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    Home Tech Semiconductors IC manufacturing
    Sunday 21 December 2025
    TSMC's US expansion stirs security debate as Taiwan government reaffirms N-2 rule

    TSMC's plan to sharply expand its US footprint has reignited debate in Taiwan over technology security, even as the government insists that existing safeguards remain firmly in place.

    Sunday 21 December 2025
    Taiwan academics seek to break through SiPh yield bottlenecks
    Cloud computing, GenAI, and high-performance computing continue to drive bandwidth and energy efficiency demands. Line rates have now been pushed beyond 100–200Gbps. The intense heat generated by machines poses serious rack management challenges at data centers.
    Saturday 20 December 2025
    Foxconn's quantum advancement earns UNESCO recognition
    Marking the 100th anniversary of quantum mechanics, the United Nations General Assembly (UNGA) proclaimed 2025 as the International Year of Quantum Science and Technology (IYQ). The United Nations Educational, Scientific, and Cultural Organization (UNESCO) launched the Quantum 100 initiative, recognizing key contributors who have made pivotal contributions to the advancement of quantum science, technology, and the broader quantum community.
    Friday 19 December 2025
    US scrutinizes Nvidia H200 chip exports to China as risks mount
    The Trump administration has launched an interagency review to determine whether to authorize the first exports of Nvidia's H200 artificial intelligence chips to China, Reuters reported.
    Friday 19 December 2025
    Taiwan makes silicon photonics a pillar of its new national AI strategy

    Taiwan is seeking to anchor itself at the center of the next wave of artificial intelligence infrastructure, with silicon photonics elevated to a strategic national priority.

    Friday 19 December 2025
    Japan poised to guarantee 80% of Rapidus chip loans
    Japan plans to guarantee up to 80 percent of private-sector loans raised by Rapidus as the government intensifies financial backing for the chipmaker’s plan to mass-produce 2nm semiconductors, the Ministry of Economy, Trade and Industry said on December 18.
    Friday 19 December 2025
    TI begins shipping chips from new 300mm Sherman fab in Texas
    TI has begun shipping chips from its newest 12-inch semiconductor fabrication plant in Sherman, Texas, marking a key milestone in the company's long-term manufacturing expansion in the US. The facility, known as SM1, is the first fab at TI's Sherman mega-site and comes online about three and a half years after construction began.
    Friday 19 December 2025
    TSMC Co-COO Y.J. Mii wins Executive Yuan Award for driving advanced process and packaging innovation
    TSMC Executive Vice President and Co-Chief Operating Officer Y.J. Mii has been awarded the Executive Yuan Award for Outstanding Science and Technology Contribution, underscoring both his personal achievements and Taiwan Semiconductor Manufacturing Company's long-standing leadership in advanced semiconductor innovation.
    Friday 19 December 2025
    Exclusive: Former TSMC COO talks discipline and unity behind success
    Former COO of TSMC and a veteran semiconductor industry leader, J.K. Wang, shared insights from his 30-plus-year career at the company in an exclusive interview with DIGITIMES' IC Broadcasting podcast, marking his first media interview since retirement.
    Friday 19 December 2025
    Tata Group invests additional US$170M in Tata Electronics to expand iPhone production and semiconductor capacity
    Tata Group has invested an additional INR15 billion (US$170 million) in Tata Electronics, the company that manufactures iPhones for Apple, bringing its total investment in the subsidiary to INR45 billion over the past year. The latest funding, made in October, reflects ongoing support for expanding production capacity as Tata Electronics strengthens its role in Apple's global supply chain.
    Friday 19 December 2025
    Onsemi and GlobalFoundries sign agreement to develop 650V GaN power devices
    Onsemi has signed a collaboration agreement with GlobalFoundries to develop and manufacture next-generation gallium nitride (GaN) power devices, expanding its power semiconductor portfolio to include high-voltage lateral GaN solutions. The companies said the effort will focus initially on 650-volt devices produced using GlobalFoundries' 8-inch enhancement-mode (eMode) GaN-on-silicon process technology.
    Friday 19 December 2025
    India's semiconductor outbound investments surge, signaling strategic global ambitions
    India's semiconductor sector has increasingly turned to cross-border acquisitions and investments, reflecting a broader push to accelerate technology capabilities and integrate into global supply chains. Notably, Cyient Semiconductors' recent agreement to acquire over 65% of US-based Kinetic Technologies for US$93 million is part of a larger trend of Indian firms targeting foreign semiconductor assets.
    Friday 19 December 2025
    South Korea's Uniqconn partners with TSMC to mass-produce 60GHz communication chip
    A South Korean logic IC startup is moving closer to cable-free device design with the development of a 60GHz millimeter-wave communication chip designed to replace short-range wired connections in consumer and industrial electronics.
    Thursday 18 December 2025
    Doosan Group named preferred partner in SK Siltron sale talks
    South Korea's Doosan Group has been selected as the preferred negotiation partner for the acquisition of semiconductor wafer maker SK Siltron, valued at approximately KRW4 trillion (approx. US$2.72 billion) to KRW5 trillion, according to reports from The Korea Economic Daily, The Elec, and other media outlets.
    Thursday 18 December 2025
    Intel completes high-NA EUV validation for 14A, advances 2D transistor tech
    Intel has completed acceptance testing of the industry's first commercial high-NA EUV lithography system with a numerical aperture of 0.55, the ASML Twinscan EXE:5200B, laying the foundation for mass production of its 14A process node. This milestone marks the transition of high-NA EUV technology from research and development verification to high-volume manufacturing (HVM), enabling wafer throughput of 175 per hour and reinforcing Intel's efforts to reclaim leadership in advanced semiconductor processes.
    Thursday 18 December 2025
    Rapidus launches AI design tools to support 2nm semiconductor development
    On December 17, Rapidus announced a new suite of AI-based semiconductor design tools under its Rapidus AI-Assisted Design Solution (Raads), aimed at supporting the company's Rapid and Unified Manufacturing Service (RUMS) concept. The technology will be rebranded as Rapidus AI-Agentic Design Solution, with multiple tools scheduled for release starting in 2026. Customers will receive the tools alongside a process design kit (PDK) and reference flows.
    Thursday 18 December 2025
    China's EUV prototype forces a rethink of the AI chip order
    China has quietly crossed a psychological and potentially strategic threshold in the global semiconductor race. In a tightly controlled laboratory in Shenzhen, Chinese scientists have built a working prototype of an extreme ultraviolet (EUV) lithography machine, the most complex and geopolitically sensitive tool in modern chipmaking, according to Reuters.
    Thursday 18 December 2025
    Cyient Semiconductors to acquire majority stake in Kinetic Technologies for US$93 million
    Cyient Ltd's wholly owned subsidiary, Cyient Semiconductors Singapore Pte Ltd, has entered into a definitive agreement to acquire over 65% of US-based power semiconductor company Kinetic Technologies for US$93 million. The transaction is expected to close by April 30, 2026.
    Thursday 18 December 2025
    Advanced packaging drives ABF substrate expansion as Taiwanese companies exit post-pandemic capacity cuts
    As more AI GPU, CPU, and ASIC customers ramp up their market push, advanced packaging capacity continues to face tight supply. This has prompted upstream IC packaging substrate makers to adopt a more aggressive investment and capacity expansion stance, supported by improved order visibility.
    Thursday 18 December 2025
    Apple reportedly explores chip assembly in India, signaling supply chain diversification
    Apple is reportedly in preliminary talks with Indian chip manufacturers to assemble and package components for the iPhone, potentially marking a first step in shifting part of its semiconductor operations to India.
    Thursday 18 December 2025
    Taiwan targets four research priorities to maintain semiconductor leadership
    Taiwan has long dominated advanced semiconductor manufacturing, with TSMC's global R&D headquarters in Hsinchu alone employing over 10,000 researchers. The government continues to foster collaboration between academia and industry to advance both technology and talent development. Against this backdrop, the National Science and Technology Council (NSTC) is launching a new initiative in 2025 to sustain Taiwan's leading position in next-generation chip manufacturing over the next five to ten years.
    Wednesday 17 December 2025
    UMC backs Unimicron expansion to reinforce IC substrate supply as AI demand rises

    United Microelectronics Corporation (UMC) announced on December 17 that it will participate in the capital increase of its affiliate, IC substrate manufacturer Unimicron Technology, as part of a strategic investment plan.

    Wednesday 17 December 2025
    Rapidus unveils glass interposer to challenge TSMC
    Rapidus, Japan's state-backed chipmaker, has developed a prototype glass interposer for artificial intelligence chips. The company says the technology could lower production costs and strengthen its challenge to industry leader TSMC as Japan pushes to rebuild its advanced semiconductor base.
    Wednesday 17 December 2025
    Samsung Foundry reportedly wins Intel 8nm order after Nvidia
    Samsung Electronics' foundry division is reported to have secured an 8nm manufacturing order from Intel, adding another blue-chip customer to its mature advanced-node portfolio after Nvidia. Analysts say the win strengthens Samsung Foundry's order momentum at nodes where yields and cost structures have largely stabilized.
    Wednesday 17 December 2025
    Advantest, Tokyo Seimitsu to co-develop die-level probers for AI and HPC
    Semiconductor test equipment supplier Advantest and Tokyo Seimitsu have announced a joint plan to co-develop a next-generation die-level prober for high-performance computing components.
    More IC manufacturing coverage
    NTN special report
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