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Wednesday 22 July 2026
Samsung sounds out suppliers on four new fabs by 2030, report says
Samsung Electronics is sounding out major suppliers about whether they can support four proposed new semiconductor fabrication plants through 2030, as South Korea's chipmakers prepare for a concentrated cycle of factory construction.
Wednesday 22 July 2026
CPO commercialization opens new SiPh packaging race for Taiwan OSATs

Exploding demand for AI server computing power is pushing data-center architectures to upgrade at a faster pace, and the traditional copper-wire signal path is approaching its physical limits. As co-packaged optics (CPO) and related solutions enter their first year of commercialization, the silicon photonics (SiPh) industry is poised for rapid growth.

Wednesday 22 July 2026
Commentary: Gulf state's Sovereign Wealth Fund pours into ASEAN, eyeing stake in AI infrastructure supply chains

ASEAN's AI boom is taking on a dual role as both a "no-man's land" and an international hub from Singapore's perspective, while investors from the Middle East and China are also pushing into the region. According to industry sources, ASEAN's AI industry will be driven not only by local demand, but also by China's market.

Wednesday 22 July 2026
Albany NanoTech Complex acquires ASML High NA EUV tools for chip research
Parts of ASML's next-generation high numerical aperture (High NA) extreme ultraviolet (EUV) machine have arrived in New York state, where they will be used for chipmaking R&D. State officials tout this as an important step in establishing a US-based research center for cutting-edge lithography as chip miniaturization begins to reach the limits of Moore's Law.
Wednesday 22 July 2026
TSMC raises 2027 chip prices, giving Intel fresh pricing room

TSMC's planned 2027 wafer price increases are reinforcing confidence that AI chip demand remains strong while prompting fresh discussion over whether Intel and other semiconductor companies will gain greater flexibility to adjust their own pricing.

Wednesday 22 July 2026
Chinese equipment makers win early production orders as TGV packaging moves beyond the lab

Chinese semiconductor equipment suppliers are beginning to secure production orders for through-glass via (TGV) manufacturing tools, marking a shift from prototype validation toward commercial deployment as the industry moves to develop glass substrates for next-generation AI chip packaging.

Wednesday 22 July 2026
WAIC 2026: Enflame debuts China's first glass-based CoPoS AI chip sample

Chinese AI chip developer Enflame said at the World Artificial Intelligence Conference (WAIC) 2026 that it had jointly showcased an AI chip sample with Shanghai Xianfeng Technology using glass-based Chip-on-Panel-on-Substrate (CoPoS) panel-level advanced packaging.

Wednesday 22 July 2026
Taiwan chip supply chain faces tighter green power pressure from Apple and Google
Taiwan's semiconductor supply chain is facing mounting pressure to secure enough green electricity as Apple and Google push suppliers to meet net-zero requirements. The strain is rippling from end customers to foundries such as TSMC and then through upstream and downstream vendors, raising fresh concerns over the island's ability to provide affordable and sufficient clean power.
Wednesday 22 July 2026
China weighs stricter AI and chip export curbs after Kimi K3 benchmark win

China is considering tighter export controls on artificial intelligence and semiconductor technologies amid intensifying competition with the US in frontier AI. The proposed measures, reported by Financial Times, would also target overseas acquisitions of advanced technology startups and could appear in the next revision of Beijing's export control catalogue.

Wednesday 22 July 2026
TSMC's Arizona capex draws Taiwanese capital, with J&V Energy staking US$88M on land for spillover gains

TSMC continues to expand its investment in Arizona, accelerating not only the relocation of semiconductor equipment and materials suppliers to the US, but also attracting Taiwan's capital markets into the region.

Wednesday 22 July 2026
Japan weighs new standards post to gain an edge in AI and chips
Japan is considering creating a senior government position to coordinate international standardization across ministries and industry, as Tokyo seeks to convert a sweeping investment drive into a stronger global position for Japanese companies in artificial intelligence (AI), semiconductors and other strategic technologies.
Wednesday 22 July 2026
'Two companies, one business': how Zeiss and ASML are riding the AI boom to dominate EUV

Zeiss, the exclusive supplier of ASML's extreme ultraviolet (EUV) optical systems, says the two companies operate as though they were one business. The comment comes as ASML's results for the second quarter of 2026 beat expectations, with the lithography equipment maker lifting its full-year outlook again. Zeiss Semiconductor Manufacturing Technology (SMT) President and CEO Frank Rohmund said the strong ASML report is good news for Zeiss as well, underscoring a partnership that has become deeply intertwined.

Wednesday 22 July 2026
Interview: Why agentic AI could be SiPearl's biggest break—and Europe's

Philippe Notton has spent nearly 20 years traveling to Taiwan roughly once a month. That rhythm—born from his time at MStar Semiconductor and deepened across four companies on three continents—shaped how he thinks about building chips, building companies, and building Europe's only independent advanced CPU business.

Wednesday 22 July 2026
Academia Sinica quantum chip platform targets production by end of 2026
Academia Sinica said its quantum chip fabrication platform in Tainan is moving through equipment calibration and is expected to start producing quantum chips by the end of 2026. The institute also said its larger quantum technology laboratory building is still under construction and is scheduled to open in 2028.
Tuesday 21 July 2026
Huawei Kirin 9030 shows SMIC's 7nm gains and ongoing efficiency gap
A teardown of Huawei's Kirin 9030 flagship processor — built on SMIC's 7nm-class N+3 process — reveals continued density progress from China's leading chipmaker, but a significant efficiency gap against global peers remains.
Tuesday 21 July 2026
Trump offers tariff relief to aluminum producers investing in US smelters

US President Donald Trump has signed a proclamation creating a new incentive program that would cut import tariffs on primary aluminum for companies that invest in expanding domestic smelting capacity, marking the latest effort by the administration to boost US metals production.

Tuesday 21 July 2026
Power and water constraints cast doubt on South Korea's Honam memory cluster, experts say
South Korea's plan to develop a semiconductor cluster in the Honam region (Jeolla Province) is facing mounting scrutiny over whether the area can support the enormous energy and infrastructure requirements of advanced memory manufacturing.
Tuesday 21 July 2026
China's EUV gap keeps semiconductor catch-up in check
As the US continues to tighten export controls on advanced semiconductor equipment to China, questions are mounting over whether China can narrow the gap with leading-edge manufacturing through mature nodes and advanced packaging. German manufacturer Zeiss said advanced packaging can improve overall chip performance, but it cannot fully replace the process advantages delivered by extreme ultraviolet (EUV) lithography.
Tuesday 21 July 2026
CMTX develops 590mm single-crystal silicon ground ring for chip etching

South Korean semiconductor materials and parts supplier CMTX has developed a roughly 590mm single-crystal silicon ground ring for chip-etching equipment and plans to begin customer validation as it scales production of the 600mm-class ingots used to make oversized chamber components.

Tuesday 21 July 2026
TSMC weighs margin hit against long-term AI payoff in US push

TSMC has announced an additional US$100 billion investment in the US on top of its existing US$165 billion commitment, expanding its Arizona footprint to 12 fabs and one R&D center. While the market has focused on the size of the spending, investors are more concerned that overseas expansion could squeeze profitability.

Tuesday 21 July 2026
Taiwan indicts ex-TSMC employees in first China-linked national core tech espionage case

Taiwan prosecutors have indicted four former TSMC employees for allegedly stealing confidential semiconductor technology with the intent of transferring it to China, marking the island's first criminal prosecution involving "national core technologies" under the National Security Act. According to Nikkei Asia, the case highlights Taiwan's intensifying efforts to safeguard its semiconductor leadership amid growing competition from China.

Tuesday 21 July 2026
AI reshapes semiconductor growth curve; Zeiss eyes US$2.5 trillion market
Generative AI, high-performance computing (HPC), and large AI models are rapidly reshaping the global semiconductor industry's growth curve. Thomas Stammler, chief technology officer of Semiconductor Manufacturing Technology (SMT) at Zeiss, said the market is now being discussed not as a US$1 trillion milestone in 2030, but as one that could reach US$2 trillion or even approach US$2.5 trillion, ushering in a new growth cycle for the industry.
Tuesday 21 July 2026
BOE expands into glass-core packaging, solar cells and optical interconnects
BOE Technology Group said on July 20 that it is pushing beyond display panels into glass-core substrate packaging, perovskite solar cells and Micro LED optical interconnects. The Chinese display maker outlined the three areas as strategic priorities as it moves toward advanced packaging, optoelectronics and new energy markets, according to meeting notes from an investor relations event posted on the Shanghai Stock Exchange website.
Tuesday 21 July 2026
Pat Gelsinger: Intel missed GPU boom, warns Taiwan energy risk

Former Intel CEO Pat Gelsinger has criticized Intel's past strategy in a recent interview, revisiting the company's history with Nvidia and Apple while also weighing in on Taiwan Strait tensions and the outlook for quantum computing. Speaking at the RAISE Summit AI conference in Paris, he said Intel dismissed Nvidia GPUs at the height of its CPU dominance as nothing more than graphics tools for gamers.

Tuesday 21 July 2026
Samsung keeps High-NA EUV rollout cautious as foundry profitability remains the focus

Samsung Electronics is taking a slower approach than Intel to High-NA extreme ultraviolet (EUV) lithography for advanced chip production, weighing equipment spending against the need to restore foundry profitability. According to Chosun Biz, citing industry sources, the debate now centers less on yield than on financial returns.