Pluggable front-panel optics still own the market, but Arista co-founder Andy Bechtolsheim gave them a deadline at an OCP APAC panel here: the form factor reaches its physical limit at the 49.6T switch generation, roughly 18 months out.
Intel is signaling a broader push into next-generation memory technologies, with CEO Lip-Bu Tan revealing that the company is exploring new memory architectures after hiring former SK Hynix CEO Seok-Hee Lee.
South Korea's Hanmi Semiconductor is pulling ahead of rival Hanwha Semitech in thermal compression (TC) bonders for high-bandwidth memory (HBM), as HBM4 equipment orders rebound and Hanmi's growing business with Micron helps reduce its reliance on SK Hynix, according to Chosun Biz.
Odisha's state cabinet has approved a third amendment to its Semiconductor Manufacturing and Fabless Policy, adding fresh capital support to attract projects backed by India's national chip-making push, according to state officials cited by regional outlets on August 12, 2026.
NXP Semiconductors has begun expanding its Petaling Jaya assembly and test site in Malaysia, a move that could support semiconductor supply chains worldwide by adding capacity, automation, and geographic diversification. The project is part of a broader effort to improve manufacturing resilience as global demand and supply risks continue to shape the industry.
TSMC said on August 11 that it will invest in CMOS image sensor development and mass production with Sony Group in Kumamoto Prefecture, Japan, adding to a wave of foreign chip spending backed by Japanese subsidies. According to Nikkei Asia, Japan's total foreign investment in semiconductor plants has now reached JPY6 trillion (US$380 billion).
