Chinese chip designer GigaDevice is investing another CNY500 million (approx. US$73.9 million) into its wholly owned subsidiary to support its DRAM research and industrialization project, continuing a series of capital injections aimed at expanding its memory business.

SK Hynix said in a July 22 disclosure that it had neither pursued nor decided on an acquisition of Intel's under-construction semiconductor site in New Albany, Ohio, denying a JoongAng Ilbo report that the companies were negotiating over the campus.

TSMC's planned 2027 wafer price increases are reinforcing confidence that AI chip demand remains strong while prompting fresh discussion over whether Intel and other semiconductor companies will gain greater flexibility to adjust their own pricing.

The AI industry may be riding a wave of momentum, but two clouds have recently unsettled the outlook: growing public opposition to data center construction across the United States, and a dramatic leap in the rankings by Chinese-developed model Kimi K3, which has renewed fears of AI overinvestment. NVIDIA CEO Jensen Huang addressed both concerns directly on July 21.

Nvidia's newly detailed Vera Rubin NVL72 is being pitched less as a faster chip and more as a cheaper unit of AI output. This shift matters most for the power-constrained data centers now defining the ceiling of the industry's growth. In its July 21 announcement, Nvidia said the rack-scale system delivers roughly 10 times more tokens per megawatt than its current Grace Blackwell NVL72, and about one-tenth the cost per million tokens of the GB200 NVL72. This framing positions electricity, not silicon, as the scarce resource.

Chinese semiconductor equipment suppliers are beginning to secure production orders for through-glass via (TGV) manufacturing tools, marking a shift from prototype validation toward commercial deployment as the industry moves to develop glass substrates for next-generation AI chip packaging.