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Tuesday 28 April 2026

Nanya breaks into Nvidia's AI memory ecosystem with LPDDR

Nvidia's next-generation AI platform Vera Rubin is approaching mass production, with a key architectural shift favoring low-power DRAM. Sources familiar with the matter say Nanya Technology has secured a supply chain position through LPDDR products, supported by an advanced packaging collaboration with TSMC. The move marks the first entry by a Taiwanese memory maker into Nvidia's AI server primary memory ecosystem.

Tuesday 28 April 2026

Macronix returns to profit in 1Q26, citing tighter supply and higher memory prices

Macronix's return to profitability in the first quarter of 2026 signals supply constraints and stronger memory pricing, with implications for global flash markets and customer supply chains. The Taiwan-based memory maker reported wider margins, robust NAND growth, and reduced inventories, suggesting that tighter industry supply and higher ASPs could significantly reshape pricing and sourcing worldwide.

Tuesday 28 April 2026

Samsung fast-tracks Pyeongtaek fabs to turn HBM4 edge into AI memory scale

Samsung is accelerating one of its most aggressive memory capacity buildouts in years, aiming to bring its Pyeongtaek Line 4 fab, or P4, into full operation by the end of 2026 as the AI server boom reshapes demand for high-bandwidth memory (HBM) and advanced DRAM.

Tuesday 28 April 2026

Wuhan unveils US$38 billion plan; YMTC and XMC lead memory expansion

China's central tech hub Wuhan has unveiled its 2026 major project plan, targeting 355 city-level projects with total investment exceeding CNY260 billion (approx. US$38.1 billion).

Tuesday 28 April 2026

AI lifts memory: SK Hynix hits 72% margin as Samsung nears 70%

SK Hynix reported record results for the first quarter of 2026, with operating margin reaching about 72% — among the highest globally — as artificial intelligence (AI)-driven demand lifted memory pricing, according to company disclosures and Korean media reports.

Monday 27 April 2026

Samsung reportedly breaks 10nm barrier with first single-digit nanometer DRAM working die

Samsung Electronics has reportedly become the first company in the world to develop a single-digit nanometer-class 10a DRAM working die, using the prototype to fine-tune process conditions to rapidly improve yield.

Monday 27 April 2026

Weekly news roundup: Micron's Sanand ramp shifts India chip debate; Qualcomm Chief reportedly seeks deals in South Korea

Below are the most-read DIGITIMES Asia stories from the week of April 20-27, 2026:

Monday 27 April 2026

NEO Semiconductor advances 3D DRAM with POC validation

Driven by AI, demand for high-bandwidth memory (HBM) is surging, causing a supply shortage in DRAM and prompting cloud service providers to pre-book capacity for the next two years. The rising need for larger HBM capacities is expected to grow exponentially, while 3D DRAM technology emerges as a solution to overcome current process scaling limits.

Sunday 26 April 2026

Samsung, Kingston reportedly lift SSD prices by over 10% as supply tightens

Samsung Electronics and Kingston Technology have reportedly notified distributors of price increases of more than 10% across their solid-state drive (SSD) product lines, according to IT Home, citing supply chain sources.

Sunday 26 April 2026

Samsung reportedly advances sub-10nm DRAM as SK Hynix targets HBM4E sampling

Samsung Electronics has reportedly produced a working die for sub-10nm DRAM, marking a potential breakthrough below the 10-nanometer threshold, according to The Elec. SK Hynix, meanwhile, is preparing to sample its next-generation high-bandwidth memory product as memory makers accelerate their product roadmaps.

Sunday 26 April 2026

Samsung bets its HBM leverage can hold Nvidia's LPU orders — but TSMC is pushing back

The AI era has officially shifted from training to inference and agent-centric computing, prompting Nvidia's strategic acquisition of Groq to integrate LPUs into its own platform. This move not only eliminates a strong competitor but also sparks a fierce battle between Samsung Electronics and TSMC over LPU foundry orders.

Friday 24 April 2026

Memory price surge reshapes global notebook competition in 2026

The global notebook market is undergoing a structural shift in competitive dynamics in 2026, moving from product specifications and pricing battles to group-level integrated capabilities as the core of competition. Memory supply chain control has emerged as a key indicator of brand competitiveness, directly impacting shipment volumes and operational performance.

Friday 24 April 2026

SK Hynix deepens TSMC ties with HBM4, advances memory-logic integration

SK Hynix showcased its latest high-bandwidth memory (HBM) technologies at TSMC's North America Technology Symposium 2026, highlighting closer collaboration with the foundry and outlining a strategy focused on integrating memory and logic.

Friday 24 April 2026

Samsung labor unions rally 40,000 workers, prepares for 18-day strike in May

Three major labor unions at Samsung Electronics held a large-scale protest on the afternoon of April 23 in front of the Pyeongtaek semiconductor campus in South Korea. An estimated 40,000 people participated, accounting for roughly one-third of the company's workforce, marking the largest collective action in Samsung's history.

Friday 24 April 2026

DIGITIMES Insight: SK Hynix's US HBM push sets up a showdown with Micron

SK Hynix Inc. has moved to deepen its presence in the US by building an HBM packaging and testing plant and planning a US stock exchange listing to raise capital — steps that could bolster local high-bandwidth memory supply and reshape competition with Micron Technology Inc.

Friday 24 April 2026

PC chipmakers warn CPU shortages cloud 2026 shipment outlook

CPU shortages in the PC sector have emerged as a new concern for shipments this year, in addition to ongoing memory supply issues. Industry players supplying PC peripheral chips observe that while current CPU shortages from x86 vendors like Intel and Advanced Micro Devices (AMD) have not yet severely impacted PC shipment forecasts, future trends remain uncertain.

Friday 24 April 2026

Interview: Taiwan-Korea cooperation not limited to memory giants; Hwaseong City aims to expand alliances

When it comes to Taiwan-Korea semiconductor cooperation, the outside world often focuses on orders and R&D between memory giants such as Samsung Electronics, SK Hynix, and TSMC. However, centered on Hwaseong City in Gyeonggi Province, South Korea, emphasizes that the potential of Taiwan-Korea cooperation goes far beyond this; both sides should establish more direct supply chain alliances at the SME level in equipment and components.

Thursday 23 April 2026

SaiMemory wins NEDO backing for next-generation ZAM memory, partners with Intel

SaiMemory, a next-generation memory developer established by SoftBank, said on April 22 that its development project has been selected for subsidies by Japan's New Energy and Industrial Technology Development Organization (NEDO), with the government expected to cover roughly half of the initial development costs.

Thursday 23 April 2026

Former Samsung Electronics researcher sentenced to 7-year prison term for leaking DRAM trade secrets

A former researcher at Samsung Electronics was sentenced to seven years in prison on April 22 by a South Korean court for leaking core semiconductor trade secrets to a Chinese competitor. The case highlights how chip-making technology is increasingly regarded by governments as a national security asset under strict protection.

Thursday 23 April 2026

SK Hynix to shift over half of NAND output to 321-layer chips

SK Hynix said it plans to expand production of its latest 321-layer NAND chips, as demand for AI applications leads to increased adoption of high-capacity enterprise storage.

Thursday 23 April 2026

SK Hynix dismisses peak fears, points to structural memory upcycle

SK Hynix said the current strength in memory pricing reflects structural changes in demand, pushing back against concerns that recent spot price weakness signals a market peak.

Thursday 23 April 2026

SK Hynix flags persistent HBM shortage as demand outpaces supply

SK Hynix said demand for high-bandwidth memory is expected to outpace supply for several years, underscoring persistent constraints in the AI memory market even as the company ramps up investment.

Thursday 23 April 2026

Samsung and SK Hynix race to upgrade China chip plants as NAND demand surges

As the artificial intelligence boom reshapes global computing demand, the memory chip industry is entering a new phase of strain and restructuring — one in which both DRAM and NAND flash are seeing rapidly tightening supply.

Thursday 23 April 2026

SK Hynix builds HBM packaging hub in Cheongju to expand AI memory capacity

SK Hynix has broken ground on a large-scale advanced packaging facility in Cheongju Technopolis, underscoring how the battleground for AI semiconductors is shifting beyond wafer fabrication to the back-end processes that increasingly define performance.

Thursday 23 April 2026

SK Hynix hits 72% operating margin in Q1, doubling profit quarter-on-quarter

SK Hynix reported its strongest quarterly results on record in the first quarter of 2026, with revenue of 52.58 trillion won (approximately US$37.9 billion), operating profit of 37.61 trillion won (approximately US$27.1 billion), and net profit of 40.35 trillion won (approximately US$29.1 billion).

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