TSMC is reportedly planning another wafer foundry price increase, with supply chain sources saying its order visibility now extends to 2030. According to the sources, the company plans to adjust wafer prices from January 2027 across different processes, with hikes of about 3-6% as tight capacity and strong AI demand keep customers in line.

Powertech Technology expects stronger memory packaging and testing demand, higher average selling prices (ASPs), and ramping high-end through-silicon via (TSV) DDR5 production in the fourth quarter of 2026 to drive sequential growth throughout 2026 and lift revenue to a new record. Its Taiwan fan-out panel-level package (FOPLP) line, already booked by Advanced Micro Devices (AMD), is set to add revenue from 2027 and open another growth chapter for both sales and profit.

Microsoft is changing how companies evaluate their generative AI investments, as the technology evolves from its beginnings as a productivity tool into deeper uses in core business workflows. In addition to token consumption and model costs, Microsoft Taiwan general manager Sean Pien points out that corporations are also examining how AI actually benefits workflows and innovation, making return-on-investment (ROI) evaluations harder to judge solely on the basis of time or labor savings.

Japan's Leading-edge Semiconductor Technology Center (LSTC) is building a public-private-academic framework around Rapidus, which plans to mass-produce 2-nanometer chips in 2027, to advance next-generation semiconductor research and talent development and give Japan a unique edge in the global race for advanced process technology.

Biwin Storage Technology plans to invest CNY4.5 billion (approx. US$672 million) in the third phase of its wafer-level advanced packaging and testing project, expanding 2.5D integration and compute-memory co-packaging capacity as AI and high-performance computing lift demand for advanced packaging.

Archie Hwang, the founder and chairman of Hermes-Epitek, appeared before the media alongside Hermes Testing Solutions Inc. (HTSI) executives. The company outlined a major push into silicon photonics (SiPh) co-packaged optics (CPO) testing and said related revenue is expected to begin contributing in 2027.

Nexperia China is accelerating production on its domestic 12-inch wafer platform as it rebuilds a locally controlled semiconductor supply chain spanning design, wafer production, packaging, and testing.

Taiwan's export orders topped US$100 billion in August 2026, reaching US$102.96 billion, up US$5.02 billion from the previous month, according to statistics released by Taiwan's Ministry of Economic Affairs (MOEA) on September 22. Export orders for September are forecast to be between US$106 billion and US$109.1 billion, representing year-over-year growth of 50.7% to 55.1%.

DeepSeek CEO Liang Wenfeng said during a call with investors that he aims to rely on Huawei chips to train the startup's models in the future, and that a batch of training chips from Huawei are set to begin arriving at his company as early as the fourth quarter of 2026.

The labor dispute at Micron Taiwan continues to escalate after Micron and the Taiwan Taoyuan Union failed to reach agreement at a second mediation meeting on September 21, 2026. The union said the company has not presented a concrete profit-sharing plan and announced it will launch a strike vote under the Act for Settlement of Labor-Management Disputes, while Micron said it will keep talking and coordinating but must still go through board procedures.

Rising demand for advanced packaging tied to AI and high-performance computing (HPC) is driving development at Baipu Industrial Park in Kaohsiung, where construction has formally begun on what is billed as Taiwan's first advanced packaging supply-chain cluster. Led by TSMC, the park's first phase has already been fully allocated, and a groundbreaking ceremony on September 21 drew more than 20 semiconductor companies, including TSMC, Foxconn, and ASE.

China's silicon carbide (SiC) end-market demand is expanding rapidly, driven by high-voltage charging infrastructure and AI servers. The surge in orders has tightened SiC wafer capacity in China, and some offshore companies seeking foundry partners there have reportedly been turned away, pushing spillover business toward Taiwan, where Episil, HYS, and Diodes are among the names cited as potential beneficiaries.

Demand from high-tech companies for new research and manufacturing sites remains strong, prompting Taiwan to advance plans to expand Longtan Science Park by 104 hectares as the government seeks to accommodate continued growth in AI and semiconductor industries.