TPCA Show 2026 officially opened, with Unimicron Chairman Shan-Chieh Chien saying in his opening address that solving the three major challenges facing AI accelerators in high-performance computing (HPC) will require more than semiconductor process scaling. Advanced packaging and heterogeneous integration technologies must be introduced in parallel, significantly raising the technical requirements for the PCB and substrate industries.

Tongtai Machine & Tool said it had order visibility for its printed circuit board (PCB) drilling equipment through the end of 2027 as AI infrastructure demand increased pressure on high-end board production. The Taiwan-based machine tool maker presented its latest solutions at the Taiwan Printed Circuit Association Show 2026, highlighting CCD high-precision drilling machines and an unmanned drilling-station system for AI server boards and IC substrates.

More than a dozen US companies are exploring opportunities to develop Malaysia's rare earth industry, seeking alternatives to China-dominated supply chains as Washington pushes to secure supplies of critical minerals.

SEMICON West 2026 wrapped up in San Francisco last week, with US officials, industry executives, equipment and materials suppliers, and workforce-development partners repeatedly highlighting Taiwan as a critical partner in rebuilding US semiconductor manufacturing. Taiwan's role spans investment, process technology, supply-chain expertise, and talent development.

AI servers are driving demand for power components, transient voltage suppressors (TVS), and electrostatic discharge (ESD) protection devices. Yea Shin Technology, a subsidiary of Eris Technology, will begin trading on Taiwan's emerging stock market on October 23 and plans to raise the share of 6-inch wafers in its capacity from 35% to more than 50%, as its TVS products enter the international AI server supply chain.

South Korean substrate maker Daeduck Electronics is accelerating development of ceramic core substrates (CCS) to address warpage and thermal-management challenges as AI semiconductor packages grow larger. The company is conducting performance and internal reliability assessments, plans to advance samples and customer evaluations in 2027 and 2028, and is targeting mass production in 2029, with ceramic cores serving as a material alternative to glass cores for next-generation large-area packages.

China's Hygon Information Technology reported a 57.58% increase in revenue for the first nine months of 2026, reflecting sustained demand for domestic high-performance processors and AI computing chips. Yet slower quarterly growth, mounting R&D expenditure and a steep share-price correction have highlighted the gap between the company's operating performance and market expectations.

Kioxia is prioritising proprietary NAND flash technology and customer-specific development over aggressive capacity expansion, seeking to capitalise on rising AI storage demand while reducing exposure to memory market volatility.

AI computing is pushing packaging density to its limits, with accelerator substrates expected to exceed 100x100mm and expand beyond 120x120mm within the next three to five years. As substrate sizes, layer counts, I/O and power requirements rise, the industry's key bottleneck is shifting from design capabilities to manufacturing capacity.

China's electronic design automation (EDA) industry is consolidating, with Shanghai-based S2C and Wuxi-based HyperSilicon merging into a unified digital front-end EDA platform. Backed by Empyrean Technology and other investors, the deal aims to strengthen domestic capabilities in hardware emulation, chip verification, and simulation.

Amkor Technology is tripling its planned investment in Gwangju to expand advanced packaging capacity for artificial intelligence and high-performance computing, bringing a semiconductor project under South Korea's southwestern development strategy into construction.