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Aug 18
Nvidia swaps credit support for exclusive chip sales in OpenAI's Ohio data center campus

Nvidia has reached a deal with OpenAI to provide up to US$105 billion in credit guarantees for the AI startup's upcoming 8GW data center campus in Ohio. The support will help OpenAI to secure a lease from SB Energy, while Nvidia will be the facility's exclusive chip supplier.

SK hynix said on August 19 that its board had approved a plan to repurchase and cancel KRW40 trillion (roughly US$29 billion) of its own shares, the largest share buyback and cancellation ever undertaken by a company listed in South Korea.

ByteDance and Tencent have each received about 10,000 Nvidia H200 processors in mainland China in recent weeks, the Financial Times reported, marking the clearest sign yet that Beijing's import reviews are translating into meaningful deliveries after months of regulatory uncertainty.
Industry figures and analysts from Taiwan and the United States gathered on August 19 at an international unmanned aerial vehicles (UAVs) forum to discuss how Taiwan can move beyond its traditional role as a components supplier and become a strategic partner in the global drone supply chain. The discussion takes place at a time when drones have become the frontier of warfare, and countries such as the US are looking to build non-China drone supply chains.
GigaDevice Semiconductor posted record first-half 2026 results, with tight memory supply and rising prices across niche products lifting earnings well beyond its full-year 2025 level.
Cerebras Systems on Tuesday announced the CS-4, a rack-scale AI accelerator the company says is up to twice as fast as its current CS-3 system and up to 30 times faster than GPU-based alternatives on a tokens-per-second-per-user basis.
As AI chips move toward larger dies and higher integration, advanced packaging is shifting from 300mm wafers to square panel manufacturing. In panel-level packaging (PLP), FOPLP and CoPoS have emerged as the two hottest keywords, while glass-based technologies remain further ahead on the roadmap.
Optical imaging technologies company New Smart Technology (NSTC) is moving beyond traditional optical and image inspection into semiconductor high-end automated optical inspection (AOI), co-packaged optics (CPO) optoelectronic modules, and unmanned vehicle vision systems, with a clear change in its revenue structure, according to chairman Stone Shih and president Phil Chen.

Tsinghua Unigroup's former "chip-to-cloud" expansion strategy unraveled after a debt crisis in 2020 and subsequent bankruptcy restructuring. Several projects originating in the group's earlier era have since entered disposal proceedings, and one of the former group's largest planned investments has now reached a formal end.

Indian Prime Minister Narendra Modi will inaugurate the fifth edition of Semicon India on September 17 at Yashobhoomi (India International Convention and Expo Centre) in New Delhi, with the three-day event running through September 19 under the theme "Silicon to Systems: Building the Ecosystem," according to ETV Bharat and the Statesman.

More than half of Taiwanese companies surveyed by TAITRA reported being negatively affected by the US-Iran conflict, with rising costs emerging as the biggest concern as geopolitical tensions disrupt energy, raw material, and supply chain conditions.

Market speculation that AMD is working with Google on technology for its v10-generation tensor processing unit (TPU) has prompted questions over the potential impact on Google's existing application-specific integrated circuit (ASIC) partners, including Broadcom and MediaTek.