Hermes Testing Solutions said its August revenue kept rising and topped NT$500 million for the first time, setting a new monthly record on steady growth in semiconductor test equipment engineering services and customized products. The wafer-testing solutions provider also said its in-house Membrane Probe Card has begun contributing revenue as it moves into customer applications, while the company expands into next-gen test applications for high-speed data transmission, silicon photonics and co-packaged optics (CPO).

AI and high-performance computing (HPC) demand is sustaining strong investment in advanced semiconductor processes, high-bandwidth memory (HBM), and advanced packaging, lifting the global semiconductor equipment market and opening higher-value opportunities for Taiwan's industrial PC (IPC) suppliers.

DB HiTek said it has completed reliability qualification for its 1,200 V silicon carbide (SiC) MOSFET process on 8-inch wafers. The development could expand foundry capacity for next-generation power semiconductors used in electric vehicles, renewable energy systems, and industrial equipment. The company is targeting volume production in 2027 as SiC manufacturers shift toward larger wafers.

Samsung Electronics has reduced its foundry Design Solution Partner (DSP) network to 11 companies from 13, as the chipmaker shifts toward greater emphasis on partners that can secure fabless customers, advance design projects, and help convert them into foundry orders.

At the China International Optoelectronic Expo (CIOE), Morphotonics, a Netherlands-based nanoimprint lithography company, made the case that the quickest way to reach affordable AR glasses runs through the display industry rather than the semiconductor background, where most AR lens-making equipment comes from.

AI chip demand is tightening high-end testing interface capacity, and supply-chain sources say Nvidia has raised prices to secure most of the probe card and test socket output from major testing interface vendors. The squeeze is also pushing Taiwan foundry leader TSMC and related IC design customers to assess diversified supply channels for early-stage R&D validation.

The extreme ultraviolet (EUV) lithography race is splitting into two tracks. Intel has moved High-NA EUV into production, Samsung Electronics and SK Hynix are targeting DRAM production in 2028, and TSMC plans to introduce the technology into advanced-node high-volume manufacturing in 2030.

Data-center power systems are entering a new phase as operators move toward 800V HVDC and denser DC-DC architectures, raising demand for high-voltage, low-loss, and high-frequency power devices. The shift is pushing suppliers toward integrated control, protection, and module solutions, while Taiwan manufacturers weigh how quickly they can adapt.

STMicroelectronics expects rapidly expanding AI infrastructure sales and stronger automotive demand to support growth into 2027, but its largest gross-margin gains will depend on customer approvals allowing older factories to close, CFO Lorenzo Grandi said at Citi's Global TMT Conference on September 9.

Analog Devices has agreed to acquire Alif Semiconductor in a US$1.35 billion all-cash deal, a move that could broaden access to faster, more energy-efficient edge AI systems for industrial, defense, health, and consumer applications worldwide. The deal underscores a shift toward local, real-time computing beyond data centers.

Yageo posted year-over-year and month-over-month revenue growth in August, extending its streak of record monthly highs to a sixth straight month. The passive components maker said strong AI-related demand and resilient demand in Asia helped offset holiday effects in Europe and the US.

Driven by sustained artificial intelligence (AI) demand, global semiconductor capacity expansion is accelerating. According to the 2026 Semiconductor Industry Talent Report released by 104 Job Bank, monthly job openings in Taiwan's semiconductor sector reached 47,000 in 2026, a year-over-year surge exceeding 20%.

Global PMX, a major maker of automotive power and safety components, said August consolidated revenue rose to NT$802 million (approx. US$25.4 million), up 33.50% year on year and extending the company's growth momentum from July. The company said order visibility for semiconductor products now stretches through 2027, as AI server liquid-cooling parts and high-end semiconductor components ramp up.

SuperAlloy Industrial, a global automotive wheel supplier, reported August consolidated revenue of NT$550 million (approx. US$17.4 million), up 2.46% from a year earlier, and NT$5.052 billion for January–August 2026, up 6.34% year on year. The company said the stronger sales base, along with progress in semiconductor material qualification, is setting up a second growth curve beyond its core auto business.

Hiwin Technologies has signed a supply contract with Semes, Samsung Electronics' semiconductor equipment arm, for a single-axis positioning stage being tested in hybrid bonding equipment, signaling a potential opening in South Korea's advanced packaging supply chain. The deal complements Hiwin's push to broaden its co-packaged optics (CPO) business and move into higher-value semiconductor equipment components.

For Samsung Electronics' two loss-making logic businesses, OpenAI's declaration that it is jointly producing and researching next-generation chips with the Korean company matters less as a new logo on the customer list than as a sign of where Samsung's advanced wafers actually go.

Jin Lian Cheng Resources completed an upgrade to its desulfurization production line as demand increased for lead-acid battery recycling tied to high-spec uninterruptible power supply (UPS) systems used by semiconductor plants. The Taiwanese waste lead-acid battery processor said the upgrade restored normal operations while improving sulfur oxide treatment, real-time monitoring, and environmental management.

Ample Electronic Technology said strong demand for passive components and artificial intelligence (AI) server-related products is boosting business momentum, as multi-layer ceramic capacitor (MLCC) customers ramp up copper paste purchases.

Washington has converted the largest federal bet yet on quantum computing from a promise into a contract, and it is taking ownership in return. On Sept. 8, the US Department of Commerce announced the signing of final awards with five companies under the CHIPS and Science Act: up to US$375 million for GlobalFoundries and up to US$100 million each for Rigetti, D-Wave, PsiQuantum, and Quantinuum, according to five separate announcements posted by the National Institute of Standards and Technology. Together, the five deals commit US$775 million, and each carries a minority, non-controlling government equity stake as a condition of the money.

Amkor Technology's latest Arizona expansion underscores how advanced packaging capacity is becoming a strategic issue for the US semiconductor supply chain. The larger campus aims to meet rising demand for advanced packaging, strengthen domestic production, and support next-generation devices worldwide.

China has imposed provisional anti-dumping measures on Japanese dichlorosilane (DCS), a semiconductor material used in thin-film deposition, potentially accelerating Chinese wafer fabs' shift toward domestic suppliers.

Asia Vital said August 2026 revenue rose to NT$512 million, up 29.10% year over year, as shipments of ASIC servers to a US cloud service provider customer continued to increase. The Taiwan-based supplier said revenue stayed above NT$500 million for a third straight month, while demand for the customer's next-generation products remained strong.

Axcelis Technologies plans to invest US$35 million in a new semiconductor equipment manufacturing facility in Pyeongtaek, South Korea, a move that could help strengthen global chip supply chains. The project underscores how leading suppliers are expanding production capacity to meet rising demand from manufacturers worldwide.