SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into a more critical front for HBM suppliers.
Samsung Electronics' 2026 tentative labor-management agreement is expected to pass after already surpassing an 86% voting participation rate within just three days. While the agreement has temporarily eased concerns over potential strikes, South Korea's semiconductor industry is increasingly worried that the newly expanded performance bonus structure, which guarantees employees a fixed percentage of business performance, could negatively impact the country's long-term semiconductor competitiveness.
Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking, optical interconnects, and system-level architecture design.
Printed circuit board (PCB) drill bit manufacturer Topoint Technology approved a private placement of unsecured convertible corporate bonds with a maximum issuance amount of NT$600 million (approx. US$19.10 million) at its shareholders' meeting on May 26. The company also welcomed Unimicron Technology, Gold Circuit Electronics (GCE), and Zhen Ding Technology Group (ZDT) as strategic investors.
Taiwan Semiconductor Manufacturing Company (TSMC) is scheduled to hold a company-wide communication meeting on the morning of May 27, during which chairman C.C. Wei is expected to address employees in person over the growing backlash surrounding reports that the company will cut employee bonuses by 15%.
Ennostar Holdings' transformation has begun to show clear results, with chairman Paul Peng saying the company's "3+1" strategy is taking shape, as higher-value applications now account for more than half of revenue. Despite continued uncertainty in the global environment, Peng remains cautiously optimistic about the second half of 2026 and expects the company to maintain relatively strong performance.
For the past three years, graphics processing units, or GPUs, have dominated the artificial intelligence boom. But Johnny Shen, chairman of Alchip Technologies, believes the next phase of the market may belong to something more specialized.
As the global semiconductor industry pivots toward chiplet-based designs — where multiple smaller chips are packaged together rather than built as a single monolithic die — the specialized intellectual property that makes those chips communicate reliably has become critical infrastructure. InPsytech, a Taiwanese IP design firm and subsidiary of Egis Technology, has staked its business on exactly that.
The race to dominate next-generation NAND flash memory has long been measured in layers — and Samsung Electronics appears to be pulling ahead. The South Korean chipmaker has reportedly developed a 900-layer-class V-NAND prototype, a significant leap that brings the memory industry closer to the 1,000-layer threshold as chipmakers intensify efforts to pack more storage into smaller chips while cutting power consumption.
Taiwan-based AI server maker Wiwynn is accelerating its global expansion as surging demand for AI infrastructure creates mounting pressure on power supply, production capacity, and critical component availability.
When AMD CEO Lisa Su arrived in Taiwan on May 20, she announced plans to invest more than US$10 billion with local supply-chain partners and the island's broader semiconductor ecosystem. The goal, she said, was to help secure a long-term supply of advanced artificial intelligence (AI) chips.
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