DIGITIMES Semiconductors news

Jul 3

How TSMC quietly turned its supply chain into a 'second fleet'

TSMC has accelerated efforts to localize its supply chain in recent years, using joint development, joint validation, and long-term partnerships to help Taiwanese equipment, materials, and chemical suppliers enter the advanced semiconductor supply chain. The move is steadily building a more resilient and complete local supply system, with both CoWoS and panel-level advanced packaging (CoPoS) now spawning a "second fleet."

South Korea bets on southwest semiconductor cluster, but key hurdles remain

Jul 3

Intel takes aim at TSMC's CoWoS lead with EMIB-T

Jul 3

Samsung eyes marquee AI win as Anthropic explores custom chip beyond Nvidia

Jul 3

Analysis: Innoscience-Infineon clash shows China's courts becoming a weapon in the global GaN race

Jul 3

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IC MANUFACTURINGNXP chief says robots need autonomous computing to move beyond remote control

Jul 6, 10:38

As physical AI and robotics spread globally, NXP CEO Rafael Sotomayor said robots will only reach commercial scale if they can think and act independently. For international industries, that shift could determine whether factory automation, humanoids, and smart machines become practical tools or remain costly demonstrations.

MEMORY CHIPSPhison says AI demand could erase NAND memory's boom-and-bust cycle

Jul 6, 10:32

AI is reshaping the memory market in ways that could matter well beyond Taiwan and China, according to Phison Electronics founder and chief executive Pua Khein-Seng. He said growing demand for storage from global cloud operators, AI PCs, and servers may reduce the severe ups and downs that have long defined NAND flash prices.

IC MANUFACTURINGExclusive Interview: Dutch startup Nearfield targets AI chip process control expansion after US$380 million funding round

Jul 6, 10:24

Dutch semiconductor equipment startup Nearfield Instruments has completed a US$380 million Series D funding round, the largest-ever fundraising for a Dutch deep-tech company. The company is now targeting an initial public offering (IPO) in 2028.

IC DESIGN, DISTRIBUTIONHuawei chip chief proposes Tau Law V2 centered on time-based scaling

Jul 6, 09:44

Huawei's semiconductor chief is promoting a post-Moore roadmap that shifts industry focus from shrinking transistors to reducing time across the computing stack, a framework backed by internal production claims for Kirin chips and Ascend accelerators. Despite that, he also drew caution because the work remains a preprint, not a peer-reviewed study.

MEMORY CHIPSMicron breaks ground on Hiroshima expansion to boost AI memory chip production

Jul 6, 09:39

Micron Technology has begun construction on an expansion of its existing semiconductor plant in Higashi-Hiroshima, western Japan, as part of a JPY1.5 trillion (approx. US$9.3 billion) investment aimed at increasing production of advanced memory chips, particularly high-bandwidth memory (HBM) used in artificial intelligence (AI) processors.

IC MANUFACTURINGMeta's AI cloud idea underscores a search for returns, not an AI retreat

Jul 6, 08:56

Meta is reportedly exploring a new AI cloud infrastructure business that would let enterprises use its AI models and some unused GPU capacity, a move that could lift hardware utilization and create a new revenue stream from its heavy artificial intelligence spending. The proposal has revived talk of an AI bubble, but key industry barometers Nvidia and TSMC still show no sign of a broad demand slowdown.

IC MANUFACTURINGIndia launches third semiconductor plant as CG Semi begins commercial production in Gujarat

Jul 6, 08:55

India Prime Minister Narendra Modi inaugurated CG Semi's Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, Gujarat, marking the start of commercial production at what the government described as the country's third semiconductor plant to become operational in 2026. The project forms part of New Delhi's broader effort to build a domestic semiconductor ecosystem under its India Semiconductor Mission and "Make in India" initiative.

IC DESIGN, DISTRIBUTIONChina TPU chipmaker Zhonghao Xinying launches Xuyu AI processor to challenge GPU-based computing

Jul 6, 07:30

Zhonghao Xinying (Hangzhou) Technology has launched its new self-developed high-performance TPU AI processor, Xuyu, alongside Taize 2.0, a software-hardware integrated AI computing platform built around the chip.

MEMORY CHIPSAI supercycle could drive semiconductor market beyond US$2 trillion by 2030

Jul 6, 07:29

The global semiconductor market is entering a historically significant growth phase. According to WSTS's latest June forecast, global semiconductor revenue is projected to grow by nearly 90% in 2026, reaching approximately US$1.5 trillion. Growth is expected to remain exceptionally strong in 2027, with year-on-year expansion of around 27%, pushing total market revenue close to US$1.9 trillion.

IC MANUFACTURINGAsahi Kasei to expand Taiwan photoresist film capacity for AI chip packaging

Jul 6, 07:29

Asahi Kasei, one of the notable suppliers of Sunfort dry film photoresist in Japan, has initiated a fab expansion project in Taiwan. The newly established plant is expected to further elevate capacity performance in cutting and processing semiconductor packaging substrates.

PASSIVE, PCB, OTHER IC COMPONENTSSamsung Electro-Mechanics, Sumitomo Chemical to form glass-core venture for chip substrates

Jul 6, 07:28

Samsung Electro-Mechanics signed a final agreement on July 2 with Sumitomo Chemical's Korean subsidiary Dongwoo Fine-Chem to form a joint venture that will produce glass cores, a key material used in next-generation semiconductor package substrates, the companies said.

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