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Mar 26, 11:47
Arm's self-developed chip sparks cross-industry clash, TSMC-backed GUC faces impact
Arm has officially unveiled its first fully self-designed physical chip, the Arm AGI CPU, targeting data center mass production. The announcement came at the Arm Everywhere conference in San Francisco, sending shockwaves through an already fiercely competitive AI chip market.
Probe card automation equipment maker Innostar Service (Innos) is expected to list on the Taipei Exchange (TPEx) main board in late April 2026. With artificial intelligence (AI) applications driving demand in the semiconductor industry, the probe card market is anticipated to grow rapidly, supporting strong revenue growth and sustained high gross margins for the company in 2026.
Holy Stone Enterprise expects a 20–30% rise in passive component revenue in 2026 as demand for high-power AI server components accelerates globally. Doubling AI product sales could improve profits by shifting to a higher-value product mix, with implications for supply chains and procurement across data center and server manufacturers worldwide, as well as enterprise customers.
Dell Taiwan general manager Terence Liao said enterprise adoption of AI will continue expanding in scope and scale through 2026. Dell has shipped Nvidia's B300 and GB300 AI servers, with the GB10 model especially popular. While AI servers are booming, the PC market faces headwinds from memory shortages and rising prices, which inevitably impact sales. Liao expects memory price increases to persist, making current PC prices the lowest point for the year.
At the SEMICON China 2026 opening keynote, Siemens EDA IC Products Executive Vice President (EVP) Ankur Gupta delivered a clear message: traditional EDA software is no longer sufficient, and future chip design tools must be AI-driven.
Nuvoton and Tower have agreed to restructure their joint Japanese operations, a move that could reallocate fabs and services and affect global semiconductor supply chains and customer relationships. The deal separates the partners' 12‑inch and 8‑inch businesses to sharpen strategic focus and ensure continuity across operations and customers worldwide.
As advanced packaging pushes toward 3D integration and high-bandwidth computing, hybrid bonding has emerged as a critical battleground for semiconductor equipment makers.
Nvidia and Emerald AI said on Tuesday that they are joining forces with a group of major US power producers — including AES Corporation, Constellation Energy, Invenergy, NextEra Energy, Nscale Energy & Power, and Vistra — to develop a new generation of "AI factories" designed to come online faster and operate as active participants in the power grid.
US Senators Jim Banks and Elizabeth Warren, in a joint letter dated March 23, called on US Commerce Secretary Howard Lutnick to suspend Nvidia's export licenses for advanced AI chips destined for China and intermediary Southeast Asian countries, including Singapore and Vietnam.
Four reasons that Aspeed dominates the BMC chip market
Mar 26, 08:19
As Taiwan-based IC design firms face declining global market share due to China, Taiwan's Aspeed stands out by dominating the baseboard management controller (BMC) chip sector.
SK Hynix is actively evaluating whether to adopt TSMC's 3nm process for the logic die of its seventh-generation high-bandwidth memory (HBM4E), aiming to close Samsung Electronics' performance advantage. However, industry analysts warn that production timing and cost challenges pose significant risks to SK Hynix's 3nm ambitions.
Lelon Electronics expects shipments to rise in 2026, driven by automotive electronics and AI servers, with wider supply-chain and pricing implications for global electronics manufacturers and suppliers as inventory buildups and pull-in deliveries reshape component flows and capacity planning worldwide.