DIGITIMES Semiconductors news

Sep 9

Mature-node chip scramble may persist through 2028 as supply chain management becomes bargaining leverage

Capacity for advanced semiconductor processes and packaging remains tight, while mature-node chips required for AI-related peripheral applications are also facing mounting supply pressure. IC design houses and semiconductor industry sources generally expect the current capacity constraints to last longer than the chip supply crunch that followed the COVID-19 pandemic.

Samsung turns to Japan for packaging edge, narrows HBM gap with SK Hynix

Sep 9

Kioxia rules out deeper SK Hynix ties, resists further NAND price hikes

Sep 9

Update: US finalizes US$775 million in CHIPS quantum awards, with equity attached

Sep 9

Commentary: Huawei's Kirin comeback, Xiaomi's Xring entry widen China's chipmaking race

Sep 9

MORE NEWS

IC MANUFACTURINGNanoprinting lithography shifts from round to square, increasing waveguide output

Sep 10, 16:20

Nanoimprint technology is shifting from round to square substrates. Qingdao GermanLitho noted that this transition has become vital for volume manufacturing as the industry demands larger template formats and higher throughput.

IC MANUFACTURINGUS Justice Department probes Nvidia-Groq deal over antitrust concerns

Sep 10, 16:01

The US Department of Justice has opened a probe into Nvidia's deal with AI chip startup Groq, according to reports from The New York Times and Reuters. Regulators are examining whether the transaction was structured to avoid antitrust review, with potential fines possible if wrongdoing is found.

IC MANUFACTURINGASE August revenue tops NT$80 billion record as AI packaging capacity stays sold out

Sep 10, 15:41

ASE Technology Holding's revenue surpassed NT$80 billion (US$2.5 billion) for the first time in August 2026, as AI continued to drive demand for both advanced and conventional semiconductor packaging and testing.

IC MANUFACTURINGFoxsemicon hits record 2Q26 revenue on Thailand ramp-up

Sep 10, 14:51

Foxsemicon Integrated Technology (FITI) posted record consolidated revenue of NT$6.3 billion (approx. US$200.0 million) in the second quarter of 2026, up 13.3% quarter-over-quarter and 21.1% year-over-year. The semiconductor equipment maker said second-half operations should outperform the first half as its Thailand plant ramps following a July production increase and product mix improves.

PASSIVE, PCB, OTHER IC COMPONENTSAUO matching glass substrate size stokes TSMC collab speculation

Sep 10, 14:49

AUO is accelerating its transformation by extending its established large-format panel manufacturing capabilities into advanced semiconductor packaging.

MEMORY CHIPSApple added flat US$100 to every iPhone and rebuilt A20 Pro around memory

Sep 10, 14:46

Two things happened at Apple's September 9 launch that belong in the same story: the company raised the price of every iPhone it sells by exactly US$100, and it introduced a chip whose headline improvement is a wider memory interface, without saying how much memory sits behind it.

MEMORY CHIPSChina's Nvidia rivals raise prices as HBM shortage bites

Sep 10, 14:37

Chinese chipmakers challenging Nvidia are sharply raising prices for current and next-generation accelerators as high-bandwidth memory (HBM) becomes scarcer and more expensive, adding another cost constraint to China's push for domestic computing hardware.

IC DESIGN, DISTRIBUTIONIntelligo targets double-digit 2027 revenue growth on AI IP, ASICs

Sep 10, 13:58

Intelligo said it is aiming for double-digit revenue growth in 2027 as AI IP licensing and AI edge-computing ASICs expand its reach into smartphones, notebooks, earbuds, gaming consoles and smart glasses. The company said edge AI demand is rising even as AI data centers absorb semiconductor capacity and supply-chain resources.

IC MANUFACTURINGTSMC August 2026 revenue jumps 53.3% as AI chip demand drives record growth

Sep 10, 13:57

TSMC reported strong revenue growth in August, underscoring continued momentum in AI-related semiconductor demand. TSMC said consolidated revenue reached NT$514.81 billion (approx. US$16.3 billion) in August, up 10.1% month-over-month and 53.3% year-over-year. Revenue for the first eight months of 2026 totaled NT$3.387 trillion, representing a 39.3% year-over-year increase.

IC DESIGN, DISTRIBUTIONTaiwan chipmakers target humanoid robots beyond the 'brain,' focusing on vision, motor control

Sep 10, 12:22

Taiwanese IC design companies have recently begun highlighting opportunities in physical AI and robotics. Arm's recently announced expansion of its Arm Total Design for Physical AI ecosystem, for example, includes Taiwanese IC designer Realtek Semiconductor.

PASSIVE, PCB, OTHER IC COMPONENTSSpirox TGV inspection capable of scanning entire substrate in 20 minutes

Sep 10, 12:18

As advanced packaging moves toward higher-density stacking, demand is rising for glass through-glass via (TGV) and through-silicon via (TSV) inspection, while glass core substrates are steadily shifting from technology validation to mass production. Spirox chairman Peter Chin said the company has entered advanced packaging inspection with nonlinear optical technology, with TGV aperture sizes now at 4μm and 3μm still under validation, while materials, foundry, memory and packaging companies in Taiwan, Japan, the US and South Korea have already sent samples for testing.

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Exclusive Interview: WG Tech sees a faster route for TGV beyond displays

WG Tech (Jiangxi) Group is accelerating its shift from display glass into semiconductor applications, targeting through-glass via (TGV) substrates for optical communications and advanced packaging as AI demand expands.

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