DIGITIMES Semiconductors news

Aug 24

Nvidia server prices to rise up to 17% as memory costs climb

Prices for some Nvidia-based server systems due for delivery in 2027 are set to rise by more than 15%, with certain flagship configurations increasing about 17%, as higher memory and other component costs feed through to next-generation data center infrastructure.

Samsung's DRAM capacity lead shrinks as SK Hynix expands faster

Aug 24

Taiwan semiconductor materials hit golden opportunity

Aug 24

SK Hynix charts advanced HBM packaging path: hybrid bonding, Intel EMIB and 3D integration

Aug 24

Rapidus 2nm ramp stays on track as Japan readies JPY150 billion investment

Aug 24

MORE NEWS

IC DESIGN, DISTRIBUTIONOmniVision's CIS business slips, but machine vision and robotics surge 71%

Aug 25, 10:53

OmniVision Group reported a sharp drop in first-half 2026 profit as weakness in consumer electronics and automotive electronics weighed on its core image sensor business, even as machine vision, robotics and edge AI emerged as faster-growing sources of revenue.

MEMORY CHIPSChina-based Guangyu Xinchen says 3D-stacked edge AI chip has entered mass-production deployment

Aug 25, 10:39

According to 36Kr, Shanghai Guangyu Xinchen Technology says its TC1000 series of 3D-stacked near-memory-computing AI processors has moved from silicon validation to mass-production deployment, marking a claimed acceleration in the commercialization of memory-centric computing for edge AI.

IC DESIGN, DISTRIBUTIONCommentary: Nvidia's 15% hike piles pressure on the AI supply chain, lifts ASIC prospects

Aug 25, 10:25

Nvidia has reportedly notified major customers that server systems using its AI chips will rise by more than 15%, with the new pricing set to apply to models shipping from early 2027, including Grace Blackwell and the next-generation Vera Rubin platform. The move is expected to ripple through the chip and system supply chain, while industry figures say it could also lift the appeal of inference ASICs.

MEMORY CHIPSSamsung, SK Hynix step up China NAND upgrades as US tool risks grow

Aug 25, 10:21

Samsung Electronics and SK Hynix are stepping up equipment spending at their NAND flash plants in China through 2027, upgrading existing production lines even as future access to Western chipmaking tools becomes less predictable.

IC DESIGN, DISTRIBUTIONNovosense encoder launch highlights China's push into robot joint sensing

Aug 25, 09:58

Chinese analog and mixed-signal chipmaker Novosense Microelectronics has introduced the NSM350x series, a Hall-based magnetic encoder designed for high-precision angular measurement in robot joints and industrial motion-control systems, reports Sina Finance.

IC DESIGN, DISTRIBUTIONInfineon buys India-based C2i Semiconductors to bolster AI data center power systems

Aug 25, 09:35

Infineon Technologies has agreed to acquire Bangalore-based C2i Semiconductors, a move that strengthens its position in power delivery for AI data centers and highlights India's growing role in chip design. The deal could shape how global operators manage rising energy demand, efficiency pressures, and next-generation computing workloads.

IC DESIGN, DISTRIBUTIONNvidia Groq 3 LPX enters full production for faster agentic AI inference

Aug 25, 09:04

Nvidia said its Groq 3 LPX inference accelerator is now in full production, a move that could speed up agentic AI systems used worldwide for coding, reasoning, and other tasks. The company said the platform is designed to improve responsiveness, lower latency, and support growing demand for real-time AI applications.

IC DESIGN, DISTRIBUTIONSpaceXAI to use Nvidia Vera CPUs for faster agentic AI at scale

Aug 25, 09:02

SpaceXAI plans to deploy Nvidia's new Vera CPUs to speed up agentic AI workloads, a move that could influence how advanced AI systems are built and run worldwide. The partnership also extends toward orbital computing, signaling a broader shift in where future AI infrastructure may be located.

IC DESIGN, DISTRIBUTIONIBM unveils dual-architecture mainframe chip to run Arm, z/OS, Linux workloads

Aug 25, 08:49

In an August 24 press release, IBM announced that it is developing the first dual-architecture mainframe processor, a move that could let global enterprises run Arm-native and IBM workloads on the same future systems. The milestone may broaden software choices, accelerate AI adoption, and reshape mission-critical computing for banks, governments, and large cloud operators worldwide.

IC MANUFACTURINGBroadcom's debt push signals AI compute is becoming Wall Street asset class

Aug 25, 08:06

The AI infrastructure race is entering a phase where access to silicon is no longer the only constraint. As compute demand expands into multi-gigawatt projects, the industry is increasingly confronting a second bottleneck: how to finance hardware and data-center capacity at the scale frontier-model developers now require.

MEMORY CHIPSSK Hynix and Alibaba tackle the next AI bottleneck: getting more value per chip

Aug 25, 08:05

The AI infrastructure race has been marked by a near-fixated drive to expand AI-powered buildouts, as demand for increasingly complex chip configurations pushes against the physical and economic limits of scalability.

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