Huawei is reportedly working through its domestic supply chain to begin mass production of semiconductor glass substrates in 2027, with plans to adopt the technology in its own AI chips. Industry sources said that if the strategy proceeds successfully, leadership in global semiconductor glass-substrate technology could gradually shift towards China.
Taiwan's display supply chain enters second-quarter earnings season this week, with Coretronic reporting results on July 28, followed by AUO and Radiant Opto-Electronics (ROEC) on July 30 and BenQ Materials (BMC) on July 31.
Printed circuit board (PCB) manufacturer Eiso Enterprise has completed its annual fundraising plan. To strengthen working capital for future operations, repay bank loans, and enhance its financial structure, the company launched a cash capital increase and issued its second domestic unsecured convertible bonds in 2026.
Rising raw material costs and tightening supply of high-end components for AI applications have triggered an unusual round of price increases across the aluminium capacitor industry, with major suppliers in Japan, China and Taiwan moving to protect margins.
China's printed circuit board (PCB) industry is entering a new investment cycle, with more than CNY70 billion (approx. US$10.3 billion) committed in 2026 as AI servers, high-speed optical modules and edge devices lift demand for advanced boards.
Samsung Electro-Mechanics disclosed on July 23 that it signed a KRW295.12 billion (US$200 million) supply contract with a major global company for multilayer ceramic capacitors used in artificial intelligence servers and data center systems.
China's 12-inch silicon wafer maker Xi'an Eswin Material Technology said monthly output and sales of its 12-inch electronic-grade silicon wafers have both exceeded 1 million units, marking a further increase in its mass-production scale.
With SpaceX's first public earnings report approaching, investors are looking for fresh insight into the company's operations and future satellite deployment plans, viewing the results as an important barometer for the global satellite communications market.
IQE has raised its 2026 revenue outlook as demand for artificial intelligence (AI) infrastructure and data centers continues to strengthen, showing that AI-related growth is spreading beyond GPUs and servers into high-speed optical communications and photonics supply chains.
The rapid growth of AI data traffic is pushing quartz timing components toward three key technical upgrades: lower phase noise, reduced jitter and greater frequency accuracy. At the same time, SpaceX's continuing satellite deployment plans are creating fresh demand for frequency-control components such as filters, particularly benefiting suppliers capable of rapidly producing customized solutions.
HKC, the world's third-largest LCD panel supplier, plans to invest CNY4 billion (approx. US$590 million) in a 12-inch chip packaging and testing project, joining BOE and other Chinese display makers in expanding upstream into semiconductors.
Chinese AI chip developer Enflame said at the World Artificial Intelligence Conference (WAIC) 2026 that it had jointly showcased an AI chip sample with Shanghai Xianfeng Technology using glass-based Chip-on-Panel-on-Substrate (CoPoS) panel-level advanced packaging.
Rising investment in AI servers, high-speed networking, and satellite communications is accelerating a shift in Southeast Asia's electronics industry. Thailand, Vietnam, and Malaysia are moving beyond traditional consumer device assembly and building a deeper regional ecosystem for printed circuit boards, advanced substrates, and semiconductor-related manufacturing.
Zeiss, the exclusive supplier of ASML's extreme ultraviolet (EUV) optical systems, says the two companies operate as though they were one business. The comment comes as ASML's results for the second quarter of 2026 beat expectations, with the lithography equipment maker lifting its full-year outlook again. Zeiss Semiconductor Manufacturing Technology (SMT) President and CEO Frank Rohmund said the strong ASML report is good news for Zeiss as well, underscoring a partnership that has become deeply intertwined.
Haesung DS has reportedly added China's CXMT as a customer for DDR5 package substrates as the South Korean supplier expands its DDR5 business and considers panel-based production for higher-layer-count products for the DDR6 generation.
Google is reportedly developing a new chip that embeds information from its Gemini AI models directly onto the silicon to boost efficiency. If the anticipated performance gains materialize, this new design would mark a deeper integration of the tech giant's hardware and AI capabilities.
Ishihara Sangyo Kaisha plans to double production capacity for high-purity titanium dioxide used to make dielectric materials for multilayer ceramic capacitors, as rising AI server power requirements increase demand for the components.
Samsung Electronics, SK Hynix and Micron Technology are reportedly scaling back or shelving plans to commercialize internally developed Compute Express Link (CXL) controller chips, shifting more controller work to specialist fabless suppliers while continuing to develop CXL-based memory products.
