MSScorps saw August 2026 revenue post a new single-month high, as global artificial intelligence (AI) computing power continues to expand, driving demand for advanced process technologies, high-performance computing (HPC), advanced packaging, and high-speed optical interconnects, further raising the importance of semiconductor analysis services.
Trusval Technology is riding AI- and high-performance computing-driven semiconductor expansion overseas, but Taiwan's fab engineering firms face tougher labor shortages, regulations, materials constraints and rising costs abroad. Co-CEO Chu-chiao Kung said the company is turning years of high-spec project execution for leading advanced-process customers into global competitiveness.
TAIPEI, Taiwan — The global semiconductor industry is hitting a physical wall. As artificial intelligence demands push architectures toward three-dimensional packaging, high-bandwidth memory (HBM) stacks, and complex hybrid bonding, traditional inspection tools are going blind.
Chunghwa Precision Test Technology said demand for AI and high-performance computing (HPC) is driving a surge in advanced testing interface business, while ASIC revenue is set to grow rapidly and catch up with GPU sales. CEO Shui-Ke Huang said GPU products remain the mainstream in the HPC chip market and the company's main revenue source, with US customers also serving as its largest clients.
Singapore-based semiconductor packaging equipment maker Kulicke and Soffa (K&S) said AI demand is spreading into adjacent applications, lifting 2026 orders for wire bonding equipment and driving shipments to a record high, while the company continues to expand its advanced packaging business.
Montage Technology is accelerating its move beyond traditional DDR memory interfaces, with CXL 3.2, DDR6 and PCIe products positioning the Chinese interconnect chipmaker deeper in AI data center infrastructure.
Micron is reportedly preparing to roughly double its high-bandwidth memory capacity by the end of 2026, targeting about 100,000 wafers a month while sharply increasing 12-high HBM4 output for Nvidia's Vera Rubin AI platform.
To meet next-generation high-speed optical interconnect demand, fiber array units (FAU) are moving from traditional one-dimensional layouts to high-density two-dimensional (2D) architectures, raising the bar for hole positioning accuracy, micro-hole size, packing density, and process stability. At SEMICON Taiwan 2026, semiconductor equipment maker E&R Engineering unveiled a new ultra-high-precision laser micromachining platform with integrated high-precision motion control, laser drilling, and micromachining technologies.
Kyocera held a ceremony on September 1 to mark the completion of its Nagasaki Isahaya Plant in Kuremo-machi, Isahaya, Nagasaki. The company says the new manufacturing site will anchor its push into semiconductor-related products. Total investment will reach approximately JPY68 billion (US$424.70 million) by the end of March 2029, according to the company's announcement.
For years the quantum industry has worked on a discouraging assumption: that a machine capable of doing anything commercially useful would need a million qubits or more. Fujitsu told a Taipei audience that the number is coming down sharply, and that its own work is part of the reason.
Taisic Materials, a compound semiconductor company under the Kenmec Group, unveiled a p-type silicon carbide (SiC) substrate on September 2, targeting ultra-high-voltage power applications, including smart grids, rail transportation, and high-power electrical systems.
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