Taiwanese integrated circuit (IC) design firms report that passing on costs to customers will likely continue through 2027 as upstream foundry and outsourced semiconductor assembly and test (OSAT) price hikes take shape.

Taiwan-Asia Semiconductor Corporation (TASC) expects a stronger second half of 2026 as new Apple Watch demand lifts sensor orders. The company said weak consumer electronics demand has not materially affected its business, with smartwatch and earphone orders arriving faster than expected. More sensors per device and seasonal demand should lift fourth-quarter performance above the third, making the second half clearly stronger than the first.

A string of AI server smuggling prosecutions is showing that following US export-control rules to the letter has not stopped advanced Nvidia hardware from reaching China. The weak point lies less in the chips themselves than in the multi-layered server supply chain that carries them, where each participant checks its own slice, and no one owns the final destination.

As the global communications industry moves toward the 6G era around 2030, front-end modules supporting frequency ranges such as D-band at 130-150GHz and W-band at 77-95GHz have become major research priorities across academia and industry.

TSMC will hold its third-quarter earnings call on October 15 this year.

Dassault Systèmes is pitching its virtual twin software as the link between India's chip design base and the factories and packaging plants now being built under the country's semiconductor mission. The French industrial software company is offering tools that simulate production before anything is built, as the government's Semicon 2.0 program widens support beyond fabrication to design, research, and talent.

The traditional market divide between the third-generation semiconductors gallium nitride (GaN) and silicon carbide (SiC) is seeing greater overlap in 2026, with SiC increasingly encroaching on GaN's territory.

India's young chip industry is becoming a contest among the world's largest semiconductor equipment makers, with Canon the latest to declare its interest. The race remains at an early, positioning stage, however, and has so far produced few confirmed orders.

Japan's Rapidus is widening its semiconductor push with help from four Malaysian IC design firms, a move that could strengthen chip-development support for customers worldwide. The partnership underlines how Malaysia is emerging as a key design hub, linking Japanese ambitions with global supply-chain and AI-chip demand.

Marvell Technology is betting that the next phase of AI infrastructure growth will require substantially more networking and optical connectivity, raising its fiscal 2028 revenue outlook to approximately US$20 billion and setting a fiscal 2031 target of US$70 billion to US$90 billion. The company's strategy centers on extending existing hyperscaler relationships across switches, optics, and custom chips surrounding AI processors.

Hua Yang Precision Machinery has teamed up with Zeiss to launch COSMA-M, a high-precision measurement system aimed at the semiconductor metrology market as demand surges from AI, high-performance computing (HPC), and advanced packaging.