TSMC is reportedly planning another wafer foundry price increase, with supply chain sources saying its order visibility now extends to 2030. According to the sources, the company plans to adjust wafer prices from January 2027 across different processes, with hikes of about 3-6% as tight capacity and strong AI demand keep customers in line.
AI server, high-speed networking, and memory demand continued to lift Taiwan's PCB industry in the second quarter of 2026, boosting demand for substrates, high-layer-count boards, and HDI products. Tight supplies of advanced materials and rising raw-material costs also pushed PCB prices higher quarter by quarter.
South Korea's exports of the customs category that carries high-bandwidth memory (HBM) are no longer a two-destination story. Unit-value data show that the chips going to Taiwan and Malaysia are worth several times more per kilogram than those shipped to Hong Kong, China, or Vietnam. That points to a two-tier trade, with premium stacked memory heading to advanced packaging lines and cheaper multichip parts going to transit hubs and lower-unit-value destinations.
China is trying to carve out a foothold in semiconductor supply-chain standards with Micro Han Xin, a miniaturized version of its home-grown barcode designed for chips and other components too small for conventional labels.
As AI applications expand rapidly across industries, testing and validation have become essential to moving innovation from R&D into real-world use. Gartner's latest forecast puts global AI spending at US$2.7 trillion in 2026, up 49.5%, and about US$3.6 trillion in 2027.
China is intensifying its push to replace foreign technology across critical computing infrastructure, targeting high-speed networking hardware alongside foreign AI accelerators.
