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Tuesday 15 September 2026
China's Guoxin Micro buys its way into power-chip manufacturing

Unigroup Guoxin Microelectronics plans to acquire WeEn Semiconductors for CNY1.9 billion (≈ US$283 million), giving the Chinese specialty IC supplier in-house wafer manufacturing and a faster route into power semiconductors.

Tuesday 15 September 2026
Global semiconductor revenue hits record US$425B in 2Q26
Global semiconductor revenue reached a record US$425 billion in the second quarter of 2026, surging 31.4% quarter-over-quarter, as AI demand and strong memory pricing continued to drive the market, according to research firm Omdia.
Tuesday 15 September 2026
Samsung, SK Hynix diverge on cell design for sub-10nm DRAM in 2028

Samsung Electronics and SK Hynix are preparing to move DRAM below the 10nm threshold in 2028, with the two memory makers pursuing different cell structures as conventional scaling becomes increasingly difficult.

Tuesday 15 September 2026
GlobalWafers partially resumes Italy plant, restarts EPI production
GlobalWafers announced on September 14 that recovery work is continuing at its Novara plant in Italy following a fire that broke out on the facility's 8-inch line on July 20, 2026, local time. The site has formally begun a partial resumption of operations, with overall recovery running slightly ahead of the original schedule.
Tuesday 15 September 2026
Sivers Semiconductors positions laser arrays as solution to copper's limits

At this year's China International Optoelectronic Expo (CIOE), Sivers Semiconductor brought two products to its booth that trace the trajectory of the optical networking industry: a 1.6T pluggable optical transceiver currently ramping toward mainstream adoption, and a prototype module built for external light source (ELS) architectures, a technology that could define the next generation of data center interconnects.

Tuesday 15 September 2026
TSMC 3nm, 2nm, and CoWoS stay tight as AWS, MediaTek, TPU shift capacity
TSMC's 3nm, 2nm, and CoWoS advanced packaging capacity remained in short supply in late 2026's third quarter, as changes in major customer orders and front-end and back-end supply models prompted the foundry to adjust its advanced capacity allocation. Supply chain sources said Nvidia and Apple continue to dominate TSMC's advanced process and packaging resources, while AWS has recently expanded AI chip tape-outs, giving Annapurna more 3nm capacity.
Tuesday 15 September 2026
Chinese chip tools reach 35% of equipment installed at local fabs
Chinese-made semiconductor equipment accounted for roughly 35% of tools installed at fabs in China in 2025, up from about 25% a year earlier, as domestic suppliers gain ground in key process-equipment markets.
Tuesday 15 September 2026
Inside CIOE: takeaways from China's biggest optoelectronics show
Last week, from September 9 to 11, thousands of vendors gathered for an enormous trade show in the Chinese tech hub of Shenzhen. At the China International Optoelectronic Expo (CIOE), DIGITIMES reporters got a peek into the trends going on within this booming industry.
Tuesday 15 September 2026
2nm capacity crunch may keep smartphone SoC makers on split-node strategy through 2027

In 2026, major smartphone system-on-chip (SoC) vendors began moving selected flagship processors to 2nm technology, seeking not only to secure sufficient capacity but also to deliver meaningful upgrades in technical specifications.

Tuesday 15 September 2026
Phoenix Pioneer Technology AI power substrate order visibility extends to 1Q27

IC substrate manufacturer Phoenix Pioneer Technology (PPt) turned profitable in the first half of 2026, driven by strong momentum in its advanced AI power substrate business. Production lines are running at full capacity, with order visibility clearly extending into the first quarter of 2027. Notably, end-system customers are bypassing OSAT providers to negotiate long-term agreements (LTAs) directly with the company.

Tuesday 15 September 2026
Nvidia, MediaTek deepen 20-year chip ties

Nvidia and MediaTek have recently drawn market attention after Nvidia invested US$3.5 billion in MediaTek convertible bonds, expanding cooperation into custom AI chips, AI PCs, automotive, and data centers. But their overlap began more than 20 years ago, during competition in the PC chipset market, when MediaTek, ALi, ULi, and Nvidia were already connected.

Tuesday 15 September 2026
Global data center capex could reach US$31.6 trillion by 2050 as AI demand surges
PwC and Oxford Economics jointly released their Global Data Centre Outlook 2026–50 in early September, projecting cumulative global data center capex of US$31.6 trillion by 2050 under the baseline scenario. If AI adoption accelerates, investment could approach US$50 trillion under an upside scenario.
Tuesday 15 September 2026
Sigmaintell: Memory shortage to ease in 2027 before chip growth hits 2029 wall

After months of tight supply and sharp price increases in 2026, the global memory market is expected to see its supply-demand gap narrow significantly in 2027 as DRAM capacity expands and demand patterns shift, according to Beijing-based Sigmaintell Consulting. The consultancy expects the memory and broader semiconductor markets to continue growing through 2028, but forecasts a potential pullback in 2029 as evolving AI applications reshape demand.

Tuesday 15 September 2026
The 1,000-watt problem: a TSMC veteran on the brute force forging Nvidia's AI chips
"He practically created a new era—the age of AI," Mou-Shiung Lin said of Nvidia CEO Jensen Huang. Yet, the early TSMC executive describes the methodology behind that success in blunt terms: it is "violent."
Monday 14 September 2026
Kokusai Electric gains from Hitachi split as AI memory demand surges
Kokusai Electric, the semiconductor equipment maker spun off from Hitachi and later acquired by KKR, has emerged as one of the clearest winners from Hitachi's restructuring. According to Nikkei, the company benefited from faster decision-making, continued research and development spending, and rising demand for advanced memory equipment as AI infrastructure spending accelerated in the second half of 2024.
Monday 14 September 2026
Yole Group takes outside capital for the first time, selling minority stake to new French fund
Yole Group, the French market-research firm that tracks the semiconductor, photonics and electronics supply chains, has sold a minority stake to Cervinvest Scale, the lower-midcap fund of Paris-based Cervinvest Capital. The deal, announced September 14, is the fund's first investment.
Monday 14 September 2026
Fujitsu's Monaka targets 2027 mass production with TSMC 2nm boost
Fujitsu is preparing to take its advanced AI CPU overseas, with sales set to begin as early as 2027 in Japan, the US, and Asia. The company is betting on Monaka, a high-efficiency, power-saving chip developed with technologies refined through its work on the Fugaku supercomputer, to regain competitiveness in advanced logic ICs as demand for AI inference surges.
Monday 14 September 2026
AI demand lifts UMC, VIS, PSMC revenue

After mature-node price competition from 2023 to 2025, AI demand has spread from GPUs and HBM to power management ICs (PMICs), power components, networking chips and specialty processes. At the same time, aggressive price cutting by mature-node players in China has eased, pushing quotes for Taiwan foundries broadly higher since the start of 2026.

Monday 14 September 2026
STMicro lead times top 1 year, boosting Taiwan chip makers
AI crowd-out effects are rippling through the supply chain, with lead times for microcontroller units (MCUs) from STMicroelectronics reportedly stretching beyond 1 year and triggering severe shortages in industrial control MCUs. That is opening the door for Taiwanese chip makers to push into high-end industrial MCUs, while supply is expected to remain tight through 2027 and stable delivery becomes key to defending market share.
Monday 14 September 2026
DIGITIMES Insight: High NA EUV chips near production, but economics will be the pacemaker
ASML's latest update suggests High NA EUV is no longer confined to laboratory validation. With 10 systems already operating across four customers worldwide, and three more in shipment or installation, the technology is beginning to enter production ramp-up. The shift matters because adoption now hinges less on optical promise and more on whether chipmakers can justify the added cost.
Monday 14 September 2026
DIGITIMES Insight: Taiwanese firms lead in FOPLP as overseas rivals race to catch up
Taiwanese chip packaging firms are advancing fan-out panel-level packaging (FOPLP) and glass-substrate development as AI processors demand ever-larger reticle sizes and more complex packaging. Their early manufacturing scale, automation progress, and substrate design choices could help determine who controls the next bottlenecks in high-end chip assembly.
Monday 14 September 2026
China optical firms target photonics with mixed high-end, lower-cost push
The 2026 China International Optoelectronic Exposition (CIOE) closed on September 11. While near-eye display applications such as AR/VR and smart glasses drew attention, vendors' latest moves in optical communications also attracted strong industry interest.
Monday 14 September 2026
South Korea broadens espionage law to counter rising tech leaks
South Korea's revised Criminal Act took effect September 13, extending the scope of espionage offenses from acts benefiting North Korea to those benefiting any foreign country or equivalent organization, as South Korea strengthens protection of semiconductors and other strategic technologies.
Monday 14 September 2026
Samsung, Qualcomm deepen 2nm talks as pricing and yield hurdles persist
Samsung Electronics and Qualcomm are expanding discussions over 2nm foundry cooperation, with pricing, yield, and process optimization still unresolved as Samsung seeks to regain a share of Qualcomm's flagship processor business.
Monday 14 September 2026
Gritek to take full control of 12-inch silicon wafer venture in major restructuring
Gritek plans to strengthen its position in China's large-diameter silicon wafer market by acquiring the remaining stakes in two semiconductor materials companies, according to a company announcement.