Largan announced on August 5 that July revenue reached NT$4.877 billion (US$150.8 million), up 31% month-over-month and 11% year-over-year. For the first seven months, consolidated revenue totaled NT$34.086 billion, up 7% year-over-year, as the company entered the traditional peak season.
On August 5, Taiwan's National Science and Technology Council said it had completed the central government's 2027 budget plan, with NT$182.3 billion (US$5.7 billion) earmarked for technology spending, up about 9.5% from 2026. The biggest increase goes to sovereign AI computing power and infrastructure as Taipei pushes ahead with its Smart Nation 2.0 initiative.
Rashi Peripherals, a national distribution partner for global technology brands in India, has entered a joint venture with Japanese electronics and technology company Restar Corporation. The move pushes the distributor beyond product distribution into engineering, design, and field application support for India's manufacturing sector, according to ScanX, IT Voice India, and CRN Asia.
Infineon said demand for its AI data center power semiconductors continues to exceed available supply, prompting leading customers to sign multi-year capacity reservation agreements that give the chipmaker greater visibility while securing future supply for hyperscale AI deployments.
Daeduck Electronics plans to invest KRW497 billion(US$349.50 million) in semiconductor production facilities through 2027, its second major expansion announcement this year, Seoul Economic Daily reported, citing a regulatory filing with South Korea's Financial Supervisory Service.
Huawei is arguing that the next phase of semiconductor performance will depend less on transistor shrinkage and more on system architecture, faster data movement and tighter coordination between chips, software and AI models.
Market interest in whether Taiwan's Powerchip Semiconductor Manufacturing (PSMC) would deepen cooperation with Intel or potentially bring the company in as an investor has grown, as the US government and companies like Intel have actively sought partnerships with Taiwanese chipmakers in recent years. Intel and Taiwan's United Microelectronics (UMC) are currently collaborating on a 12-nanometer process platform.
Manz has applied to establish a branch in the Tainan Science Park and plans to set up an R&D center there for advanced packaging equipment and systems integration solutions, according to the Southern Taiwan Science Park Bureau. The move is aimed at developing next-generation tools for markets including artificial intelligence, high-performance computing, and panel-level packaging.
South Korean semiconductor equipment maker Hanwha Semitech is expected to begin recognizing revenue from fan-out panel-level packaging (FOPLP) equipment starting in the third quarter of 2026. The move follows a return to profitability in the second quarter, driven by thermocompression bonding (TCB) tools. FOPLP is set to become the next growth engine as the company broadens its advanced packaging portfolio.
