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Thursday 30 July 2026
ASE sees full-year LEAP revenue topping US$3.5 billion amid tight packaging capacity
ASE Technology Holding said growing demand for advanced packaging and testing, combined with stronger momentum in its electronics manufacturing services (EMS) business, has tightened capacity across both advanced and conventional packaging. Wafer sorting and final test capacity are also nearing full utilization.
Thursday 30 July 2026
South Korean chip exports increasingly flow to Taiwan for TSMC packaging amid rising AI demand

Growing demand for AI chips is sending a larger share of South Korea's semiconductor exports to Taiwan, where Korean-made high-bandwidth memory (HBM) moves into advanced packaging processes led by TSMC.

Thursday 30 July 2026
China's DUV shock: the secretive Aishengna rattles ASML with US$1B state backing

China's immersion DUV lithography programme has brought a little-known state-backed company into focus. Shanghai Aishengna Electronic Technology Group, founded in August 2023 with CNY7 billion (approx. US$1.03 billion) in registered capital, is reportedly coordinating limited production of domestically developed lithography systems.

Thursday 30 July 2026
South Korean suppliers win HBM4 tester orders from SK Hynix
South Korean test-equipment suppliers Digital Frontier and UniTest have secured four orders for HBM4 wafer testers from SK Hynix worth a combined KRW247.84 billion (approx. US$172 million) in 2026, expanding domestic vendors' role in a memory-testing segment where Japan's Advantest has long been an established supplier.
Thursday 30 July 2026
GlobalFoundries lands US$300M CHIPS backing for AI silicon photonics

GlobalFoundries has signed a letter of intent with the US Department of Commerce for a potential US$300 million award to accelerate US development of silicon photonics technologies used in AI and high-performance computing data centres.

Thursday 30 July 2026
Lam Research raises WFE outlook as AI drives NAND, DRAM, advanced packaging demand
Lam Research delivered record quarterly results and raised its outlook for global wafer fab equipment (WFE) spending, citing accelerating AI-driven demand across memory, advanced logic and packaging.
Thursday 30 July 2026
China's 28nm DUV lithography enters fab validation, reportedly guided by State Council-level experts
China's 28nm DUV lithography programme has entered a new phase after Shanghai Aishengna Electronic Technology delivered its first five immersion deep ultraviolet lithography systems.
Thursday 30 July 2026
Samsung foundry to double 2nm design wins in 2026 on Broadcom talks; claims profit turnaround 'possible in near term'

Samsung Electronics' foundry business expects its 2nm project wins to more than double year-on-year in 2026, and the company is in talks with Broadcom and other major customers on multiple projects, foundry business EVP Sukchae Kang said on Samsung's earnings call for the second quarter of 2026. This is the clearest sign yet that its advanced-node business is gaining commercial traction after years of trailing TSMC.

Thursday 30 July 2026
Ennoconn deepens Singapore push with SMF pact and AI forum

Ennoconn Technologies held its 2026 Semiconductor x AI Applications Forum at Google's Asia-Pacific headquarters in Singapore on July 29 and signed a memorandum of understanding with the Singapore Manufacturers' Federation (SMF) on the same occasion. The event marked a further step in the Taiwanese technology group's expansion into Southeast Asia's semiconductor and artificial intelligence markets.

Thursday 30 July 2026
Italy, US to sign Pax Silica pact on AI, chip supply chains

Italy and the US are set to sign a cooperation agreement tied to the US-led Pax Silica initiative on July 31, as Rome expands efforts to secure critical raw materials and semiconductor supply chains.

Thursday 30 July 2026
Lam Research raises outlook as AI-driven semiconductor demand fuels record revenue and margin expansion
On July 29, Lam Research reported record fiscal fourth-quarter results and issued stronger-than-expected guidance, signaling that rising demand for artificial intelligence is accelerating investment in semiconductor manufacturing equipment. The company's performance reflects growing demand for advanced chip production technologies, while analysts said AI-related capacity expansion could continue to support growth across etching, deposition, and service businesses.
Thursday 30 July 2026
Samsung memory sales up 471% in 2Q26; foundry targets double-digit second-half growth

Samsung Electronics' Device Solutions (DS) division posted the most profitable quarter in its history in 2Q26, generating operating profit of KRW89.2 trillion (approx. US$61.6 billion) on sales of KRW127.5 trillion (approx. US$88.1 billion) — a 70% operating margin — as the AI-driven memory supercycle intensified.

Thursday 30 July 2026
UMC, Intel advance 12nm process collab with no next-gen plans at this time
United Microelectronics (UMC) stated that its collaboration with Intel to develop a 12nm process is progressing smoothly. The process design kit (PDK) is expected to be completed by the end of 2026, with tape-out scheduled to begin in 2027. Full-scale mass production and revenue contribution are expected to come in 2028.
Thursday 30 July 2026
UMC posts NT$42.26B profit on non-operating investment gains in 2Q26
United Microelectronics (UMC) reported consolidated second-quarter 2026 revenue of NT$68.73 billion (approx. US$2.12 billion) during its earnings call on July 29. The figure is up 12.6% from NT$61.04 billion in the first quarter and 17% year-over-year. Profit margin reached 32.5% in the second quarter, up 3.3 percentage points from the previous quarter.
Thursday 30 July 2026
Greatek sees sustained AI demand, plans Philippines packaging plant acquisition
Greatek's latest investment and capacity plans signal how AI-driven semiconductor demand is rippling beyond Taiwan, with implications for global device makers, automakers, and industrial customers. The PowerTech Technology unit said orders remain strong, its bumping lines are full, and it is preparing new overseas capacity to support supply chain diversification.
Thursday 30 July 2026
Amkor reallocates SiP production to Vietnam, freeing Korean cleanrooms for AI packaging
Amkor Technology reported record second-quarter results for 2026, characterized by broad-based revenue growth and significant strategic shifts in its global manufacturing footprint. During the subsequent Q&A session, President and CEO Kevin Engel and CFO Megan Faust detailed the company's performance across ten key areas, ranging from volatile smartphone demand to the long-term financial implications of its new US manufacturing facility.
Thursday 30 July 2026
Taiwan semiconductor power demand is set to reach 52 billion kWh in 2026

Taiwan's semiconductor sector is set to become an even larger driver of electricity demand as AI-related expansion lifts output in wafer fabrication, memory, and advanced packaging. Taipower projected that the industry's power use would reach 52 billion kWh in 2026, underscoring how the island's chip ambitions are reshaping its energy system.

Wednesday 29 July 2026
TSMC: JASM utilities back to normal, equipment calibration underway; construction resumes

TSMC on Wednesday issued its third statement since a magnitude 7 earthquake struck Kumamoto, Japan on July 28, saying that utility systems at its JASM wafer fab are operating normally, equipment inspection and calibration are in progress, and construction at the site of its second Kumamoto fab has resumed.

Wednesday 29 July 2026
Coretronic reports first-half loss as margins weaken and demand stays uneven
Coretronic said its first-half 2026 performance turned negative as margin pressure and weaker profitability offset a second-quarter revenue recovery. The Taiwanese electronics maker said it would respond cautiously to market changes while focusing on its core businesses, product mix, market position, and technology development.
Wednesday 29 July 2026
Intel Foundry completes US microelectronics prototype program

Intel Foundry has completed a US defense-backed semiconductor prototype program that could have implications for supply chain resilience, national security, and global access to advanced chips. The work, tied to Intel 18A technology, aims to expand trusted domestic manufacturing and could shape how allied governments approach secure chip production.

Wednesday 29 July 2026
China's first home-grown immersion DUV production reveals real test beyond prototypes
China has begun producing domestically developed immersion deep-ultraviolet (DUV) lithography machines, moving a critical semiconductor-equipment programme beyond prototypes and towards limited commercial deployment.
Wednesday 29 July 2026
Corning bets on SiPh and CPO to drive AI data center growth

Corning expects AI infrastructure to become an increasingly powerful growth engine, outlining how its glass technologies will move beyond traditional optical fiber and into silicon photonics (SiPh) and co-packaged optics (CPO) for next-generation AI data centers.

Wednesday 29 July 2026
China chip substitution accelerates as chill effect looms
China's semiconductor self-reliance push has notched new gains, with Chinese AI giants expanding purchases of domestic AI chips and facing direct pressure from Beijing to use more local silicon, market sources say. Industry players say the trend toward chip substitution has been building for years, but whether it truly accelerates will depend on how strong the "chilling effect" becomes.
Wednesday 29 July 2026
ASM raises 2027 revenue outlook as AI-driven chip demand lifts forecast

On July 28, ASM International raised its revenue outlook for 2027 and issued third-quarter guidance above market expectations after reporting higher second-quarter revenue and profit, supported by continued investment in artificial intelligence infrastructure and advanced semiconductor manufacturing.

Wednesday 29 July 2026
KLA executives outline growth strategy amid accelerating AI infrastructure demand

During KLA's June 2026 earnings call, held on July 28, executives detailed the company's financial performance and strategic outlook, highlighting a period of record revenue and accelerating investment across the semiconductor ecosystem. CEO Rick Wallace and CFO Bren Higgins addressed several critical topics, including supply chain constraints and the long-term impact of artificial intelligence on wafer fab equipment (WFE) demand.