GPU prices are expected to rise in early 2026 as memory costs surge. AMD may implement hikes starting in January 2026, with Nvidia following in February 2026, according to industry sources. Pricing adjustments will likely continue for several months.

Nvidia has reportedly asked memory suppliers to prepare for the delivery of 16-high high-bandwidth memory by the second half of 2026, according to industry sources cited by South Korean media, including ET News and eNews Today. The request sets an aggressive timeline for a product that has yet to be commercialized.

These are the most-read DIGITIMES Asia stories in the week of December 22 to December 29, 2025.

Memory maker Winbond Electronics has recently continued to expand capital expenditures by increasing capacity for 16nm and DDR4 DRAM. As inventories of legacy DDR3 products decrease, DDR4 will officially become Winbond's main product in the first half of 2026. The company's new 8Gb DDR4 products manufactured on its in-house 16nm process have recently passed customer qualification smoothly and are expected to enter mass production and shipment in the first to second quarters of 2026.

Samsung Electronics and SK Hynix are pushing forward their production schedules for sixth-generation high-bandwidth memory to February 2026. Industry sources and South Korean media reports confirm the accelerated timeline. The two companies aim to begin volume manufacturing of HBM4 months earlier than previously anticipated. The goal is to meet surging demand for artificial intelligence infrastructure. By accelerating their timelines, the South Korean chipmakers seek to solidify their dominance in the AI memory market before global competitors can scale similar technologies.

SK Hynix is scheduled to deliver final samples of its next-generation high-bandwidth memory to Nvidia in early January 2025. This comes as the South Korean chipmaker nears a February target for mass production of HBM4. The delivery follows a revised wafer run intended to resolve technical issues identified during earlier integration testing, according to DealSite. It marks a critical step in supporting Nvidia's next wave of artificial intelligence accelerators.

Google and Microsoft are stepping up efforts to secure high-bandwidth memory. Production capacity at South Korean chipmakers is approaching its limits. The supply crunch has coincided with executive dismissals and stalled negotiations. According to industry sources cited by the Seoul Economic Daily and G-enews, major cloud and artificial intelligence companies are intensifying procurement efforts. Samsung Electronics and SK Hynix are nearing full utilization of their advanced memory lines.

SoftBank and Japanese partners are advancing a government-backed project to develop next-generation memory technology aimed at enhancing AI and supercomputer performance. The initiative, involving RIKEN, Intel, the University of Tokyo, and Taiwan's Vanguard International Semiconductor (VIS), targets prototype completion by fiscal 2027 and mass production by fiscal 2029, Nikkei Asia reports.

YF Capital, the private equity firm founded by Jack Ma, has taken a stake in China's memory chip sector, renewing market focus on semiconductor investment trends. As the US tightens technology restrictions, domestically developed Chinese chips are increasingly seen as strategically critical, driving a rise in related investment activity.

South Korean prosecutors have charged ten individuals over an alleged large-scale leak of 10nm-class DRAM process technology from Samsung Electronics to China's leading memory maker ChangXin Memory Technologies (CXMT), a case authorities say directly enabled China's first mass production of advanced DRAM in 2023.

As the global memory market enters its sharpest price upswing in nearly five years, one top-tier PC maker has moved quickly to lock in supply, dispatching senior executives to negotiate directly with major memory producers, including Samsung Electronics, SK Hynix, and Micron Technology.

South Korean memory giants Samsung Electronics and SK Hynix have reportedly hiked prices for fifth-generation high-bandwidth memory by nearly 20% for 2026 deliveries, as soaring demand for artificial intelligence accelerators outstrips supply, according to industry sources. The price increase for HBM3E chips comes as manufacturers pivot production resources toward next-generation HBM4 technology, creating an unusual supply crunch for the current industry standard.

Taiwan's Ministry of Economic Affairs (MOEA) announced on December 23, 2025, that export orders from the US reached US$28.45 billion in November 2025, up 12.5% sequentially and 56.1% year-over-year. Orders for information and communications products, focused on artificial intelligence (AI) servers, rose by US$6.43 billion, marking a sharp year-over-year increase of 117.7%.

Memory giant Samsung Electronics is slowing its planned DDR4 DRAM production phase-out in the fourth quarter of 2025 amid surging market prices and tightening supply. Sources say Samsung will sign long-term non-cancellable, non-returnable (NCNR) contracts with select server customers starting the first quarter of 2026 to secure maximum profit from capacity allocation as DDR4 demand heats up.

The Office of the US Trade Representative (USTR) has concluded a year-long Section 301 investigation into China's acts, policies, and practices related to its semiconductor industry, determining that they are actionable under US trade law. The findings were published in a notice dated December 23, 2025, and are scheduled to appear in the Federal Register on December 29.

Two-dimensional (2D) materials were once regarded as important candidates for extending semiconductor scaling. Because they are only an atom thick, they are theoretically very suitable for fabricating extremely small, ultra-low-power transistors. However, once these ideas move into advanced logic processes, challenges begin to surface. The problem lies in the fact that using 2D materials to fabricate FETs requires process control that is nearly at the single-atom level.

Once a low-cost commodity underpinning global computing, dynamic random-access memory (DRAM) has become a strategic chokepoint as AI-driven demand reshapes supply chains. With prices rising and conventional scaling nearing its limits, Taiwanese researchers—backed by government funding—are racing to develop next-generation memory technologies that promise higher density, lower power consumption, and resilience in extreme environments.

ENE Technology said persistent shortages of DDR memory could weigh on revenue over the next two quarters, as tight supplies of DRAM and storage chips continue to pressure notebook and smartphone markets heading into 2026.

Silicon Optronics (SOI) highlighted at its recent earnings call that ongoing price hikes and shortages in consumer memory remain unresolved, potentially tightening wafer foundry supply for the company's lens module-related chips. The firm warned that since SoCs integrated with lenses require memory support, shortages in consumer memory could limit production volumes of mid- to low-end consumer applications due to high costs or material mismatches. Given that this segment is a core shipment market for SOI, the company said it will closely monitor developments.

Samsung Electronics has reportedly become the largest supplier of mobile DRAM for Apple's iPhone 17, a trend expected to continue with the upcoming iPhone 18. Industry analysts attribute this shift to SK Hynix and Micron recently focusing their production capacity on AI-targeted high-bandwidth memory (HBM), prompting Apple to rely more heavily on Samsung's ample general DRAM output to secure supply.

As privately owned rocket and satellite manufacturers in the United States continue to surge, China has been accelerating its own commercial space ambitions. Beyond its extensive low-Earth-orbit satellite deployment plans, the privately held Chinese launch company LandSpace Technology achieved a milestone on December 3, 2025, when its Zhuque-3 rocket completed a successful maiden flight.

Despite approaching the end of the year and the promotional peak season coming to an end, overall utilization rates in the smartphone panel market have remained relatively high. Additionally, differences in market conditions and structures among panel technologies have led to mixed price movements.

Samsung Electronics and SK Hynix are reportedly intensifying their competition to supply Nvidia's sixth-generation high-bandwidth memory (HBM), known as HBM4. The new HBM4 will be used in Nvidia's next-generation AI accelerator, Rubin, expected to launch in the second half of 2026.

These are the most-read DIGITIMES Asia stories in the week of December 15 to December 21, 2025.