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Thursday 4 June 2026
BE Epitaxy Semiconductor targets 1.6T CPO with AMD, MediaTek
Silicon photonics (SiPh) chip designer BE Epitaxy Semiconductor turned profitable in 2025 as demand for 800G and 1.6T co-packaged optics (CPOs) heads toward explosive growth. Backed by orders and funding from AMD and MediaTek, the company is using a lean-asset model and ecosystem integration strategy to push into full-optical CPO design. General manager Jada Wang said 2026–2027 will mark the industry-wide breakout point for SiPh chips and CPO commercialization. BE Epitaxy Semiconductor's 800G products have already reached shipment standards, and the company is now moving toward 1.6T optical engine (OE) chipsets.
Thursday 4 June 2026
Chip test equipment makers hit by FPGA, CPU supply crunch

Semiconductor test equipment makers are facing severe shortages of key components, with lead times for FPGAs, CPUs, GPUs, and driver ICs stretching sharply as AI and data center demand strain the broader chip supply chain, according to The Elec.

Thursday 4 June 2026
Taiwan courts the world's AI startups in a bid to secure chip future
Taiwan is stepping up its efforts to position itself as a global hub for artificial intelligence and semiconductor innovation, deepening ties between international startups and its world-leading chip ecosystem.
Thursday 4 June 2026
Interview: Andhra Pradesh moves to become India's semiconductor packaging hub
Andhra Pradesh is making its most concrete move yet in semiconductors, zeroing in on packaging as the immediate entry point into the chip supply chain. Speaking on the sidelines of the Computex technology expo in Taipei, Bhaskar Katamneni, Secretary to the Government for ITE&C, acknowledged that wafer fabrication remains a long-term "seven or eight-year journey," but said packaging work is already well underway — with four PCB manufacturers having already begun operations, according to him.
Thursday 4 June 2026
Taiwan's Walsin Technology gains pricing power from AI demand

Walsin Technology, one of Taiwan's leading manufacturers of multilayer ceramic capacitors (MLCCs), has notified distributors that it will raise prices on resistors and selected capacitor products beginning June 1, citing mounting cost pressures and robust demand from AI-related applications. The move makes Walsin one of the first Taiwanese MLCC suppliers to formally implement a new round of price increases, and a sign that the inflationary effects of the artificial intelligence (AI) boom are spreading deeper into the electronics supply chain.

Wednesday 3 June 2026
MIPS CEO makes the case for RISC-V in physical AI at Computex forum
Sameer Wasson, CEO of MIPS by GlobalFoundries, spoke at the MIPS Forum at Computex 2026 on June 3 in Taipei, held at the Taipei Courtyard by Marriott Nangang — one day after his company announced the completion of its acquisition of Synopsys' ARC Processor IP Solutions business.
Wednesday 3 June 2026
Physical AI must act before it thinks, NXP CEO argues at Computex
As robots and autonomous systems move from factory floors into hospitals, warehouses, and public spaces, NXP Semiconductors CEO Rafael Sotomayor used his Computex 2026 keynote to argue that the defining challenge of physical AI is not raw intelligence, but the ability to act in milliseconds without waiting for instructions from the cloud.
Wednesday 3 June 2026
Tight laptop chip supply tests Intel's 18A comeback
Intel's effort to rebuild confidence in its manufacturing technology is facing an early test, as PC makers struggle to secure laptop processors built on the company's 18A process.
Wednesday 3 June 2026
GlobalFoundries completes acquisition of Synopsys' ARC processor IP business to build physical AI platform
GlobalFoundries (GF) has completed its acquisition of Synopsys' ARC Processor IP Solutions business, the company announced on June 2. The acquisition adds to GF's existing MIPS subsidiary, combining two processor IP portfolios into a single offering that spans RISC-V processor IP, software tools, custom silicon design, and semiconductor manufacturing.
Wednesday 3 June 2026
Nvidia to accelerate Vera Rubin production; Quanta Computer to add three US plants by end of 2026
Quanta Computer executive vice president and Quanta Cloud Technology (QCT) president Mike Yang said GPU applications are expanding across training, edge computing, and storage, as well as in the development of application-specific integrated circuits (ASICs). In response to future demand, the company is preparing for power needs and production capacity, planning to add three more plants in the US by the end of 2026.
Wednesday 3 June 2026
Nvidia and Infineon press supply chain co-design as AI power limits tighten
At the opening day of Computex 2026, Lite-On Technology hosted an AI industry summit under the theme "Powering the AI-driven Future," where DIGITIMES chairman Colley Hwang moderated a cross-industry panel with Nvidia, Infineon Technologies, and Gigabyte subsidiary Giga Computing at the exhibition venue.
Wednesday 3 June 2026
MediaTek denies rumored EMIB adoption timeline
MediaTek denied a foreign report about a timeline for adopting Intel Corp.'s embedded multi-die interconnect bridge packaging at a recent investor event and said its supply-chain strategy remains focused on TSMC. The clarification came after a Goldman Sachs research note, and media coverage suggested MediaTek had set tape-out and mass-production dates for a project using Intel EMIB-T packaging.
Wednesday 3 June 2026
SK Group weighs pausing SK Siltron sale as AI chip demand lifts wafer strategy
SK Group is reportedly placing AI and semiconductors at the center of its next round of business restructuring, prompting a fresh internal review of the strategic value of SK Siltron, a major global silicon wafer maker. The planned sale of SK Siltron, once seen as a move to improve SK Group's financial structure, now faces uncertainty as the group reconsiders whether to push ahead with the deal.
Wednesday 3 June 2026
Commentary: Why the world's memory giants are betting on Anthropic
The latest funding round for Anthropic produced a headline-grabbing figure: a US$65 billion capital raise that pushed the artificial intelligence (AI) startup's valuation to $965 billion, surpassing OpenAI and making Anthropic the world's most valuable AI startup.
Wednesday 3 June 2026
Analysis: New AI race is redefining semiconductor industry at Computex
Computex 2026 showcased the industry's latest innovations with its usual fanfare. Yet beneath the spectacle, the event revealed something far more consequential: artificial intelligence is rewriting not only the rules of competition but also the relationships that have long defined the global semiconductor industry.
Wednesday 3 June 2026
Naura pushes into AI chip packaging with first 600mm PLP descum tool
Naura Technology Group has shipped its first 600mm × 600mm panel-level packaging descum tool, marking a key step in the Chinese semiconductor equipment maker's move from wafer-level packaging into panel-level packaging, according to ICviews and ICsmart.
Wednesday 3 June 2026
Middle East war drives LME aluminum to 4-year high, squeezing chip equipment margins
Rising global geopolitical risk and tightening supply in some markets have pushed London Metal Exchange (LME) aluminum prices higher in volatile trading, adding cost pressures to industries across electronics components, semiconductor equipment, automobiles, and energy infrastructure.
Wednesday 3 June 2026
Samsung Foundry eyes Anthropic as OpenAI chip project reportedly stalls

Samsung Electronics is seeking to secure major artificial intelligence (AI) logic-chip customers as its reported preliminary work on a custom SoC for OpenAI slows, while Anthropic emerges as another potential opportunity for Samsung Foundry.

Wednesday 3 June 2026
GSEO sees CPO business as potential second growth engine from 2027 to 2028
Genius Electronic Optical Co. (GSEO) said on May 29 that its co-packaged optics (CPO) business is moving toward rapid growth in 2027 and 2028, with shipments that could eventually rival smartphone lenses as a second major revenue source.
Wednesday 3 June 2026
Commentary: China shifts exports toward higher-value tech as US trade pressure reshapes supply chains
China moved toward higher-value exports in response to escalating US trade and technology restrictions, reshaping global supply chains and forcing manufacturers to absorb higher costs, executives and research findings showed. The shift, visible in early 2026 trade patterns, came after rounds of US containment measures that began with 2018 tariffs and intensified following the 2025 policy expansion, according to a report commissioned by the Mainland Affairs Council.
Wednesday 3 June 2026
Intel Foundry makes progress in advance processes, CEO Tan calls TSMC a key partner
Intel CEO Lip-Bu Tan said Intel Foundry is making steady progress in advanced process technology, adding that Taiwan Semiconductor Manufacturing Company (TSMC) is one of Intel's most important partners. The remarks were made during a global media briefing with several senior executives on June 2.
Tuesday 2 June 2026
Intel CEO Lip-Bu Tan anchors AI comeback on 18A, x86, and Taiwan ties at Computex 2026
Intel CEO Lip-Bu Tan used his Computex 2026 keynote in Taipei to frame Intel's AI-era reset around execution, infrastructure, and deeper ties with Taiwan's PC and semiconductor supply chain.
Tuesday 2 June 2026
Intel CEO Lip-Bu Tan's Computex keynote: 1,000 steps up Elephant Mountain and a live demo with Perplexity's CEO
Intel CEO Lip-Bu Tan opened his Computex 2026 keynote in Taipei on June 2 with a personal note that set him apart from every Intel CEO before him.
Tuesday 2 June 2026
South Korea cuts EUV equipment approvals to speed Samsung and SK Hynix expansion
South Korea's Ministry of Trade, Industry, and Energy announced on June 2, 2026, that it would sharply streamline domestic approval procedures for extreme ultraviolet equipment used in semiconductor fabrication, reducing installation lead times from 34 days to 9 days to accelerate advanced production lines. The ministry said the change reclassifies EUV tools from high-pressure gas manufacturing facilities to a new "specific equipment" category after a partial revision to the Enforcement Decree of the High-Pressure Gas Safety Control Act.
Tuesday 2 June 2026
TSMC races to expand AI chip capacity while CPO and CoWoS move to center stage
Nvidia GTC Taipei opened on June 1 with a packed keynote by CEO Jensen Huang, who kicked off the event by unveiling the widely watched Taiwan supply chain board.