TSMC will not let customers sublease or auction off their wafer capacity allocations, chairman C.C. Wei said during the company's October 15 earnings call. With AI chip demand still far outstripping supply, Wei said TSMC intends to leave no food on the table, making as much as it can, as fast as it can.
TSMC Chairman and CEO C.C. Wei announced that, driven by relentless AI momentum and strong demand for advanced process technologies, the company has raised its full-year 2026 US dollar revenue growth guidance to approximately 44%. AI and leading-edge nodes continue to serve as the core growth pillars for the foundry's operations.
The European Union (EU) is negotiating with China to lift sanctions on Sindlhauser Materials GmbH, a small German business that is part of ASML's supply chain, according to people familiar with the matter. In exchange, the EU would remove trade restrictions on a Chinese company previously accused of assisting Russia's war against Ukraine.
Touch Taiwan 2027 will take place on April 21–23, 2027, and will expand its scope with two dedicated co-located shows: the Advanced Packaging & Testing Expo and the Silicon Photonics Technology Applications Expo. Spurred by surging demand for AI, high-performance computing (HPC), and high-speed data transmission, the new additions will run alongside the established Smart Manufacturing and Smart Display exhibitions, creating a unified platform spanning semiconductor technologies, optical communications, intelligent manufacturing, and end applications.
SK Hynix is seeking US approval to ship additional American chipmaking equipment to its NAND flash facility in Dalian, China, linking the request to a potential investment in a new US factory, Reuters reported on October 15, citing two people familiar with the matter.
Six Taiwanese server and networking contract manufacturers booked combined revenue of NT$2.18 trillion (US$67.3 billion) in September 2026, up 55.9% year-over-year and 4.9% month-over-month, as demand for AI servers stayed strong. Nine-month revenue of NT$15.5 trillion already exceeds the group's full-year 2025 total of NT$14.3 trillion.
India's RRP Electronics has inaugurated an Advanced Wafer-Level Packaging (AWLP) facility at its semiconductor unit in Navi Mumbai, Maharashtra, adding SIM and eSIM module production and specialized testing to its outsourced semiconductor assembly and test (OSAT) operations. The facility opened on October 12, 2026, according to Dalal Street Investment Journal.
TSMC has confirmed that it is in discussions with Elon Musk's Terafab initiative over potential semiconductor manufacturing cooperation, marking the first public acknowledgment of talks between the two sides.
TSMC expects fourth-quarter 2026 revenue to reach US$52.3 billion to US$54.3 billion, potentially rising as much as 61% year-over-year, with sustained demand for advanced semiconductor manufacturing and accelerating 2nm production supporting its year-end outlook.
Chinese semiconductor equipment maker AMEC plans to develop 102 new equipment models over the next three to five years, backed by nearly CNY13 billion (≈ US$1.94 billion) in research and development investment. The expansion will extend its portfolio beyond plasma etching into thin-film deposition, advanced packaging, inspection and other semiconductor manufacturing processes.
Samsung Electronics has reportedly completed development of next-generation 4F² DRAM technology and is aligning commercialization with customer requirements, even as China's ChangXin Memory Technologies (CXMT) prepares to introduce server memory using the architecture by the end of 2026. The competing timelines have raised questions about whether China's memory industry is closing the technology gap with South Korean manufacturers.
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