More than a dozen US companies are exploring opportunities to develop Malaysia's rare earth industry, seeking alternatives to China-dominated supply chains as Washington pushes to secure supplies of critical minerals.
SEMICON West 2026 wrapped up in San Francisco last week, with US officials, industry executives, equipment and materials suppliers, and workforce-development partners repeatedly highlighting Taiwan as a critical partner in rebuilding US semiconductor manufacturing. Taiwan's role spans investment, process technology, supply-chain expertise, and talent development.
AI servers are driving demand for power components, transient voltage suppressors (TVS), and electrostatic discharge (ESD) protection devices. Yea Shin Technology, a subsidiary of Eris Technology, will begin trading on Taiwan's emerging stock market on October 23 and plans to raise the share of 6-inch wafers in its capacity from 35% to more than 50%, as its TVS products enter the international AI server supply chain.
Samsung Electronics is expected to enter 2027 with approximately 80% of its planned memory production secured under long-term contracts, reinforcing its pricing position while China's ChangXin Memory Technologies (CXMT) expands capacity and attracts attention from US tech companies seeking alternative DRAM suppliers.
South Korean substrate maker Daeduck Electronics is accelerating development of ceramic core substrates (CCS) to address warpage and thermal-management challenges as AI semiconductor packages grow larger. The company is conducting performance and internal reliability assessments, plans to advance samples and customer evaluations in 2027 and 2028, and is targeting mass production in 2029, with ceramic cores serving as a material alternative to glass cores for next-generation large-area packages.
China's Hygon Information Technology reported a 57.58% increase in revenue for the first nine months of 2026, reflecting sustained demand for domestic high-performance processors and AI computing chips. Yet slower quarterly growth, mounting R&D expenditure and a steep share-price correction have highlighted the gap between the company's operating performance and market expectations.
DeepSeek is reportedly working closely with Huawei to influence the design of its future AI chips, a link reportedly closer than typical supplier-customer relationships. The collaboration shows the growing ties between two of China's largest technology firms to sidestep Nvidia.
Kioxia is prioritising proprietary NAND flash technology and customer-specific development over aggressive capacity expansion, seeking to capitalise on rising AI storage demand while reducing exposure to memory market volatility.
AI computing is pushing packaging density to its limits, with accelerator substrates expected to exceed 100x100mm and expand beyond 120x120mm within the next three to five years. As substrate sizes, layer counts, I/O and power requirements rise, the industry's key bottleneck is shifting from design capabilities to manufacturing capacity.
China's electronic design automation (EDA) industry is consolidating, with Shanghai-based S2C and Wuxi-based HyperSilicon merging into a unified digital front-end EDA platform. Backed by Empyrean Technology and other investors, the deal aims to strengthen domestic capabilities in hardware emulation, chip verification, and simulation.
Intel is pitching its foundry as the industry's supplier of light sources for AI data center optics, claiming at the 2026 Open Compute Project (OCP) Global Summit that it is the only high-volume fab that can deliver 12-inch indium phosphide (InP) silicon photonics (SiPh) at scale to the industry.
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