The annual "360°MOBILITY Mega Shows," a major gathering for the auto parts and mobility industry, opens on the 14th, drawing heightened attention to the growing role of Taiwan's suppliers in next-generation automotive technology. As software-defined vehicles (SDVs) emerge as a central industry direction, the share of automotive semiconductors and software in vehicle development is rising rapidly, according to a DIGITIMES Research report.
The passive components sector is emerging from its inventory slump, with Yageo and Walsin Technology flagging a pickup in both commodity and high-end components, driven by AI servers and automotive electronics.
Japan's Yaskawa Electric is pointing to a turning point in its earnings trajectory, with AI-driven robotics and semiconductor equipment demand converging to lift orders, margins, and outlook.
Taiwan's semiconductor supply chain posted stronger-than-expected results in the first quarter of 2026, as artificial intelligence (AI) demand accelerated the adoption of advanced nodes and advanced packaging, lifting both foundries and equipment suppliers.
BenQ Materials is expanding into semiconductor materials, with president Ray Liu saying the company has entered CMP cleaning brush rollers and begun shipments to wafer fabs. It is also developing wafer grinding tapes and UV debonding tapes, which are currently under customer validation and could begin shipping as early as the end of 2026.
As global corporations accelerate spending on artificial intelligence (AI) infrastructure, supply constraints are no longer limited to memory chips. Signs of tightening availability are now emerging in multi-layer ceramic capacitors (MLCCs), small but essential components used across a vast range of electronic systems. Lead times for these parts are lengthening across the industry, according to market data.
Looking ahead, Taiwan's printed circuit board giant Zhen Ding Technology expects a strong growth trajectory beginning in the second quarter, as clients ramp up production on next-generation platforms. The company projects that momentum in its server and optical communications businesses will expand quarter by quarter, while its IC substrate segment is set to benefit from robust AI computing demand, driving sequential growth. Zhen Ding anticipates entering a new phase of accelerated expansion in 2026.
Prices for gallium arsenide (GaA) substrates — a key material used in power amplifiers for wireless communications — are rising, driven by surging costs for gallium, a critical upstream metal. After months of sustained increases in raw material prices, industry executives say a reversal appears unlikely.
Samsung and SK Hynix delivered record performance in 2025, driven by strong investment in AI infrastructure. Yet the gains have not flowed upstream. Materials and component suppliers are facing a second consecutive year of price cuts, with contract terms for 2026 again revised lower.
