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Monday 23 February 2026
Lenovo hits North American partners with price increases driven by memory shortage
Global memory supply shortages are forcing PC and server vendors to pass higher component costs on to customers, with Lenovo notifying North American partners of planned price adjustments on selected commercial client devices and server products from March 2026. Resellers were urged to order by February 25, 2026, and ensure delivery by February 28, 2026, to preserve current pricing.
Monday 23 February 2026
Samsung regains DRAM lead with 40% revenue jump in 4Q25, eyes HBM4 to strengthen edge
Samsung Electronics reclaimed the global DRAM market crown in 4Q25, just one year after losing it to SK Hynix. Industry watchers are closely monitoring whether Samsung can further solidify its leadership by being the first worldwide to mass-produce and ship sixth-generation high-bandwidth memory (HBM4).
Monday 23 February 2026
Kioxia sells out 2026 NAND capacity as AI demand tightens global memory supply
As the global memory market tightens under the weight of artificial intelligence (AI) demand, Japanese NAND flash maker Kioxia Holdings has emerged as one of the clearest beneficiaries of the current upcycle, with its 2026 production capacity already fully booked and supply constraints expected to persist into 2027, according to KST Components, an electronic component distributor.
Monday 23 February 2026
Weekly news roundup: memory impacts, AI infrastructure, and policy uncertainty
Below are the most-read DIGITIMES stories from the week of February 16-22, 2026.
Monday 23 February 2026
PSMC shifts beyond mature nodes to power next wave of AI memory innovation
Powerchip Semiconductor Manufacturing Corp. (PSMC) is emerging as a central manufacturing partner in a new initiative to develop next-generation AI memory, marking a strategic shift for the Taiwanese foundry from mature-node contract manufacturing toward advanced 3D integration for artificial intelligence infrastructure.
Monday 23 February 2026
Jensen Huang's missed India summit and Valentine's dinner in Korea spotlight Nvidia's shifting priorities
Nvidia CEO Jensen Huang's absence from India's AI Impact Summit and his appearance at a late-night engineer gathering in California have drawn attention to the chipmaker's strategic priorities amid intensifying competition over next-generation memory and artificial intelligence hardware.
Friday 20 February 2026
SK Group chairman Chey meets US tech leaders to secure core AI chip supply chain
SK Group Chairman Chey Tae-won recently traveled to the US for a series of high-level meetings with CEOs from Nvidia, Broadcom, Microsoft, Meta, and Google. The strategic focus extends beyond expanding high-bandwidth memory (HBM) sales; it aims for a head start in the design phase collaboration for next-generation AI chips, aiming to capture key leadership in future AI accelerator architectures.
Thursday 19 February 2026
MediaTek CEO at ISSCC: solo chip era is over, system-level efficiency is the next frontier
The rules of winning in AI are changing, and one of the semiconductor industry's most prominent executives is calling time on the old playbook.
Thursday 19 February 2026
DIGITIMES Insight: US tariff-credit design could pressure Korean memory makers to localize production
A proposed US tariff and duty-exemption framework could force Korean memory suppliers to accelerate US fab investments or risk losing AI server market share, according to DIGITIMES analyst Luke Lin, speaking on a DIGITIMES podcast.
Wednesday 18 February 2026
Micron expands capacity to counter worst memory supply shortage in 40 years

Micron Technology is accelerating capacity expansion in response to what executives describe as the most severe memory supply shortage in more than 40 years, driven by surging demand for AI infrastructure.

Wednesday 18 February 2026
Samsung advances LPDDR5X-PIM, signaling memory's new role in AI computing

Artificial intelligence is shifting the center of gravity in semiconductors. For decades, processors defined performance. Now memory bandwidth, capacity and energy efficiency increasingly determine how much of a GPU's power can actually be used.

Tuesday 17 February 2026
Global memory chip shortage reportedly forces Sony PlayStation and other tech launches to delay
A global shortage of memory chips is beginning to reshape product launch timelines across the tech industry, impacting everything from smartphones and laptops to gaming consoles and data center hardware, according to Bloomberg and other reports.
Tuesday 17 February 2026
Pentagon's brief blacklist reversal could ease US OEM access to Chinese memory suppliers, complicating Trump-Xi summit dynamics
Pentagon's brief blacklist reversal could ease US OEM access to Chinese memory suppliers, complicating Trump-Xi summit dynamicsWith President Donald Trump set to visit China in just over a month, the US Department of War's recent listing and rapid retraction of several Chinese firms has intensified tensions and exposed internal contradictions within the administration.
Tuesday 17 February 2026
Samsung accelerates HBM hybrid bonding line to meet Nvidia demand
Samsung Electronics is reportedly accelerating preparations for next-generation high-bandwidth memory (HBM), moving to establish a hybrid bonding production line at its Cheonan campus in South Korea to support the higher stacking transition to high-bandwidth memory 4 (HBM4) and next-generation high-bandwidth memory 5 (HBM5).
Monday 16 February 2026
RAMmageddon? AI-driven memory shortage sends DRAM prices 'parabolic'

The global memory industry is facing its most severe supply crunch in more than a decade. DRAM and NAND prices are rising at record speed, while high-bandwidth memory capacity is increasingly absorbed by artificial intelligence data centers.

Monday 16 February 2026
Pentagon withdraws 1260H list adding Alibaba, BYD and Baidu, removing YMTC and CXMT

The Pentagon briefly published an updated list of Chinese companies alleged to have ties to the People’s Liberation Army, then withdrew it within an hour. The episode highlights Washington’s attempt to ease trade tensions with Beijing while maintaining pressure on technology and national security ahead of an expected April meeting between President Donald Trump and Xi Jinping.

Monday 16 February 2026
Apple reportedly agrees to double NAND prices from Kioxia, shifts to quarterly contract pricing

Apple has reportedly agreed to double the unit price it pays for NAND flash from Japan's Kioxia starting in the January–March quarter, with supply contracts moving to quarterly price adjustments linked to market conditions.

Sunday 15 February 2026
Taiwan's January exports jump nearly 70% on AI server boom, boosting 2026 growth optimism and tech defense push
Taiwan's export value in January 2026 surged 69.9% year-on-year, surpassing the NT$2 trillion (US$63.7 billion) mark for the first time, largely due to differences in the number of working days between the Lunar New Year periods in 2025 and 2026. Strong shipments of AI servers and high-performance chips have prompted foreign banks to forecast Taiwan's GDP growth could reach 8.0% in 2026. If realized, this would mark a second consecutive year of above-8% expansion, following 2025's 8.63% growth.
Sunday 15 February 2026
CXMT races to scale up as yield gaps and export curbs bite
CXMT, a leading Chinese DRAM maker, is expanding aggressively but faces significant production and regulatory hurdles, ChosunBiz reported, citing industry sources. Despite rising global memory demand, the company's wafer output has hit capacity limits, with yield issues and US export restrictions constraining further growth.
Saturday 14 February 2026
Nvidia deepens South Korea ties in smart factory push
Nvidia outlined its role in advancing two major manufacturing trends—AI Factory and Physical AI—at SEMICON Korea 2026, emphasizing that it views South Korea as an important strategic outpost for collaboration as the country accelerates AI-driven industrial transformation.
Saturday 14 February 2026
HBM steals the show at SEMICON Korea despite Samsung, SK Hynix skipping the floor
Artificial intelligence-driven growth in the semiconductor industry has drawn increasing public attention. SEMICON Korea, organized by SEMI, continues to expand in scale. The 2026 exhibition featured 550 participating companies and more than 2,400 booths, with pre-registered attendance reaching 75,000.
Friday 13 February 2026
Citi flags post-HBM shift as edge memory, HBF advance
A Citi analyst said the next phase of artificial intelligence (AI) memory demand will extend beyond high-bandwidth memory (HBM), pointing to emerging opportunities in physical AI devices and high-capacity flash architectures.
Friday 13 February 2026
TSMC and memory makers boost capex to offset China export restrictions impact
TSMC raised its 2026 capital expenditure forecast to US$52-56 billion, driving strong demand in the global semiconductor supply chain amid AI growth. Memory giants SK Hynix, Micron, Nanya Technology, and Winbond also expanded capacity plans.
Friday 13 February 2026
SK Hynix reportedly begins equipment orders for Cheongju HBM packaging line amid AI-driven capacity race
SK Hynix has started placing initial equipment orders to convert an idle Cheongju fab into a high-bandwidth memory (HBM) packaging and testing line, according to ET News, citing sources.
Friday 13 February 2026
SEMICON Korea: Samsung pushes hybrid bonding HBM, SK Hynix bets on platform AI
SEMICON Korea 2026, held in Seoul from February 11–13, brought senior executives from Samsung Electronics and SK Hynix to outline their AI-era memory R&D strategies. Samsung focused on cross-domain semiconductor integration to address bandwidth and energy-efficiency limits, while SK Hynix detailed a platform-based and AI-driven approach to compress development cycles.