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Thursday 11 June 2026

Largan's CPO play hinges on sub-0.3-micron precision, not perfect parts

Largan Precision is accelerating its push into CPO-related optical components, with chairman Adam Lin revealing that the company is building its first automated pilot line at a new Taiwan facility, scheduled to be ready before September 2026.

Thursday 11 June 2026

Exclusive: Astera Labs sees switch chips becoming biggest revenue driver by end of 2026

Astera Labs expects its Scorpio switch-chip business to become its largest revenue contributor by the end of 2026, marking a shift for the cloud AI connectivity chip supplier as demand grows for scale-up infrastructure in AI clusters.

Thursday 11 June 2026

How an alliance of Taiwanese chip suppliers cracked Intel's supply chain with a FOUP solution

TSS Semiconductor Alliance, a group of 18 small and medium-sized Taiwanese suppliers of semiconductor materials, components and equipment, is preparing to form a third cohort as members seek to expand their role in global chip supply chains.

Thursday 11 June 2026

Apacer targets industrial memory demand as DDR4 shortages drive profits through 2027

Memory supply remains tight, and higher prices have made end markets cautious. Despite that, Apacer Technology CEO Chia-Kun Chang said that foundry shifts by the three major makers are irreversible, meaning DRAM and flash will stay in short supply, and the memory industry will continue to profit at least throughout the first half of 2027.

Wednesday 10 June 2026

Aker to expand capacity by 20% as auto demand drives growth

Aker Technology plans to expand capacity by 20% in 2026 as automotive demand grows and the quartz component supplier pushes further into AI servers, optical modules, and industrial control applications.

Wednesday 10 June 2026

Chang Wah says semiconductor inventory correction has ended, sees 2026 sales growth

Chang Wah Technology has declared that the global semiconductor inventory correction has ended, with demand recovering in industrial control, networking, and AI data center power management. The shift signals firmer supply-chain conditions, rising leadframe demand, and broader pressure on packaging capacity across Asia — factors with direct implications for global electronics buyers and investors.

Wednesday 10 June 2026

HVLP4 copper foil battle heats up as Nvidia courts Co-Tech

Co-Tech said on June 8, 2026, that Nvidia has directly approached it to discuss long-term capacity planning for high-end HVLP4 copper foil, as AI GPU and ASIC demand accelerates and a structural supply bottleneck looms in 2026. Chairman Frank Lee said the market could face a 15–25% supply shortfall in 2026, setting up a two-to-three year upcycle in prices.

Wednesday 10 June 2026

Largan targets CPO multilayer stacking with first FAU pilot line

Lens maker Largan Precision held its shareholders' meeting on June 9, where chairman Adam Lin, long known for his terse public remarks, appeared relaxed and offered unusually detailed views on the industry, technology, and Largan's own operations. His comments showed clear optimism toward the company's development of fiber array units (FAUs).

Wednesday 10 June 2026

GEM Terminals cites AI-driven demand as May 2026 copper sales jump 72%

GEM Terminals reported consolidated revenue of about NT$428 million (US$13.6 million) in May 2026, up 71.83% year-over-year from NT$249 million, saying expanding global investment in AI infrastructure drove a surge in demand for specialty copper materials used in cooling applications. The firm linked the month's performance to rising cooling needs at servers and data centers as computing density increased, and described the result as evidence of strong long-term momentum for its materials transformation strategy.

Wednesday 10 June 2026

Posiflex sees orders through 3Q26, shuns price war

Posiflex said order visibility for the second and third quarters of 2026 remains relatively clear, though the industrial PC and POS hardware supplier is taking a cautious view of the fourth quarter as component supply, geopolitical risks, and broader market conditions remain uncertain.

Wednesday 10 June 2026

AI use in PCB manufacturing has gone mainstream, but scaling remains lagging

AI adoption in PCB manufacturing is now widespread, yet fewer than 10% of companies have fully scaled deployments, underscoring a global gap between experimentation and factory-wide integration. For readers worldwide, the findings point to a sector where quality gains are real, but talent, data, and governance constraints are slowing broader industrial change.

Tuesday 9 June 2026

Topco monthly sales hit third-highest level on chip materials demand

Topco Scientific said strong demand from artificial intelligence and high-performance computing drove higher shipments of advanced-process materials, lifting consolidated revenue in May to NT$6.54 billion, up 18.6% year over year and the third-highest monthly level on record. For the first five months of 2026, consolidated revenue reached NT$31.85 billion, up 17.6% year over year, as semiconductor materials sales posted double-digit growth.

Tuesday 9 June 2026

Yesiang begins shipping recycled filters as 2nm demand lifts AMC market

Taiwan's Yesiang has started volume shipments of a newly certified recycled advanced micro-contamination (AMC) filter as semiconductor makers push deeper into 2nm and smaller nodes. The development could matter globally because tighter contamination control is becoming a critical yield factor for advanced chips, while cleaner manufacturing also aligns with lower-waste sourcing trends.

Tuesday 9 June 2026

Panasonic raises SP-Cap prices as AI drives passive component demand

Passive component prices are staying elevated as AI continues to drive demand, with industry sources saying pricing in 2026 will remain at high levels. Panasonic is set to launch a new round of price increases in July, mainly for its SP-Cap capacitor products, with hikes ranging from 5% to 30% depending on the specification.

Tuesday 9 June 2026

AI supply chain shortages shift from chips to equipment

As four major North American CSPs step up AI infrastructure spending, global semiconductor output forecasts keep rising. But the AI demand surge is also exposing hidden supply-chain bottlenecks, with industry watchers saying the number of components that are currently in a severe shortage now far exceeds those that are not.

Tuesday 9 June 2026

HiSilicon chip price hikes put China's AI compute supply chain back in focus

Huawei's chip design arm HiSilicon Technologies has reportedly raised prices for some products, drawing market attention as China's semiconductor sector shows signs of recovery after a prolonged downturn.

Tuesday 9 June 2026

LG Innotek expands Vietnam substrate plant as AI servers strain RF-SiP supply

LG Innotek is expanding semiconductor substrate production in Vietnam as rising demand for server components reshapes capacity across the substrate industry, fueling expectations that supply of RF-SiP substrates used in premium smartphones could tighten.

Monday 8 June 2026

Murata launches smaller MLCC for electric and automated vehicles

Murata Manufacturing said it has begun mass production of a new automotive capacitor designed to help automakers cope with shrinking circuit-board space as electrification, advanced driver-assistance systems, and autonomous driving expand worldwide. The part targets rising 48V vehicle systems, higher power demand, and tighter packaging needs across global automotive electronics markets.

Monday 8 June 2026

CWTC's May revenue hits record high as new plant targets late 2026 launch

Lead frame manufacturer Chang Wah Technology Co. (CWTC) says that as applications such as data centers, AI servers, and industrial control systems continue to grow rapidly, market demand for power management components is steadily increasing, driving growth in lead frame shipments. Demand for microcontrollers (MCUs) used in PCs, networking equipment, industrial control systems, and electric vehicles has recovered, boosting orders for QFP lead frame products. This has kept CWTC's overall capacity utilization at a high level and contributed to revenue growth.

Sunday 7 June 2026

BOE says glass-based packaging substrate pilot line has yet to reach mass-production yield

BOE Technology Group's push into glass-based packaging substrates remains short of mass production, even as the Chinese display maker expands into new materials and advanced display technologies to build growth beyond conventional panels.

Friday 5 June 2026

AI servers and MLCC recovery drive growth at Ample Electronic

As artificial intelligence fuels demand across the electronics supply chain, Taiwanese conductive paste supplier Ample Electronic is seeing a rebound in one of the industry's most overlooked segments: passive components.

Friday 5 June 2026

AI demand strains PCB supply chains, lead times stretch past 20 weeks

Explosive demand for artificial intelligence is widening supply chain bottlenecks for global electronics makers, with shortages now reaching from advanced chips and packaging into printed circuit boards, memory, and passive components. Longer lead times and rising prices are adding uncertainty for data center, optical module, and equipment buyers worldwide.

Friday 5 June 2026

US targets China's PCB grip as AI and defense supply risks mount

As demand for artificial intelligence (AI) computing expands rapidly, market attention has long centered on GPUs, high-bandwidth memory (HBM), and advanced packaging. However, printed circuit boards (PCBs), which sit beneath chips and connect critical electronics, are increasingly being viewed by the US government and defense sector as a supply chain risk.

Friday 5 June 2026

India faces PCB supply squeeze as raw material shocks, AI demand, and import dependence drive costs higher

India's PCB industry is facing mounting supply constraints and cost pressures, driven by a combination of raw material inflation, logistics disruptions, and a structural reliance on imports, according to industry associations cited by The Economic Times, as well as additional media and policy reporting.

Friday 5 June 2026

Arm says Taiwan powers its rise as agentic AI lifts PC growth

Arm CEO Rene Haas told the COMPUTEX keynote on June 2 that Taiwan has been inseparable from Arm's growth over the past 30 years, while Nvidia CEO Jensen Huang said that agentic AI will trigger the biggest PC industry transformation in 40 years and could expand the global PC market by 10 times.

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