CONNECT WITH US
Sep 10
China's Nvidia rivals raise prices as HBM shortage bites
Chinese chipmakers challenging Nvidia are sharply raising prices for current and next-generation accelerators as high-bandwidth memory (HBM) becomes scarcer and more expensive, adding another cost constraint to China's push for domestic computing hardware.
AI demand lifts UMC, VIS, PSMC revenue
Sep 14, 16:54

After mature-node price competition from 2023 to 2025, AI demand has spread from GPUs and HBM to power management ICs (PMICs), power components, networking chips and specialty processes. At the same time, aggressive price cutting by mature-node players in China has eased, pushing quotes for Taiwan foundries broadly higher since the start of 2026.

Samsung Electronics and SK Hynix have rejected a proposal to prepay KRW25 trillion (approx. US$18.7 billion) in electricity bills, highlighting the financing challenge facing South Korea as it accelerates semiconductor expansion and the power infrastructure needed to support it.

AI crowd-out effects are rippling through the supply chain, with lead times for microcontroller units (MCUs) from STMicroelectronics reportedly stretching beyond 1 year and triggering severe shortages in industrial control MCUs. That is opening the door for Taiwanese chip makers to push into high-end industrial MCUs, while supply is expected to remain tight through 2027 and stable delivery becomes key to defending market share.
ASML's latest update suggests High NA EUV is no longer confined to laboratory validation. With 10 systems already operating across four customers worldwide, and three more in shipment or installation, the technology is beginning to enter production ramp-up. The shift matters because adoption now hinges less on optical promise and more on whether chipmakers can justify the added cost.
Taiwanese chip packaging firms are advancing fan-out panel-level packaging (FOPLP) and glass-substrate development as AI processors demand ever-larger reticle sizes and more complex packaging. Their early manufacturing scale, automation progress, and substrate design choices could help determine who controls the next bottlenecks in high-end chip assembly.
The 2026 China International Optoelectronic Exposition (CIOE) closed on September 11. While near-eye display applications such as AR/VR and smart glasses drew attention, vendors' latest moves in optical communications also attracted strong industry interest.
Chinese GaN power semiconductor maker Innoscience gained direct access to capital markets after listing in Hong Kong at the end of 2024, giving it fresh funding to expand GaN capacity and technology development.

Sandisk is making an unusual push into engineering recruitment in South Korea, seeking talent across NAND system architecture, NAND core design, VLSI design, and mask design while listing experience in HBM, LPDDR, and GDDR among key qualifications.

South Korea's revised Criminal Act took effect September 13, extending the scope of espionage offenses from acts benefiting North Korea to those benefiting any foreign country or equivalent organization, as South Korea strengthens protection of semiconductors and other strategic technologies.
Samsung Electronics and Qualcomm are expanding discussions over 2nm foundry cooperation, with pricing, yield, and process optimization still unresolved as Samsung seeks to regain a share of Qualcomm's flagship processor business.
Gritek plans to strengthen its position in China's large-diameter silicon wafer market by acquiring the remaining stakes in two semiconductor materials companies, according to a company announcement.