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Wednesday 24 December 2025
PC giants rush to lock in memory supply as prices surge toward a new supercycle
As the global memory market enters its sharpest price upswing in nearly five years, one top-tier PC maker has moved quickly to lock in supply, dispatching senior executives to negotiate directly with major memory producers, including Samsung Electronics, SK Hynix, and Micron Technology.
Wednesday 24 December 2025
Samsung, SK Hynix reportedly hike HBM3E prices nearly 20% ahead of 2026 shift
South Korean memory giants Samsung Electronics and SK Hynix have reportedly hiked prices for fifth-generation high-bandwidth memory by nearly 20% for 2026 deliveries, as soaring demand for artificial intelligence accelerators outstrips supply, according to industry sources. The price increase for HBM3E chips comes as manufacturers pivot production resources toward next-generation HBM4 technology, creating an unusual supply crunch for the current industry standard.
Wednesday 24 December 2025
Taiwan's November export orders up nearly 40%, driven by US AI demand
Taiwan's Ministry of Economic Affairs (MOEA) announced on December 23, 2025, that export orders from the US reached US$28.45 billion in November 2025, up 12.5% sequentially and 56.1% year-over-year. Orders for information and communications products, focused on artificial intelligence (AI) servers, rose by US$6.43 billion, marking a sharp year-over-year increase of 117.7%.
Wednesday 24 December 2025
Exclusive: Samsung slows DDR4 phase-out, reportedly requires NCNR contracts for server customers
Memory giant Samsung Electronics is slowing its planned DDR4 DRAM production phase-out in the fourth quarter of 2025 amid surging market prices and tightening supply. Sources say Samsung will sign long-term non-cancellable, non-returnable (NCNR) contracts with select server customers starting the first quarter of 2026 to secure maximum profit from capacity allocation as DDR4 demand heats up.
Wednesday 24 December 2025
US sets June 2027 deadline for China chip tariff spike
The Office of the US Trade Representative (USTR) has concluded a year-long Section 301 investigation into China's acts, policies, and practices related to its semiconductor industry, determining that they are actionable under US trade law. The findings were published in a notice dated December 23, 2025, and are scheduled to appear in the Federal Register on December 29.
Wednesday 24 December 2025
2D materials: from memory entry to logic's future
Two-dimensional (2D) materials were once regarded as important candidates for extending semiconductor scaling. Because they are only an atom thick, they are theoretically very suitable for fabricating extremely small, ultra-low-power transistors. However, once these ideas move into advanced logic processes, challenges begin to surface. The problem lies in the fact that using 2D materials to fabricate FETs requires process control that is nearly at the single-atom level.
Wednesday 24 December 2025
Taiwan advances 'dream memory' R&D beyond DRAM for AI era
Once a low-cost commodity underpinning global computing, dynamic random-access memory (DRAM) has become a strategic chokepoint as AI-driven demand reshapes supply chains. With prices rising and conventional scaling nearing its limits, Taiwanese researchers—backed by government funding—are racing to develop next-generation memory technologies that promise higher density, lower power consumption, and resilience in extreme environments.
Wednesday 24 December 2025
ENE Technology warns DDR shortage may hit revenue, eyes drones for growth
ENE Technology said persistent shortages of DDR memory could weigh on revenue over the next two quarters, as tight supplies of DRAM and storage chips continue to pressure notebook and smartphone markets heading into 2026.
Tuesday 23 December 2025
Silicon Optronics eyes BSI and low-power products in face of memory supply concerns
Silicon Optronics (SOI) highlighted at its recent earnings call that ongoing price hikes and shortages in consumer memory remain unresolved, potentially tightening wafer foundry supply for the company's lens module-related chips. The firm warned that since SoCs integrated with lenses require memory support, shortages in consumer memory could limit production volumes of mid- to low-end consumer applications due to high costs or material mismatches. Given that this segment is a core shipment market for SOI, the company said it will closely monitor developments.
Tuesday 23 December 2025
Samsung reportedly secures over 60% of iPhone 17 DRAM supply, extends lead to iPhone 18
Samsung Electronics has reportedly become the largest supplier of mobile DRAM for Apple's iPhone 17, a trend expected to continue with the upcoming iPhone 18. Industry analysts attribute this shift to SK Hynix and Micron recently focusing their production capacity on AI-targeted high-bandwidth memory (HBM), prompting Apple to rely more heavily on Samsung's ample general DRAM output to secure supply.
Tuesday 23 December 2025
China's space launch surge exposes Taiwan's tech gap
As privately owned rocket and satellite manufacturers in the United States continue to surge, China has been accelerating its own commercial space ambitions. Beyond its extensive low-Earth-orbit satellite deployment plans, the privately held Chinese launch company LandSpace Technology achieved a milestone on December 3, 2025, when its Zhuque-3 rocket completed a successful maiden flight.
Tuesday 23 December 2025
With memory price hikes diluting end-of-year smartphone demand, AMOLED panel prices also drop
Despite approaching the end of the year and the promotional peak season coming to an end, overall utilization rates in the smartphone panel market have remained relatively high. Additionally, differences in market conditions and structures among panel technologies have led to mixed price movements.
Monday 22 December 2025
Samsung's HBM4 SiP tops Nvidia's performance tests, heating up memory race
Samsung Electronics and SK Hynix are reportedly intensifying their competition to supply Nvidia's sixth-generation high-bandwidth memory (HBM), known as HBM4. The new HBM4 will be used in Nvidia's next-generation AI accelerator, Rubin, expected to launch in the second half of 2026.
Monday 22 December 2025
Etron founder sees Moore's Law rebound as memory crunch stretches to 2027

Etron Technology founder Nicky Lu says the boom in AI is accelerating semiconductor innovation and restoring the momentum of Moore's Law, even as a global memory shortage threatens to persist through the first half of 2027. Speaking in Taipei as the industry closes a record-breaking year, Lu noted that the demand for high bandwidth and customized memory architectures is forcing a structural shift in how chips are designed and manufactured.

Monday 22 December 2025
Weekly news roundup: Intel's TSMC talent grab draws scrutiny, Samsung foundry lands Intel order, Moore's Law talent gap looms
These are the most-read DIGITIMES Asia stories in the week of December 15 to December 21, 2025.
Monday 22 December 2025
Memory price spike pressures consumer tech as AI absorbs supply
Rising memory chip prices are unlikely to slow the world's largest technology companies as they accelerate investment in artificial intelligence computing, but the surge risks squeezing consumer electronics demand in 2026, integrated circuitdistributors said, as components and capacity continue to shift toward AI infrastructure.
Monday 22 December 2025
South Korea examines challenges in building a strong AI semiconductor industry
The National Academy of Engineering of Korea (NAEK) recently convened a seminar, gathering industry and academic experts to assess South Korea's position in the AI semiconductor sector. The discussion underscored concerns about the country's heavy focus on memory chips and drew attention to Taiwan's comprehensive semiconductor ecosystem as a model.
Sunday 21 December 2025
Notebook shipments expected to defy slow season in 1H26

Rising memory prices are prompting end customers to procure notebooks early, a shift that is expected to keep shipments steadier than usual during the traditionally weak first half of 2026, even as brands are set to raise their end notebook prices to reflect the increasing costs, according to sources from the notebook supply chain.

Saturday 20 December 2025
Samsung reveals sub-10nm DRAM breakthrough targeting 0a, 0b nodes
Samsung Electronics has unveiled a key technology pathway for sub-10nm DRAM, offering a rare public look at how the company plans to push memory scaling beyond current 10nm-class limits and into future 0a and 0b nodes.
Friday 19 December 2025
Samsung turns memory shortage into advantage as others consider reducing capacity
As memory shortages and price increases extend through 2026, smartphone companies are considering downgrading memory capacities in their devices. Despite this, Jacob Chen, president of Samsung Taiwan's Mobile Communications Division, stated that Samsung's vertically integrated structure across the supply chain allows the company to benefit from memory shortages, supporting stronger smartphone sales. He expects Taiwan's smartphone sales volume in 2026 to continue growing and confirmed that Samsung currently has no plans to reduce memory capacities in its devices.
Friday 19 December 2025
SK Hynix reportedly to open new office in Seattle area to deepen ties with Nvidia and major tech firms
SK Hynix is reportedly establishing a new office in Bellevue, Washington, aiming to strengthen collaboration with key clients, including Nvidia, Amazon Web Services, and Microsoft. The move is seen as a strategic step to enhance the company's presence within the Seattle tech ecosystem.
Friday 19 December 2025
Memory shortages reshape smartphone market as costs hit 35% of mid-range devices
Research institutions predict that global smartphone shipments could decline by 1–2% in 2026 due to memory shortages, with mid- and low-range devices expected to be most affected. Based on the Bill of Materials (BOM), the proportion of memory in total component costs varies by device tier. High-end smartphones allocate roughly 15% of component costs to memory, while mid- and low-range devices account for approximately 25–35%.
Friday 19 December 2025
Brands cut specs and raise prices as memory supply turns scarce
Memory prices are surging, sending shockwaves through the supply chain as suppliers prioritize higher-margin cloud and AI server demand. Rising procurement costs are squeezing downstream brands, while allocations for consumer and non-AI applications are being sharply curtailed. Memory is emerging as a structural supply bottleneck heading into 2026.
Friday 19 December 2025
Samsung to supply SOCAMM2 LPDDR modules to Nvidia
Samsung Electronics has moved ahead in the race to supply next-generation AI server memory, providing Nvidia with samples of its SOCAMM2 LPDDR-based modules. The development signals a strategic shift as the AI memory market diversifies beyond high-bandwidth memory (HBM), with Samsung's LPDDR expertise offering a competitive edge, according to Samsung and Korean media ZDNet Korea and Biz Herald.
Friday 19 December 2025
Memory shortage drives price hikes in China's PC and smartphone markets
China's 3C market has been reporting successive price hikes despite a sluggish macroeconomic environment and deflationary pressure. Xiaomi, followed by Honor, Lenovo, and Dell, have increased prices, demonstrating the impact of memory shortages on the 3C end market.