Applied Materials used its fiscal third-quarter earnings call to lay out a multi-year capacity build rather than just a strong quarter. Alongside record results, the company said it is hiring and training manufacturing and customer-support staff so it can double its quarterly system output from current levels by 2028, and is already planning a further capacity expansion to support demand growth "by 2030," according to CFO Brice Hill on the August 13, 2026 call.
Hua Hong Grace Semiconductor has been running its fabs flat out for more than a year without earning an operating profit on the work. The June quarter ended that. Revenue reached a record US$717.5 million, up 26.8% from a year earlier and 8.6% sequentially, and gross margin widened to 16.5% from 10.9% in the same quarter of 2025 — enough, for the first time in five quarters, to cover operating costs rather than merely offset them.
China's largest contract chipmaker has spent most of the past two years increasing volume without much to show for it in terms of margins. The June quarter broke that pattern. Semiconductor Manufacturing International Corporation (SMIC) reported revenue of US$3.01 billion for the three months ended June 30, 2026, up 20.0% sequentially and 36.1% from a year earlier, and gross margin of 25.3% against 20.1% in the March quarter. The margin, not the revenue line, is the news: it is the first quarter in this cycle in which SMIC has been able to convert a full order book into price.
After EVs, rockets, and humanoid robots, Elon Musk appears to be turning his attention to optimizing the chip manufacturing process. When he unveiled a US$16.8 billion initial investment for the giant wafer fab Terafab, he also showed a concept image of the facility after completion.
The AI wave is sweeping through the chip industry, but hallucinations, loss of control, and cybersecurity risks remain unresolved even as efficiency leaps. Youngsik Kim, head of the Design Technology (DT) team at Samsung Electronics' System LSI division, has pointed out that software has already leveraged AI to cut headcount and generate significant gains, but hardware has yet to see clear benefits.
SK hynix has pushed construction of its semiconductor campus in Yongin, Gyeonggi Province, South Korea, to 87% completion as it targets February 2027 for the start of operations at its first cleanroom. Power and water supplies have already been secured, according to Maeil Business Newspaper.
Kioxia is developing a PCIe Gen6 optical SSD and hopes to work with customers on its next prototype, as the Japanese memory maker tackles cost and reliability hurdles that still stand between the technology and mass production.
Intel tests presented at the OCP APAC Summit 2026 that moving the key-value cache used in large language model (LLM) inference from GPU memory to system DRAM can raise serving throughput and support more concurrent requests when VRAM is the bottleneck, although the gains fade once compute becomes saturated.
Rapidus expects interposers for high-performance chips to reach eight-reticle scale by around 2030, as larger chiplets and high-bandwidth memory (HBM) push advanced packages toward sizes that are increasingly inefficient to manufacture on conventional 300mm wafers.
As the world enters an AI-powered era where the persistent need for more complex architectures is driven by rising demands for higher computing performance, one bottleneck confronting the semiconductor industry lies not only in technological advancement itself, but also in the capacity to deploy standardized manufacturing processes at greater scale and speed.
PixArt's latest results signal how shifting demand across consumer electronics and emerging sensor markets can reshape profitability for suppliers worldwide. The Taiwanese IC design company said strong sales from game consoles and other product lines lifted revenue in the second quarter of 2026, even as higher costs and a weaker product mix weighed on margins.
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