Despite the fact that Huawei employs mobile processors manufactured by China's SMIC, the company continues to rely on non-Chinese memory manufacturers for its premium smartphones, according to market sources.

As global memory manufacturers race to advance DDR5 technology, a dispute has emerged over China's semiconductor capabilities. Zol.com.cn reports that Changxin Memory Technologies (CXMT), China's leading DRAM manufacturer, claims to have achieved an 80% yield rate in its DDR5 mass production, matching the 80-90% yields of industry leaders Samsung Electronics and SK Hynix. However, Businesskorea contests this assertion, stating CXMT's actual DDR5 yield hovers between 10-20%, raising doubts about the Chinese media's figures.

According to Silicon Motion Technology, a specialist in memory device controllers, the NAND flash industry is expected to reach a supply-demand balance or experience a slight shortage in the second half of 2025.

Micron Technology's Taiwan subsidiary officially held an opening ceremony for its third office building in Taichung on December 25, marking a significant milestone in its long-term investment in the region. The new development underscores Micron's commitment to deepening its roots in Taiwan.

Micron is aggressively expanding its footprint in the high-bandwidth memory market, capitalizing on surging AI chip demand to accelerate growth. Backing this expansion, the company is set to receive up to US$6.165 billion in CHIPS Act funding from the US Department of Commerce by the end of 2024. To strengthen its market position, it plans to expand production in the US and Malaysia, aiming for a 20% share of the HBM market by 2025.

As competition in the high bandwidth memory (HBM) market escalates, SK Hynix is on track to begin mass production of its 16-layer HBM3E products as planned. The significance of this achievement is heightened by the fact that the same stacking technology will be applied to HBM4.

The US government has recently finalized the subsidy amounts for SK Hynix and Samsung Electronics (Samsung), with the two major South Korean companies receiving US$458 million and US$4.745 billion respectively, totaling over US$5.2 billion. This raises curiosity regarding what investments these two firms will pursue in the US.

As Broadcom strengthens its position in AI chip development through partnerships with industry giants like Apple and Google, the company has now secured a significant high-bandwidth memory (HBM) supply agreement with SK Hynix, according to South Korean media reports.

ChangXin Memory Technologies (CXMT), China's leading DRAM manufacturer, has reportedly begun mass production of DDR5 memory, according to market sources.

Micron has released its first-quarter fiscal 2025 (1QFY25, ending November 28, 2024) financial results, highlighting strong performance in its HBM segment. However, a weaker-than-expected outlook has dampened market confidence, casting a shadow over South Korean rivals Samsung Electronics and SK Hynix.

Japanese NAND flash maker Kioxia debuted on the Tokyo Stock Exchange's Prime Market on December 18, marking a significant milestone. Despite an initial stock price surge, the company's current market value stands at less than half of the JPY2 trillion (approx. US$13 billion) valuation it held upon separating from Toshiba in 2018.

While SEMICON Japan 2024 highlighted 3DIC and advanced packaging equipment essential for artificial intelligence (AI) chips, the event saw fewer physical machinery demonstrations than expected.

Nanya Technology has greenlit a strategic alliance with DRAM design firm PieceMakers Technology, committing up to NT$6.6 billion (US$1.5 million) in a cash capital increase to secure a 38% stake. The collaboration targets customized ultra-high-bandwidth memory solutions tailored for AI and edge computing demands.

Nvidia has overcome production hurdles for its highly anticipated Blackwell chip, with CEO Jensen Huang confirming the resolution of design flaws in collaboration with TSMC. Shipments are now set to begin in the fourth quarter of 2024, with a full ramp-up by the first quarter of 2025. Despite recent thermal management challenges in the GB200 Rack system, impacting shipment capacity, the supply chain confirms these issues have been resolved, ensuring smooth production.

Amid surging AI demand, SK Hynix has unveiled a 61TB SSD tailored for AI data centers, marking a significant leap in the enterprise SSD (eSSD) market and intensifying competition with industry leader Samsung Electronics.

Samsung Electronics (Samsung) is set to construct a test line for 10nm seventh-generation DRAM (1d DRAM) at Pyeongtaek Plant 2 (P2), strengthening its competitive position and enhancing yield improvement for new generation products.

Micron Technology announced during its latest investor conference that its HBM4 development is progressing as planned while revealing development of HBM4E is underway. The company expects to begin mass production of HBM4 in 2026, according to Wccftech.

India-based consumer electronics brand Micromax Informatics has partnered with Phison, a Taiwan-based NAND controller and storage provider, to create MiPhi. This strategic collaboration supports India's 'Making AI in India' vision, highlighting the country's aspirations to lead in artificial intelligence.

Kioxia, which recently listed on the Tokyo Stock Exchange (TSE), has announced plans to double its market share in AI-focused NAND products. President Nobuo Hayasaka highlighted the surging demand for AI-driven applications as a primary growth driver. He also called on major shareholders Bain Capital and Toshiba to reduce their stakes within three years to bolster Kioxia's operational independence.

The world's third-largest NAND flash manufacturer, Kioxia, has officially gone public in Japan, securing funding for investments in artificial intelligence (AI) semiconductor technologies. This move has drawn close attention from major South Korean companies Samsung Electronics (Samsung) and SK Hynix.

The US Department of Commerce has awarded SK Hynix a grant of up to US$458 million under the CHIPS and Science Act (CHIPS Act), supporting the company's efforts to strengthen the AI supply chain in the US. The funding will support the establishment of a research center in Indiana focused on next-generation high bandwidth memory (HBM) and advanced packaging R&D.

Micron Technology reported record fiscal first-quarter revenue driven by data center SSD sales, which now represent over half of total revenue. While HBM shipments doubled quarter over quarter, the company's fiscal second-quarter guidance fell below expectations due to weakening demand in non-AI segments. However, AI-driven growth prospects remain strong for fiscal 2025.

After revealing the latest financial results, Micron held an earnings call, discussing the recovery paces across markets. The company is optimistic about the demand for HBM as it continues to secure customers and develop HBM4.

Japanese NAND flash manufacturer Kioxia has announced plans to produce three additional types of memory, targeting next-generation products driven by artificial intelligence (AI) demand. The announcement comes as the company approaches its IPO and seeks to communicate its value to the market.

The US Department of Commerce's Bureau of Industry and Security (BIS) has expanded semiconductor export controls to include high bandwidth memory (HBM), a crucial component for artificial intelligence and high-performance computing. This strategic move raises concerns over the impact on Samsung Electronics, which sells specific HBM products to mainland China.