DIGITIMES Semiconductors news

Jul 27

CXMT tops A-share market cap on IPO debut

Chinese DRAM maker ChangXin Memory Technologies (CXMT) listed on the STAR Market of the Shanghai Stock Exchange on July 27, with its market capitalization briefly topping CNY3.6 trillion (approx. US$533.1 billion) on the first day of trading, surpassing Industrial and Commercial Bank of China and becoming the largest listed company in the A-share market.

Samsung converts AMD and OpenAI ties into HBM4 supply wins

Jul 27

India's Paras Defense semiconductor unit to invest in Madhya Pradesh OSAT facility

Jul 27

Qualcomm tells customers chip prices will rise by double digits from September

Jul 27

Samsung’s Broadcom AI chip pact expected to top US$200 billion as Hyundai expands robotics push

Jul 27

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IC DESIGN, DISTRIBUTIONNvidia invests in Ilya Sutskever's SSI, providing access to Vera Rubin compute platform

Jul 28, 13:58

Nvidia has made a strategic investment in Safe Superintelligence Inc. and announced a long-term partnership with the secretive AI lab founded by OpenAI co-founder Ilya Sutskever, giving SSI access to Nvidia's next-generation Vera Rubin systems and expanding its computing capacity by an order of magnitude.

PASSIVE, PCB, OTHER IC COMPONENTSDisplay industry earnings season shifts spotlight from panel prices to transformation strategies

Jul 28, 12:44

Taiwan's display supply chain enters second-quarter earnings season this week, with Coretronic reporting results on July 28, followed by AUO and Radiant Opto-Electronics (ROEC) on July 30 and BenQ Materials (BMC) on July 31.

IC DESIGN, DISTRIBUTIONGoogle TPU surge and Meta capacity push fuel CSP capex wave

Jul 28, 12:25

AI demand and whether the boom is heading into a bubble are back in focus, and capital expenditure by cloud service providers (CSPs) and their supply chains is emerging as a key gauge. Google has already said it will raise capex again in 2027, and industry watchers expect AWS and Microsoft to follow, keeping AI infrastructure momentum strong with more capital injections.

MEMORY CHIPSCXMT's record IPO and Apple talks collide with US curbs as DRAM tightens

Jul 28, 12:13

AI-driven demand is tightening the global memory market just as China's leading DRAM producer, ChangXin Memory Technologies, or CXMT, accelerates capacity expansion after a record IPO.

MEMORY CHIPSSK Hynix enters LPDDR6 production race with Xiaomi first in line

Jul 28, 12:12

SK Hynix reportedly plans to begin mass production and shipments of LPDDR6 in the second half of 2026, with Xiaomi expected to become its first customer for mobile devices. Industry sources said an early LPDDR6 launch would strengthen SK Hynix's position in premium mobile DRAM and lay the groundwork for expansion into AI server memory.

MEMORY CHIPSAI memory demand lifts WF6 prices as PERIC Special Gases adopts market-based pricing

Jul 28, 12:03

Surging demand for AI servers and advanced memory devices is tightening the global supply of tungsten hexafluoride (WF6), drawing increased attention to one of the semiconductor industry's most important specialty gases.

MEMORY CHIPSSamsung eyes Chinese DRAM sourcing to cut costs, expand budget-phone share in China

Jul 28, 11:37

Samsung Electronics is evaluating the use of lower-cost Chinese DRAM in some smartphones as it seeks to offset rising component costs and regain momentum in China's highly competitive budget handset market.

MEMORY CHIPSSK Hynix's HBM paradox: DDR5 surge builds leverage for HBM4 price hikes

Jul 28, 11:33

AI spending is broadening the memory upcycle beyond high-bandwidth memory, lifting prices for conventional DRAM, NAND flash and enterprise SSDs while reshaping earnings at SK Hynix and Samsung Electronics.

PASSIVE, PCB, OTHER IC COMPONENTSEiso raises NT$300M to accelerate AI, aerospace, defense PCB expansion

Jul 28, 10:44

Printed circuit board (PCB) manufacturer Eiso Enterprise has completed its annual fundraising plan. To strengthen working capital for future operations, repay bank loans, and enhance its financial structure, the company launched a cash capital increase and issued its second domestic unsecured convertible bonds in 2026.

IC DESIGN, DISTRIBUTIONCadence raises 2026 outlook after record quarter, flags major Intel deal as revenue driver

Jul 28, 10:31

Cadence Design Systems posted stronger-than-expected second-quarter results on July 27 and raised its full-year revenue growth outlook to 19%, citing broad demand for its AI-driven chip design tools and a landmark new agreement with Intel that executives described as a historic shift in the two companies' relationship.

IC DESIGN, DISTRIBUTIONSmart glasses ignite AI device battle as China nears 80% global brand share

Jul 28, 10:27

Smart glasses are emerging as a major next-generation consumer device as breakthroughs in generative AI and large language models (LLMs) reshape the wearable market. Once constrained by bulky designs and limited use cases, smart glasses are now drawing investment from global tech giants and hardware startups alike, while also redrawing the supply chain.

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