China's Changxin Memory Technologies (CXMT) has reportedly adopted the 1z process for its 10nm-class DDR5 production, prompting heightened concern at Samsung Electronics, which is now closely monitoring the status of advanced DRAM production in China.

As Samsung Electronics gears up to release its fourth-quarter 2024 financial results, industry observers are closely monitoring the company's progress in meeting its high bandwidth memory (HBM) business targets for the year. However, according to recent reports from South Korean media, Samsung's HBM shipments for the quarter are projected to exceed 20 billion gigabytes (GB), significantly below the company's original goal of 30 billion GB.

GigaDevice, a Chinese manufacturer of NOR flash memory and MCUs, recently disclosed its performance forecast for 2024. The company projects a net profit jump of over fivefold.

SK Hynix is poised to achieve a record-high operating profit in 2024, potentially surpassing Samsung Electronics (Samsung) for the first time. The company maintains its optimistic outlook on the high bandwidth memory (HBM) market, with plans to secure its market leadership through HBM4 and HBM4E development.

With Donald Trump's recent inauguration as US president, South Korean experts expect tighter sanctions on China's semiconductor industry. In response, Samsung and SK Hynix are strategically restructuring their production to reduce reliance on Chinese manufacturing.

A newly released semiconductor patent innovation ranking places ChangXin Memory Technologies (CXMT), Yangtze Memory Technologies (YMTC), and Semiconductor Manufacturing International (SMIC) at the forefront, showcasing their technological advancement within China's semiconductor industry amid US trade restrictions.

Following the release of its financial results showcasing impressive performance, SK Hynix remains cautious about adjusting production levels due to the sluggish demand for NAND flash. However, the company has not announced any plans to cut its product output.

Samsung Electronics has officially denied recent reports suggesting plans to revise the design of its fifth-generation 10nm-class DRAM (1b DRAM), emphasizing that no such changes are underway.

SK Hynix posted record revenue of KRW66.2 trillion (US$46.3 billion) in 2024, with an operating profit of KRW23.5 trillion, yielding a 35% margin. Net income reached KRW19.8 trillion.

Micron is expanding its investment in Taiwan, with plans to exceed NT$1.1 trillion (US$33.6 billion) by the end of 2024. According to Donghui Lu, head of Micron Taiwan, the company will increase overall production capacity for HBM3E in 2025 while continuing the ramp-up of 1β process capacity. Additionally, the 1γ process, which marks the first implementation of EUV equipment, will enter mass production at the Taichung plant in 2025.

As Samsung Electronics (Samsung) attempts to reshape the global memory market through its sixth-generation high bandwidth memory (HBM4), industry watchers are closely monitoring two critical factors: the mass production and yield of the sixth-generation 1c DRAM, as well as internal confidence in its foundry processes. Currently, SK Hynix dominates the HBM market.

Backend house Powertech Technology (PTI) anticipates a resurgence in demand from the memory sector beginning in the second quarter, with further enhancement projected through the fourth quarter.

Samsung Electronics has denied reports about the redesign of its fifth-generation 10nm-class DRAM (1b DRAM), following media speculation about changes to the latest commercially available technology. Sources had suggested the company was planning to adjust the design to improve performance and yield.

Industry sources indicate that thermal issues associated with GB200 have prompted major clients including Microsoft, Amazon, Google, and Meta to reduce their orders, impacting not only Nvidia's product sales and revenue but also creating significant implications for its primary HBM supplier, SK Hynix.

Samsung Electronics has reportedly delayed the development of its 10nm sixth-generation 1c DRAM to June 2025. Initially slated for completion by late 2024, the timeline has been pushed back by six months due to ongoing yield challenges, potentially affecting mass production plans.

The memory industry experienced fluctuations in its performance in 2024. In the first half of 2024, the three largest international DRAM manufacturers were able to convert losses into profits. However, Taiwan-based memory companies are still facing significant competitive challenges, as revenue growth has not yet translated into improvements in profitability.

At CES 2025, Nvidia CEO Jensen Huang stated that Samsung Electronics (Samsung) must develop a "new design" to pass Nvidia's qualification, sparking discussions about whether Samsung can make a comeback with HBM3E in 2025. However, according to Chosun Biz, many industry insiders pointed out that if Samsung collaborates with Nvidia's competitor Broadcom, a different outcome may emerge.

New players are joining the supply chain competition as China's major memory chip manufacturers have rapidly developed. It seems to challenge the market positions of Samsung Electronics, SK Hynix, and Micron Technology.

The US government has unveiled new semiconductor export restrictions aimed at China, potentially disrupting ChangXin Memory Technologies (CXMT) while favoring Samsung Electronics, SK Hynix, and Micron Technology. Bernstein's analysis, cited by Seeking Alpha and Business Post, suggests these measures will bolster South Korean chipmakers' competitiveness.

Recently, South Korean testing equipment provider Nextin is reportedly in discussions to supply testing equipment to Japanese NAND Flash manufacturer Kioxia. If the negotiations work out, it is expected that Nextin will be able to supply 3D NAND wafer testing equipment to both SK Hynix and Kioxia, two of the largest NAND producers.

China will investigate allegations that the US dumps lower-end chips and unfairly subsidizes its own chipmakers, in potentially one of Beijing's strongest retaliatory moves against American technology sanctions. The government will look into the question of whether the US is giving its chipmakers an unfair advantage through incentives and grants, or illegally undercutting Chinese products, the Commerce Ministry said in a statement on January 16.

Leading NAND flash manufacturers have gradually cut output to stabilize market prices and prevent further declines, as they intend to uphold pricing even beyond the Lunar New Year break, according to industry sources.

The US has introduced new regulations to prevent advanced chips from reaching China. This move aims to tighten restrictions on its geopolitical rival, urging chip manufacturers like TSMC and Samsung Electronics to increase their oversight of customers, particularly Chinese companies.

The demand for industrial memory modules has gradually recovered in the second half of 2024. However, revenue performance in December varied significantly among companies.

In the fourth quarter of 2022, Kingston Technology's divestment from Panram International and subsequent board departure triggered market concerns, prompting Panram to initiate significant operational changes. The company's new strategy involves reducing its DRAM production capacity to below 50% and revenue contribution to approximately 30% while shifting focus toward module applications for system manufacturers and expanding into the automotive market.