The shift toward 800V high-voltage direct current (HVDC) power architectures in AI data centers is driving a surge in demand for power semiconductors, boosting shipments for Taiwanese lead frame suppliers SDI Corporation and Jih Lin Technology and raising expectations for double-digit revenue growth in 2026.

Samsung Electro-Mechanics is emerging as another beneficiary of the AI data center buildout, as demand for high-end capacitors and package substrates pushes parts of its component business closer to full capacity.

Panjit International Inc. is accelerating its expansion into AI and automotive electronics as the Taiwanese power semiconductor maker positions itself for a new growth cycle after four decades in the discrete device market.

Alliance Material Co. (AMC), a Taiwan-based advanced semiconductor materials supplier, said its balance film anti-warpage material has entered customer validation and is expected to begin mass production in the second half of 2026, as AI chip demand drives a new wave of advanced packaging expansion.

BOE Technology, China's leading display panel maker, is expanding its push into new businesses beyond panels. The company said on the evening of May 20 that it had signed a three-year memorandum of understanding with US glass materials supplier Corning to cooperate in glass-based packaging substrates, foldable glass, perovskite glass substrates and optical interconnects.

China's OSAT providers are trying to move deeper into advanced packaging as artificial intelligence (AI) demand strains global chip packaging supply, creating an opening for companies that have long played a lower-profile role in the semiconductor value chain.