Benefiting from increased wafer shipments and higher capacity utilization, United Microelectronics Corporation (UMC) reported its most profitable quarter in nearly two years for the third quarter of 2025.
Dr. Nokibul Islam, Senior Director at STATS ChipPAC, presented the company's advanced packaging technology roadmap at the 2025 Advanced Packaging Developers Conference (APDC), identifying advanced packaging as one of the fastest-growing areas in the semiconductor industry.
Ang Wee Seng, Executive Director of the Singapore Semiconductor Industry Association (SSIA), told attendees at the 2025 Advanced Packaging Developers Conference (APDC) that the industry must strengthen collaboration and local networks to navigate geopolitical and resource challenges as it moves toward a projected US$1 trillion market by 2030.
Chinese electronics manufacturer Wingtech Technology has filed a formal statement with the Dutch public broadcaster NOS, urging the Netherlands to revoke its decision to temporarily take control of Nexperia, the semiconductor company Wingtech acquired in 2019. The move marks a new flashpoint in the increasingly strained relationship between China and Europe's technology industries, as national security and industrial policy concerns collide.
China's next phase of technology strategy is injecting fresh uncertainty into global supply chains, signalling a new round of strategic recalibration across industries worldwide.
