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Wednesday 25 March 2026
Micron's Singapore expansion could trigger global transformer shortage and delay AI data centers
Micron Technology's planned Singapore expansion, driven by soaring AI memory demand, requires hundreds of transformers, signaling supply constraints that could affect global AI and semiconductor infrastructure timelines and costs for data-center buildouts, energy storage projects, and heavy electrical equipment suppliers, potentially reshaping procurement and construction schedules worldwide and logistics planning.
Wednesday 25 March 2026
Xiaomi flags memory pressure, sees Apple user conversions, and pushes embodied AI strategy
Xiaomi executives outlined the group's 2025 performance and strategic priorities during an investor earnings call and webcast on March 24. Management highlighted record annual revenue and adjusted net profit, then devoted much of the presentation to artificial intelligence (AI), embodied intelligence (physical AI), and progress in the company's electric vehicle (EV) business. The call opened with standard operator instructions and procedural remarks from investor relations, followed by prepared remarks from Xiaomi president Lu Weibing and CFO Alain Lam Sai Wai, who fielded investor questions.
Wednesday 25 March 2026
SK Hynix files for potential US listing and ramps EUV investment as AI demand accelerates
SK Hynix said it has confidentially submitted a registration statement to the US Securities and Exchange Commission for a potential listing of American depositary shares, as part of a broader push to tap global capital markets.
Wednesday 25 March 2026
SK Hynix sets sights on US ADR listing to strengthen capital base
SK Hynix is reportedly set to issue new shares and list American Depositary Receipts (ADRs) on the US market. Industry analysts say the company aims to use the proceeds to expand production capacity for advanced memory products such as high-bandwidth memory (HBM), further cementing its leadership in the global AI semiconductor sector.
Wednesday 25 March 2026
SoftBank-backed SAIMEMORY plans post-HBM shift with vertical memory tech
SAIMEMORY, a Japanese startup backed by SoftBank, is positioning its proprietary Z-Angle Memory (ZAM) as a potential successor to high-bandwidth memory (HBM) as physical limits begin to constrain current AI architectures, according to Nikkei and PC Watch.
Wednesday 25 March 2026
Team Group posts 50x profit surge in January; annual procurement impact seen in 2Q26
Memory module maker Team Group reported a record-high monthly profit for January 2026, with earnings soaring over 50 times year-over-year. Although shipments declined in February due to the Lunar New Year holidays, the company expects a full recovery of shipment momentum over March. Annual procurement strategies and specification adjustments among system integrator (SI), edge computing, and OEM customers for high-end memory products are anticipated to drive sales in the second quarter of 2026.
Tuesday 24 March 2026
Hanwha Semitech's SK Hynix TCB deal draws scrutiny over KRW100 billion guarantee
Hanwha Semitech's supply of thermal compression bonding (TCB) equipment for high-bandwidth memory (HBM) to SK Hynix is drawing scrutiny after the South Korean equipment maker maintained a KRW100 billion (US$66.7 million) performance guarantee since early 2025, raising questions about whether its equipment has fully met the chipmaker's requirements.
Tuesday 24 March 2026
SK Hynix reportedly advances M15X ramp, opens second cleanroom ahead of schedule

SK Hynix has brought forward the ramp-up of its M15X DRAM facility in Cheongju, opening a second cleanroom and beginning equipment move-in about two months ahead of schedule amid rising demand for memory tied to artificial intelligence (AI), according to East Asia Daily.

Monday 23 March 2026
Samsung reportedly in talks with Google, Microsoft on long-term memory supply agreements

Samsung Electronics is reportedly in discussions with Google and Microsoft to establish long-term memory semiconductor supply agreements, in what could become the first binding contracts of their kind in the memory industry, according to Korean media reports.

Monday 23 March 2026
Zenitron warns memory shortages will reverberate across global tech supply chains
Zenitron president YY Chou warned that surging demand for AI servers, data centers, and robotics is driving memory shortages that will affect global supply chains and pricing, with gradual market balance expected over two years, influencing hardware costs and capacity planning for international technology companies and data center operators worldwide.
Monday 23 March 2026
Tescan integrates Seoul demo lab to speed testing for AI memory and advanced packaging customers
Tescan's expansion of its Seoul site integrates a Demo Lab with office space to better serve semiconductor clients amid global AI-driven memory demand, promising faster failure analysis and reliability testing for advanced packaging customers worldwide and reducing testing wait times for partners pursuing heterogeneous integration and chiplet technologies.
Monday 23 March 2026
Memory supply squeeze dents IPC profits
The semiconductor market's supply-demand imbalance is affecting more than consumer gadgets, with industrial PC (IPC) makers reporting component shortages and price hikes that dented profitability in the fourth quarter of 2025 and could ripple into 2026, raising risks of order delays and strained supply stability for industrial customers worldwide.
Monday 23 March 2026
SK Hynix plans TSMC 3nm adoption for HBM4E edge over Samsung
SK Hynix is reportedly evaluating the use of Taiwan Semiconductor Manufacturing Company's (TSMC) 3-nanometer process for producing the logic die in its seventh-generation high-bandwidth memory (HBM4E).
Monday 23 March 2026
An imminent strike looms over Samsung's AI memory supply
Samsung Electronics is facing escalating labor tensions after its largest union secured approval for a strike, raising concerns over potential disruptions to semiconductor production at a critical juncture for the global AI supply chain, according to Korean media reports, including SEDaily and Chosun Ilbo.
Monday 23 March 2026
Weekly news roundup: geopolitics, AI memory, racing for semiconductor control
Below are the most-read DIGITIMES Asia stories from the week of March 16-22, 2026:
Monday 23 March 2026
Can Elon Musk's Terafab turn chip independence into reality—or is it too ambitious to succeed?
Elon Musk has unveiled one of his most ambitious industrial visions yet: a "Terafab" that would allow Tesla and SpaceX to design and manufacture their own semiconductors for artificial intelligence, robotics, and even space-based data centers. While the project reflects Musk's sweeping vision of a vertically integrated, AI-driven future, analysts and industry realities suggest the plan may face formidable technical, financial, and structural obstacles.
Monday 23 March 2026
Netronix expects momentum from color e-readers, displays, and subsidiaries to carry into 2026
Netronix said it expects revenue and profits to continue to climb into 2026 after peaking in 2025, driven by e-book readers, digital advertising displays, and contributions from subsidiaries. The company forecast continued shipment growth and double-digit revenue gains next year.
Monday 23 March 2026
At Cheonan, Samsung is rewriting HBM's bonding playbook
Samsung Electronics is accelerating the expansion of its high-bandwidth memory (HBM) backend capacity at its Cheonan campus while preparing a transition to next-generation bonding technologies, as competition shifts from chip performance to packaging capabilities, according to NewDaily.
Sunday 22 March 2026
Samsung union votes to strike, risking Nvidia HBM4 supply disruption
Samsung Electronics' labor union has voted overwhelmingly to initiate dispute proceedings following a breakdown in wage negotiations, raising concerns over potential disruptions to the supply of HBM4 memory for Nvidia's next-generation AI accelerators.
Saturday 21 March 2026
SK Hynix targets autonomous fabs by 2030 to tackle AI-driven manufacturing challenges
SK Hynix is targeting the development of autonomous semiconductor fabrication facilities by 2030 as it seeks to address rising AI-driven demand and increasing manufacturing complexity, according to Ddaily, IT Chosun, and SEDaily.
Friday 20 March 2026
Memory price surge drives Transcend's 15x profit growth in January 2026
Memory module maker Transcend reported a remarkable profit increase for January 2026, with net income reaching NT$2.786 billion (approx. US$87.2 million), up 1578% year-over-year. Its earnings per share (EPS) hit NT$6.49, also rising 1578%, already achieving 50% of its full-year 2025 EPS of NT$12.98.
Friday 20 March 2026
Samsung plans over KRW110 trillion investment in AI semiconductor facilities and R&D for 2026
Samsung Electronics announced it will invest more than KRW110 trillion (approx. US$73.4 billion) in facilities and R&D by 2026 to secure a leading position in the AI semiconductor era. This marks the first time its annual investment surpasses the "KRW100 trillion" threshold.
Friday 20 March 2026
As NAND makers move on, MLC memory nears the end of the line

As global NAND flash makers shift toward higher-layer 3D architectures, legacy MLC NAND is slipping into a severe supply-demand imbalance and edging toward obsolescence.

Friday 20 March 2026
Samsung signals AI memory shift with HBM showcase at 2026 shareholders meeting
Samsung Electronics held its 57th annual shareholders meeting on March 18 in Suwon, South Korea, where it unveiled advanced memory products, including high-bandwidth memory (HBM), signaling a strategic push to strengthen its semiconductor competitiveness.
Friday 20 March 2026
AI tailwinds and global reach put Topco on track for double-digit growth in 2026
Driven by AI applications boosting advanced processes, HBM, and packaging technologies, demand for key materials like silicon wafers and photoresists has surged. Topco Scientific (TSC) has announced plans to focus on high-growth sectors such as AI, automotive, and data centers in 2026, targeting sustained double-digit growth.