LG Innotek is accelerating its push into advanced semiconductor packaging, announcing plans to expand its substrate manufacturing operations in Vietnam as it seeks to transform the business into a key growth engine and generate more than KRW3 trillion (approx. US$1.9 billion) in annual revenue by 2030.
Andhra Pradesh is positioning itself as a semiconductor packaging hub, focusing on an entry point into the chip supply chain while wafer fabrication remains a long-term goal. Officials said packaging activities are already underway, as Indian states used Computex in Taipei to attract Taiwanese electronics and AI supply chain investment.
As hyperscale cloud providers and enterprise customers race to build increasingly powerful artificial intelligence infrastructure, power delivery and energy efficiency are emerging as critical constraints. Industry analysts expect AI rack power requirements to exceed 1 MW per rack in the coming years.
Taiwan's T3EX Global Holdings is strengthening its Northeast Asia air freight network to capture rising logistics demand from the electronics and semiconductor supply chains, as global shipping remains highly volatile amid geopolitical tensions and adjustments to energy prices and routes.
Lead frame manufacturer Chang Wah Technology Co. (CWTC) says that as applications such as data centers, AI servers, and industrial control systems continue to grow rapidly, market demand for power management components is steadily increasing, driving growth in lead frame shipments. Demand for microcontrollers (MCUs) used in PCs, networking equipment, industrial control systems, and electric vehicles has recovered, boosting orders for QFP lead frame products. This has kept CWTC's overall capacity utilization at a high level and contributed to revenue growth.
Zhen Ding Technology Group reported that May consolidated revenue reached a 2026 high as robust demand for high-end AI products drove significant year-over-year growth, the company said. The firm attributed the performance to a sharp uptick in server and optical module shipments, which rose nearly 2.5 times year-over-year, and strong momentum in IC substrate sales, which grew nearly 80% year-over-year.
Samsung Electronics is pursuing a two-track foundry strategy, accelerating its 2nm push for future customers while asking partners to step up sales of its 5nm and 8nm processes to support near-term utilization, according to ZDNet Korea.
JCET has opened a new advanced manufacturing facility at its Chengdong production base in Jiangyin, strengthening the Chinese OSAT provider's push into advanced packaging for AI computing, power modules, and next-generation data centers.
Aspeed chairman Chris Lin said on June 3 that rapid growth in agentic AI is boosting demand for AI and general-purpose servers, with the chip maker's main constraint now supply-chain capacity rather than orders. He said the company already has visibility into a large volume of 2027 orders as customers rush to secure supply.
Transcend Information said revenue for April and May combined has already surpassed its first-quarter total, as tight memory supply and elevated prices continue to lift sales at the Taiwan-based memory module maker.
Japan's Ministry of Economy, Trade and Industry announced on June 5, 2026, that the government completed an additional JPY150 billion (US$937.9 million) capital injection into Rapidus, the national semiconductor champion formed to commercialize advanced node chips, to fund plant construction, equipment and research for 2nm and 1.4nm chips. The funding was executed through the Information-Technology Promotion Agency, according to reports by Nikkei and Reuters.
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