Samsung Electronics' foundry division chief told employees on June 12 that a return to profitability in the contract chipmaking business looks difficult next year, with 2028 emerging as a more likely timeline, Yonhap, ZDNet Korea, and Chosun reported.
Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical deposition (ECD) mass-production tool, further expanding its footprint in advanced packaging process equipment and demonstrating integrated capabilities spanning in-house R&D, process and system integration, and mass-production deployment.
Galatek Technologies has opened a manufacturing, assembly, and delivery center in Penang, marking the AI-enabled automation and semiconductor equipment supplier's first manufacturing site in Malaysia.
As global semiconductor supply chains are rebuilt, Southeast Asia is evolving from a back-end test-and-pack region into a resilient, multi-center advanced packaging and equipment ecosystem, according to industry participants. Migration drivers include pushes for local production and service, faster ramps for AI chip capacity, and customer demands for supply chain resilience amid de-Americanization and de-Chinaization pressures.
Taiwan-based UBright Optronics is accelerating its transformation from an LCD optical film specialist into a diversified technology supplier, expanding into semiconductor materials, passive components and smart acoustics. The new businesses are expected to begin generating revenue in 2026 as product certifications advance, but the company has not yet offered guidance on their revenue impact.
China has allowed the release of a fresh supply of indium phosphide (InP) substrates, which are under export controls. A first 2026 batch shipped at the end of May following an earlier release in 2025, easing a capacity bottleneck in the optical communications market. Taiwanese compound semiconductor suppliers including Visual Photonics Epitaxy (VPEC) and Global Communication Semiconductors (GCS) are expected to benefit in the second half of 2026.
India sees rising global tech investment as Meta, Reliance and Anthropic deepen AI ties, while EV firms expand, Starlink faces delays, and semiconductor and tablet markets show steady structural growth.
Optical industry leaders Largan and Genius Electronic Optical (GSEO) have recently discussed progress in co-packaged optics (CPO), a key non-smartphone growth driver, and their strategies differ sharply. As customer demand and orders become clearer and more firmly secured, both companies have also turned markedly more confident, having taken a more cautious stance in prior quarters.
Linkotech said its fan-out panel-level packaging rollout is showing early momentum, with certification from a North American low-Earth-orbit satellite communications customer and first equipment deliveries completed in the first half of 2026. The company said related sales could quickly rise to double digits as a share of annual revenue, with implications for supply chains worldwide.
India has expanded exemptions from mandatory quality certification requirements for imports by Special Economic Zone (SEZ) units and developers, a policy change that industry observers say could ease the establishment of semiconductor manufacturing facilities in the country.
Shin-Etsu Chemical plans to build a new rare earth production facility in Fukui Prefecture, aiming to expand domestic smelting capacity and reduce Japan's reliance on China for materials critical to electric vehicle and semiconductor manufacturing equipment, according to Nikkei and Kyodo News.
Samsung Electronics is regaining ground in high-bandwidth memory and foundry services, but advanced packaging remains a weak point in its bid to capture a larger share of the AI chip supply chain, according to industry sources and Korean media reports.
A strike by South Korea's ready-mix concrete transport union is disrupting major semiconductor construction sites and raising concerns about wider industrial spillovers. If the stoppage continues, delays could spread beyond building projects and affect production schedules that matter to global technology supply chains and investors.
Silicon Labs is deepening its presence in India through expanded research operations and a greater commercial focus on smart infrastructure applications, even as the US-based wireless chipmaker prepares for an acquisition by Texas Instruments.
In power electronics engineering, Silicon Carbide (SiC) companies are competing to achieve the absolute lowest thermal resistance (Rth), with the mindset that lower heat signature equates a superior system. However, at PCIM Europe 2026, a collaborative project between Rohm Semiconductor, Schweizer Electronic, and eMoveUs GmbH exposed a revolutionary counter-intuitive shift in design philosophy: willingly accepting a localized thermal performance deficit to ultimately achieve dominant system-level advantages.
