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Friday 7 August 2026
VisEra Technologies sees stronger 2H26 on recovering demand across three end markets
TSMC-affiliated optical sensing chipmaker VisEra Technologies said at its earnings conference on August 6 that business momentum rebounded significantly in the second quarter of 2026, driven by stable shipments of smartphone CMOS image sensors (CIS).
Friday 7 August 2026
Zhen Ding Tech hits July revenue record on AI and consumer electronics demand

Zhen Ding Tech (ZDT) said July revenue reached its highest level so far in 2026, supported by strong momentum across mobile communications, servers, optical modules and IC substrates. Its mobile communications business maintained double-digit year-on-year growth, while combined revenue from servers, optical modules and IC substrates sustained triple-digit growth, accelerated from the previous month and reached another monthly record. The gains were mainly driven by customers moving high-end AI products into adoption and mass production as planned, lifting ZDT's related shipments.

Friday 7 August 2026
South Korea welcomes Trump polysilicon rules as boost to non-China suppliers
US President Donald Trump's new import rules on polysilicon, ingots, wafers, and solar products could ripple through global clean energy and semiconductor markets, affecting pricing, sourcing, and investment decisions far beyond the US. South Korean producers welcomed the measure, while analysts said it targets low-cost Chinese supply and could reshape competition.
Friday 7 August 2026
Nokia's NXP Arizona fab buy signals AI optical bottleneck shifting upstream

Nokia is moving deeper into semiconductor manufacturing by acquiring NXP's Chandler fabrication campus in Arizona, signaling that the AI infrastructure race is expanding beyond GPUs and memory into the optical components needed to connect increasingly dense data-center clusters.

Friday 7 August 2026
China's MLCC supply chain ramps up as AI boom drives global component shortage

China's multilayer ceramic capacitor (MLCC) supply chain is accelerating capacity expansion as surging demand from AI servers and automotive electronics fuels one of the industry's strongest growth cycles, with domestic materials suppliers moving quickly to capture opportunities created by tightening global supply.

Thursday 6 August 2026
Ample Electronic posts record July sales as MLCC demand strengthens

Ample Electronic, a supplier of conductive paste materials for passive components, said strong artificial intelligence demand has helped drive a hot multilayer ceramic capacitor market and pushed customer orders higher. The Taiwan-based company reported July consolidated revenue of NT$269 million(US$8.33 million), a record high, while earnings per share for the second quarter of 2025 also reached a quarterly peak as downstream demand accelerated.

Thursday 6 August 2026
SpaceX losses don't shake confidence as Taiwan suppliers double down on long-term opportunities
SpaceX's first earnings report since going public showed that second-quarter 2026 revenue surged 92% year-over-year to US$7.81 billion, while the company still posted a net loss of US$541 million.
Thursday 6 August 2026
US polysilicon tariff exposes chip security's solar dependence

The Trump administration is preparing to impose a 15% tariff and minimum import prices on polysilicon and selected derivative products, placing an upstream material shared by solar panels and semiconductor chips at the center of efforts to reduce US exposure to Chinese supply.

Thursday 6 August 2026
Exclusive: Musk pushes US solar supply chain upstream as polysilicon ambitions emerge
Elon Musk is accelerating plans to establish a fully integrated US solar manufacturing ecosystem through Tesla and SpaceX, with a combined long-term capacity target of 200 GW. His strategy now extends from solar cells and modules into crystal growth and wafer production, while industry reports suggest the effort could eventually reach upstream polysilicon manufacturing.
Thursday 6 August 2026
Taiyo Yuden's AI server exposure is starting to reshape its earnings outlook
Taiyo Yuden has lifted its full-year outlook after a stronger first quarter, as demand from AI servers and related IT infrastructure increasingly drives sales of higher-end capacitors. The Japanese passive component maker returned to profit in the quarter ended June 30 and said a weaker yen, higher volumes, and stronger demand for high-reliability products are improving the outlook for the year.
Thursday 6 August 2026
Nanya Technology raises 2026 capex 34% to accelerate Fab 5A build-out
Nanya Technology's board of directors approved several resolutions on August 5, including a plan to accelerate capacity build-out at its new Fab 5A by raising its 2026 capital expenditure to no more than NT$69.7 billion (approx. US$2.16 billion) from the earlier estimate of NT$52 billion, a roughly 34% increase. The board also approved participation in the bidding process for a testing facility to expand backend packaging and testing capacity.
Thursday 6 August 2026
SpaceX earnings strengthen Win Semiconductors' outlook for satellite-driven GaN demand

SpaceX's first quarterly earnings release has offered fresh evidence that Starlink's expansion is moving beyond subscriber growth and into a more hardware-intensive phase, strengthening expectations that next-generation satellite networks and direct-to-device services will raise demand for higher-power radio-frequency components.

Thursday 6 August 2026
Machvision July revenue hits record as AI and PCB demand strengthens
Machvision reported consolidated revenue of about NT$359 million (US$11.1 million) in July 2026, a record monthly high that was up 1.28% from June and 31.84% from a year earlier. The Taiwan-based inspection equipment maker said order visibility remained healthy, with some high-end products already booked several quarters ahead as demand ran stronger than in 2025.
Thursday 6 August 2026
FOPLP leads production as CoPoS advances glass packaging
AI chip computing power is rising rapidly, pushing advanced packaging toward larger form factors, higher bandwidth, and greater integration. Traditional Ajinomoto build-up film (ABF) substrates and silicon interposers are increasingly hitting bottlenecks in cost, warpage, and packaging efficiency, making glass substrates and glass interposers a key focus in next-generation advanced packaging plans.
Wednesday 5 August 2026
AI chip demand revives co-investment deals as ABF substrate capacity fills through 2028
AI chip demand is tightening supply of IC substrates, prompting Nvidia, AMD, and hyperscalers to lock in Ajinomoto Build-up Film (ABF) capacity through 2028 and press suppliers to begin planning additional expansion for 2029 and 2030.
Wednesday 5 August 2026
Aurona lifts ABF and CCL shipments, eyes capacity expansion in 3Q26

Aurona said shipments of ABF substrate pads and CCL-related packaging materials both rose, extending its growth momentum in the second quarter of 2026. Stronger demand for CCL-related products helped lift quarterly revenue to NT$420 million (US$13 million), up 24.2% year-over-year.

Tuesday 4 August 2026
Samsung Electro-Mechanics reportedly fast-tracks Philippine MLCC plant in wake of AI-driven price hikes

Samsung Electro-Mechanics (SEMCO) is reportedly pulling forward the start-up of its first overseas multilayer ceramic capacitor (MLCC) plant, a move that underscores how an AI-driven scramble for the tiny components is reshaping pricing and investment across the industry.

Tuesday 4 August 2026
Taiwan specialty chemical firm expands Taiwan, China capacity on AI materials boom, eyes 20% revenue gain in 2026
Taiwan-based specialty chemicals supplier Johnson Fine Chemical expects robust growth in electronic materials demand driven by AI, high-performance computing (HPC) and advanced communications applications. The company is expanding production capacity in both Taiwan and China and plans to raise prices for selected products by 10-20% in the third quarter of 2026 to offset higher raw material costs. Management forecasts revenue growth of about 20% in 2026 from a year earlier, with profits also expected to increase, while 2027 is projected to deliver even stronger results.
Tuesday 4 August 2026
Kinsus boosts spending as global IC substrate supply stays tight
Kinsus said stronger second-quarter results and fresh capital spending reflect continued strain in the global IC substrate market, where demand from AI, CPU, GPU, and ASIC customers is keeping capacity tight. For global readers, the company's expansion plan points to prolonged supply constraints and firmer pricing ahead.
Monday 3 August 2026
AI infrastructure orders extend PCB expansion race
Global demand for AI infrastructure is rising, and as order visibility improves, the PCB supply chain has launched a marathon of factory expansion. Upstream copper-clad laminate (CCL) materials are already in short supply, and land, plant space, and machinery are also becoming scarce resources.
Monday 3 August 2026
India expands chip talent pipeline amid surging global chip demand
India has stepped up efforts to build a larger semiconductor workforce through training, curriculum reform, and industry partnerships. The plan matters beyond India because chip supply chains are global, and shortages in skilled engineers, fab workers, and packaging specialists can slow production, innovation, and investment worldwide.
Monday 3 August 2026
Samsung Electro-Mechanics deepens AI supply-chain bet with new contracts, eyes glass substrate production in 2027
Samsung Electro-Mechanics used its second-quarter earnings call to signal that its bet on AI infrastructure is paying off and about to get bigger, pointing to a run of long-term supply contracts, higher capital spending, and a newly formalized glass substrate venture as evidence that demand from hyperscalers and chipmakers is outrunning what the industry can supply.
Monday 3 August 2026
Flexible PCB maker Flexium sees AI server shipments doubling after 2Q margin turns positive
Flexium Interconnect said its second-quarter operating loss narrowed from the previous quarter as new flexible printed circuit products entered mass production for a US customer's latest notebooks, while smart glasses and AI server products began small-volume shipments.
Monday 3 August 2026
C.C.P. Contact Probes teams with chipmaker on MEMS probes and test-cleaning sheets
C.C.P. Contact Probes said it has expanded its presence in the AI sector through a joint development project with a major semiconductor company covering microelectromechanical systems probes and probe-cleaning sheets. The products will be introduced into customer designs after development is completed.
Monday 3 August 2026
AI server demand revives long-term MLCC supply agreements as shortages intensify
Surging demand for AI servers is tightening global capacity for high-end passive components, prompting customers to once again pursue long-term supply agreements (LTSAs) as they seek to secure future deliveries.