Samsung Electronics plans to boost its high-bandwidth memory (HBM) production capacity by approximately 50% through late 2026, according to South Korean media outlet ET News, as the company secures key technical milestones with major AI customers.
According to South Korean media reports and industry sources, TSMC is moving to pull forward the production schedule at its second Arizona facility, a shift that could reshape supply planning for major chip designers and weaken the long-running narrative that Samsung Electronics stands as the default alternative when TSMC capacity tightens.
Taiwan's leading semiconductor assembly and test providers are launching record capital spending programs to expand advanced packaging capacity, as shortages at TSMC push chip designers to seek alternative supply chains through 2026.
China is requiring semiconductor manufacturers to source at least 50% of their equipment from domestic suppliers when adding new production capacity, Reuters reported, citing people familiar with the matter.
