CG Power and Industrial Solutions is targeting 70% utilization at its larger semiconductor packaging facility within about four years, with the unit potentially generating around US$500 million in annual revenue once it reaches scale, according to CNBC.

Hermes Testing Solutions (HTSI) said revenue for the first seven months of 2026 reached NT$2.7 billion (US$83.8 million), up 128.2% year-over-year and already exceeding its full-year 2025 scale, as AI and high-performance computing (HPC) applications continue to drive demand for high-end chip testing. The semiconductor wafer test solutions provider said it expects stronger operations in the second half of 2026 and sees growth momentum extending through 2027, 2028, and even 2029.

Nvidia is aggressively expanding into open-source models and positioning itself as the world's largest open AI contributor, as CEO Jensen Huang reshapes the company from a supporter of the open AI ecosystem into a builder. The company recently spent US$6 billion to license Poolside's technology and hire about 100 of its engineers, adding momentum to the US open-model push.

Weltrend Semiconductor said first-half 2026 revenue rose 28% from a year earlier to a record for the period, with growth driven almost entirely by cooling demand tied to AI data center investment.

Xiaomi is expanding Xring from a smartphone chip program into a broader AI computing platform spanning consumer devices, vehicles, and edge inference, with three processors assigned to distinct workloads.

Nvidia has reportedly asked Samsung Electronics and SK Hynix to increase the share of 8-high HBM4 supplied for its Vera Rubin accelerator platforms, as the chipmaker seeks greater flexibility in balancing thermal constraints, packaging yields and memory availability amid tight supply.

China's contract chipmakers spent the first half of 2026 proving something narrower than the headlines suggest. They demonstrated that domestic fabs can run at full capacity, raise prices, and earn money at mature nodes, largely on the strength of Chinese customers buying Chinese wafers. What the same results do not show is a country that has closed the gap where the gap actually binds — lithography, high-end metrology, and the leading edge.

Ligitek Electronics, a Taiwan-based LED packaging maker, has expanded in recent years into semiconductor system-in-package (SiP) and silicon photonics. The company said AI-related products accounted for about 45% of its revenue in the first half of 2026. Ligitek is targeting a 200G-per-lane architecture, bypassing the mainstream 800G specification to move directly into 1.6T optical engine modules, with small-volume shipments expected as early as the fourth quarter. The company plans to push further into higher-end 3.2T module development.

Rising gold prices are squeezing Samsung Electronics' entry-level smartphone supply chain, with South Korean media reporting that back-end packaging and testing orders for display driver ICs (DDIs) used in the Galaxy A1 series OLED panels have moved from South Korea's LB Semicon to Taiwan's Chipbond Technology to ease manufacturing cost pressure.

Amazon Web Services (AWS) and Nvidia are expanding their collaboration to add millions of GPUs and new infrastructure for agentic and physical AI. The move signals rising global demand for advanced computing, with implications for cloud customers, governments, and robotics developers seeking faster, more secure access to AI tools worldwide.

Beijing is extending artificial intelligence deeper into semiconductor production, targeting chip design, wafer fabrication, packaging, testing, equipment, and materials under what local authorities describe as China's first dedicated "AI4Chip" policy.