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Apr 2
TSMC plans 12 fabs in Arizona as supply chain shifts from passive to active
TSMC's expansion scale in the US has exceeded expectations, prompting Taiwanese suppliers with existing or planned local operations to take a more proactive approach. Reportedly, companies covering cleanroom, plant engineering, electromechanical integration, and equipment sectors have seen surging visa applications and staffing demands. This surge has kept intermediaries and legal service providers busy both in Taiwan's Hsinchu Science Park and Arizona, highlighting peak mobilization within the supply chain.

MSScorps has expanded its silicon photonics (SiPh) testing capabilities in recent years and will debut its in-house "MSS HG" platform at the Electronic Production Equipment Exhibition on April 8.

Amid soaring memory prices, manufacturers have repeatedly lowered 2026 shipment targets for smartphones, PCs, and other consumer electronics, triggering a ripple effect across the supply chain. Recently, reports emerged that major Chinese smartphone brands are scaling back purchases of processors, forcing MediaTek and Qualcomm to reduce their subsequent orders with TSMC, with estimated cuts of 10-15% in wafer starts on 4/3nm processes.
Memory module maker Innodisk extended its strong growth momentum in March 2026, reporting monthly revenue of NT$5.67 billion (approx. US$177.34 million), up 35.8% month-over-month and 484.8% year-over-year. First-quarter revenue reached NT$13.18 billion, also a record high.

Recent reports suggest that Google has once again made engineering changes to its Tensor Processing Unit, or TPU, pushing the chip's tape-out to around mid-2026. The product in question—known as the v8x and designed by MediaTek—has raised fresh concerns about whether MediaTek can scale its application-specific integrated circuit, or ASIC, business as planned this year.

PCB bottlenecks, freight costs push electronics prices higher
Apr 7, 10:45
The global electronics supply chain is facing a cost shock not seen in years. War in Iran, surging AI demand, and tight capacity are simultaneously driving up prices across raw materials, key components, and logistics.
Below are the most-read DIGITIMES Asia stories from the week of March 30-April 5, 2026:
Samsung Electronics reported a record-shattering eight-fold leap in quarterly profit, as insatiable demand for artificial intelligence (AI) memory chips outweighed growing concerns over geopolitical instability in the Middle East.

Anthropic, Google, and Broadcom today announced a massive expansion of their strategic partnership, unveiling a multi-year roadmap that secures approximately 3.5 gigawatts (GW) of next-generation AI computing capacity for Anthropic.

In September 2025, Nvidia CEO Jensen Huang made a rare joint livestream appearance with Intel CEO Pat Gelsinger to announce a US$5 billion equity investment in Intel. In March 2026, Nvidia followed up with a US$2 billion investment in Marvell Technology. Why Huang is investing in potential competitors so aggressively remains a question.
Impacted by the conflict in the Middle East, Taiwan has recently reported a shortage of plastic bags, raising questions about whether Formosa Plastics Group deliberately reduced production and stockpiled raw materials to drive up prices in the plastic pellet market.
Since artificial general intelligence (AGI) depends heavily on the CPU, Nvidia CEO Jensen Huang aims to build the most efficient "AI factory" by tightly controlling CPU development. At GTC 2026, Nvidia aggressively promoted its next-generation self-developed Arm-based CPU designed specifically for agentic AI.