that it will showcase a Taiwan advanced packaging zone at Apex Expo 2026, a global printed circuit board (PCB) trade event held in Southern California. This initiative aims to help Taiwanese companies seize opportunities arising from supply chain restructuring and to accelerate Taiwan-US business collaborations.

IC DESIGN, DISTRIBUTIONGlobal Mixed-Mode's DDR5 PMIC push signals tighter memory supply and margin focus

Feb 12

Global Mixed-Mode Technology said it is expanding its DDR5 power management IC (PMIC) portfolio and prioritizing production for high-bandwidth memory (HBM), while warning that rising memory prices make PC and smartphone end-demand unpredictable. The company disclosed its operational outlook and market observations during an investor briefing on February 10, 2026.

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