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May 14
Samsung reportedly speeds up 3D NAND, packaging, and substrate plans
Samsung Electronics is reportedly reviving delayed semiconductor initiatives across next-generation NAND flash, compound semiconductors, advanced packaging, and substrates — areas it set aside after more than a year of prioritizing DRAM design and high-bandwidth memory (HBM) competitiveness. The move signals a shift from catch-up mode back toward longer-term technology investment.
United Microelectronics Corp. (UMC) has released a 14nm embedded high-voltage (eHV) FinFET technology platform for display driver ICs, marking a new step in the foundry's process roadmap after years of development.
Nvidia expanded a rapid investment campaign in 2026, deploying US$17.5 billion in the fiscal year that ended January 25, 2026, and topping US$45.3 billion so far in 2026, according to the company's financial disclosures and PitchBook data. Executives framed the activity as targeted moves across model providers, compute and cloud firms, and hardware and optical interconnect suppliers aimed at securing end demand and reducing bottlenecks in the AI inference stack.
In its first-quarter 2026 earnings Q&A session on May 15, Semiconductor Manufacturing International Corporation (SMIC) outlined a strategic response to shifting global market dynamics. As leading international foundries and integrated device manufacturers (IDMs) pivot capacity toward high-margin AI processors and High Bandwidth Memory (HBM), SMIC has seen a significant influx of orders for standard and specialty products from customers seeking to secure a reliable supply.
Following record second-quarter 2026 financial results, Applied Materials has detailed an extensive strategy to scale its global manufacturing capacity and accelerate technology commercialization through new collaborative platforms. As the semiconductor industry pivots toward artificial intelligence (AI) infrastructure, the company is leveraging improved customer visibility to prepare its supply chain for a sustained growth cycle expected to last into 2027 and beyond.
Hua Hong Semiconductor is positioning itself to capitalize on the accelerating transformation of the global semiconductor industry, driven primarily by the "unmistakably positive impact of AI" on market demand. During its first-quarter 2026 earnings call on May 14, 2026, the company outlined a multi-pronged strategy to enhance its position as a leader in specialty process technologies while expanding into nascent, high-growth sectors.
Malaysia is accelerating efforts to expand beyond semiconductor assembly and testing into chip design, following a government-backed initiative tied to access to Arm technology.
During its first-quarter 2026 earnings call on May 15, Semiconductor Manufacturing International Corporation (SMIC) detailed a strategic realignment of its operations to capitalize on the "AI boom" while maintaining a rigorous investment schedule. The company emphasized that it is currently in a "critical stage of capacity expansion" and is continuously pushing to enhance its competitive standing, leading to significant shifts in how it allocates resources and returns value to shareholders.
Hua Hong Semiconductor is accelerating its growth strategy through significant capacity expansion and the development of specialty technologies to meet rising global demand. During its latest earnings call on May 14, the company highlighted robust financial performance driven by emerging applications in artificial intelligence and power management.
Applied Materials delivered record revenue and earnings in its second fiscal quarter of fiscal 2026, signaling a robust expansion in the semiconductor equipment market driven by the global build-out of artificial intelligence (AI) infrastructure.
On May 14, Semiconductor Manufacturing International Corporation (SMIC) released its unaudited financial results for the first quarter of 2026, reporting a modest quarterly revenue increase alongside a double-digit year-over-year gain. The company recorded revenue of US$2,505 million for the period, a 0.7% increase from US$2,489 million in the final quarter of 2025. This performance reflects an 11.5% growth compared to the US$2,247 million generated during the same quarter of the previous year.
Faster AI servers drive a shift to advanced PCB technologies
May 15, 08:22
The global buildout of artificial intelligence data centers is driving a new wave of demand for high-speed networking infrastructure, as the efficiency of communication between servers becomes increasingly critical.