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Jan 22, 15:28
Nvidia overtakes Apple as TSMC's largest customer

Nvidia CEO Jensen Huang said rising demand for AI computing has pushed the company past Apple to become the largest customer of Taiwan Semiconductor Manufacturing Company (TSMC).

Facing intense price wars triggered by China's rapid expansion in the global silicon carbide (SiC) wafer industry, Sino-American Silicon Products (SAS) chairwoman Doris Hsu has decisively reshaped the company's resource allocation. She revealed that standard SiC wafer prices have plunged 60-70% within six months due to market turbulence. In response, SAS is withdrawing from the commoditized power segment for GlobalWafers' SiC wafers and prioritizing three niche markets focused on high-barrier applications.
GlobalWafers chairwoman Doris Hsu said in a January 21, 2026, media interview that with easing inflation pressures and some central bank policy adjustments, the global economy is experiencing moderate growth despite ongoing challenges from geopolitical tensions and trade uncertainties.
GlobalWafers chairman Doris Hsu told the media on January 21, 2026, that the company's global expansion plans are starting to pay off, with subsidiaries in Niigata and Utsunomiya, Japan, as well as Denmark, all hitting record revenues in 2025. Niche products like gallium nitride (GaN) stood out for their strong performance. Hsu also outlined GlobalWafers' 2026 strategy and shared her outlook on market conditions.

Following its announcement to sell the Tongluo fab to Micron Technology, Powerchip Semiconductor Manufacturing (PSMC) provided an update on its latest operational plans.

2026 is shaping up as a breakout year for cloud application-specific integrated circuit (ASIC) shipments. Not only has Broadcom secured mass production projects with multiple major cloud service providers (CSPs), but Taiwanese firms MediaTek, Alchip, and GUC also have new products entering mass production. These developments are expected to deliver solid revenue contributions despite ongoing market uncertainties.

Servers built around custom AI chips, known as application-specific integrated circuits (ASICs), have emerged as a focal point of the global server supply chain.

As generative AI technologies scale up, the semiconductor industry is poised for a significant transition from copper-based interconnects to optical solutions to meet the stringent requirements of AI data centers. Nvidia has targeted 2026 as the initial commercial launch window for silicon photonics (SiPh) technology, signaling a strategic shift that will reverberate throughout global semiconductor supply chains. Taiwanese packaging and testing firms, among others, are positioning themselves to capitalize on the burgeoning market for ultra-high-bandwidth, energy-efficient AI infrastructure.
GlobalWafers chairwoman Doris Hsu spoke to the media on January 21, outlining the company's current US strategy and sharing her views on the recently finalized US-Taiwan tariff agreement.
Strong memory demand propelled Nanya's profits to soar in the fourth quarter of 2025, with president Pei-Ing Lee highlighting sustained AI and general server needs driving a robust DRAM market into 2026. Customers are overbooking and seeking long-term agreements (LTAs), eyeing to secure sufficient supply.

As tensions between China and Japan escalate over export controls on rare earths and semiconductor materials, China is accelerating efforts to build domestic production capacity—even as Japanese firms continue to dominate the global photoresist market.

Samsung Electronics and SK Hynix have been investing tens of trillions of won each year to expand memory production as the global market moves into a new upcycle. That spending now faces fresh pressure from the US semiconductor tariff policy, complicating long-term investment planning at the two companies.