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Friday 20 March 2026
Lumotive makes optical breakthrough, targets 10,000-port data centers

As Nvidia and Coherent signal a shift toward all-optical networking to solve the AI power crisis, Redmond-based Lumotive has announced a milestone that could redefine data center scalability. In an interview with DIGITIMES Asia, Gleb Akselrod, Co-founder and CTO of Lumotive, detailed the success of the world's first programmable 2D optical beamforming chip.

Friday 20 March 2026
Research Insight: AI reshapes Taiwan's PCB industry around high-end capacity and materials
DIGITIMES observes that as demand surges for AI servers, high-speed switches, optical communication modules, and edge AI devices, Taiwan's PCB industry is undergoing a structural shift in its growth model. The traditional cyclical, recovery-driven growth is giving way to competition centered on high-end capacity deployment, control of critical materials, and global expansion capabilities.
Friday 20 March 2026
HiSilicon unveils self-developed CIS chip, shaking global sensor supply chain
The global CMOS image sensor (CIS) supply chain faces a major disruption as HiSilicon, Huawei's core semiconductor subsidiary, officially enters the high-end CIS market with its first self-developed sensor chip. Partnering with strategic collaborator Gkuvision, an imaging solution provider, HiSilicon launched the new generation sports camera "Xiaotu S7PRO MAX" equipped with its proprietary sensor.
Friday 20 March 2026
MediaTek on cruise control as chipmakers scramble for next-gen silicon photonics standards
Nvidia GTC 2026 and the Optical Fiber Communication Conference (OFC) have underscored the growing importance of optical communication in cloud AI, with chipmakers playing an increasingly critical role in the ecosystem.
Friday 20 March 2026
AI tailwinds and global reach put Topco on track for double-digit growth in 2026
Driven by AI applications boosting advanced processes, HBM, and packaging technologies, demand for key materials like silicon wafers and photoresists has surged. Topco Scientific (TSC) has announced plans to focus on high-growth sectors such as AI, automotive, and data centers in 2026, targeting sustained double-digit growth.
Friday 20 March 2026
Allied Circuit sees server, IPC market growth boosting 2H26 outlook
Benefiting from rising demand across the server and industrial PC (IPC) markets, Allied Circuit (ACCL), a PCB manufacturer backed by Compal, reported that its new capacity added in 2025 has fully come online. Now running at full capacity, ACCL's monthly revenue contribution stands at approximately NT$500 million (US$15.7 million). The company plans to continue removing production bottlenecks in 2026 and expects second-half revenue performance to surpass the first half.
Friday 20 March 2026
Lumotive creates world's first 2D photonic beamforming chip
Lumotive, a pioneer in programmable optical semiconductor technology, has demonstrated the world's first programmable two-dimensional (2D) photonic beamforming chip. Built on its Light Control Metasurface (LCM) architecture, the chip enables electronic control of light across two dimensions within a single device — a capability long pursued in optical science and widely considered essential for scalable programmable optical systems.
Thursday 19 March 2026
Samsung Electro-Mechanics rumored to supply MLCCs to top private aerospace firm
Samsung Electro-Mechanics (Semco) is reportedly supplying multilayer ceramic capacitors (MLCC) for low Earth orbit (LEO) satellites to the world's largest private aerospace company. According to industry sources, this expansion from the automotive and industrial sectors into aerospace is a significant step for the company, as it demonstrates that its components have gained global recognition for durability and reliability.
Thursday 19 March 2026
China curbs, Middle East tensions drive surge in chip material risks from gallium to helium

Global semiconductor supply chains are facing rising pressure as Middle East geopolitical tensions and China's tightening export controls on strategic minerals converge, pushing up prices for key materials and raising uncertainty over critical industrial gas supplies, according to Chosun Biz and Reuters.

Tuesday 17 March 2026
MOEA establishes high-speed silicon photonics verification lab to shorten development timelines
In January 2026, Taiwan's Executive Yuan officially approved the Ten AI Initiatives Promotion Plan, coordinated by the National Development Council (NDC) in collaboration with the National Science and Technology Council (NSTC), the Ministry of Economic Affairs (MOEA), the Ministry of Digital Affairs (MODA), and other relevant agencies. As part of this initiative, the MOEA will establish a high-speed silicon photonics (SiPh) verification laboratory to provide testing services that could shorten development timelines for local firms.
Monday 16 March 2026
Sony CIS yield issue raises Apple supply risks, opens door for Samsung

Sony's core semiconductor business, CMOS image sensors (CIS), has reportedly encountered yield challenges in recent production. Industry sources say the issue could introduce uncertainty into Apple's supply chain, while potentially creating indirect opportunities for Samsung Electronics' non-memory businesses, including its System LSI and foundry divisions, as the world's second-largest CIS supplier.

Monday 16 March 2026
CMMT pushes ahead into semiconductor materials despite polarizer headwinds
Cheng Mei Materials Technology (CMMT), a Taiwan-based polarizer manufacturer, remains loss-making but has stepped up efforts to reposition itself as a semiconductor materials supplier. The company said its semiconductor packaging application films began shipping in the first quarter of 2026, while advanced packaging process materials are expected to contribute meaningfully in the future.
Monday 16 March 2026
Weekly news roundup: Memory crunch, AI supply chains, new manufacturing hubs
Below are the most-read DIGITIMES stories from the week of Mar 9-15, 2026:
Monday 16 March 2026
AI server tracker: AI server boom drives demand for PCB, CCL and interconnect suppliers
Spending by hyperscale cloud service providers (CSPs) is fueling expansion across the AI server supply chain, with demand spreading beyond processors and server assembly into board-level materials and connectivity components.
Monday 16 March 2026
Global PMX shifts revenue mix toward semiconductor and medical businesses, projecting stronger profits in 2026
Global PMX released a positive outlook, identifying semiconductor- and AI-server-related businesses as its main future growth drivers, while signaling a gradual decline in its formerly dominant automotive segment. The company said it has actively optimized its product mix as global industry structures adjust.
Sunday 15 March 2026
PCB supply chains feel the heat of Middle East
The Middle East conflict is scorching more than just the region. Disrupted shipping lanes and tightening energy supplies are driving up costs across the printed circuit board (PCB) industry — from raw materials to manufacturing to final pricing.
Sunday 15 March 2026
Zhen Ding sees AI products near 70% of revenue, sets NT$100 billion capex for 2 years
Printed circuit board (PCB) giant Zhen Ding Technology recently held an earnings call where company chairman Charles Shen noted that customer demand across artificial intelligence (AI) applications, including AI servers, optical communications, and IC substrates, remains strong. At the same time, order visibility and shipment momentum are rising, with AI-related products accounting for nearly 70% of revenue in 2025. Furthermore, the company expects to enter a high-growth phase in 2026.
Saturday 14 March 2026
Wah Lee sees record revenue in 1H26 driven by AI server orders, CCL substrate growth
Semiconductor materials and equipment supplier Wah Lee Industrial reported record-high cumulative revenue for the first two months of 2026, fueled by strong demand for artificial intelligence (AI) servers, high-performance computing (HPC), and advanced semiconductors. Benefiting from robust AI server orders and the gradual rollout of new production capacity for 800G switches, revenue related to its copper-clad laminate (CCL) business has also grown multifold.
Friday 13 March 2026
T1200 carbon fiber upgrade raises stakes in aerospace, robotics, and advanced manufacturing

Carbon fiber, known for high temperature resistance and corrosion resistance, is often described as "black gold," the "king of new materials," and one of the strongest materials on earth. China's T1200-grade carbon fiber has appeared overseas, highlighting continued technological upgrades in China's high-performance materials sector and drawing international attention.

Friday 13 March 2026
China claims T1200 carbon fiber mass production, opening doors to semiconductors and robotics
China's advanced materials sector has made new strides. China National Building Material Group (CNBM) unveiled a domestically developed T1200-grade ultra-high-strength carbon fiber at the JEC World 2026 composites exhibition in Paris, stating it has achieved production capacity at the hundred-ton scale.
Friday 13 March 2026
Taiwan PCB output reaches $43B in 2025, TPCA says
The Taiwan Printed Circuit Board Association (TPCA) held its annual member meeting, where chairman Lawrence Chang announced projections for the industry through 2026. The announcement included both growth expectations and a newly released risk governance strategy.
Friday 13 March 2026
Flexium eyes 30% revenue from AI servers and smart glasses in 2026
After a challenging 2025, flexible printed circuit (FPC) giant Flexium Interconnect is optimistic about its revenue and profit outlook, driven by accelerated transformation in high-speed transmission products. The company expects full-year growth in 2026 fueled by strong demand in two key sectors: new models for major US smartphone customers and applications in AI servers and wearable devices.
Thursday 12 March 2026
Semco seen supplying ABF substrates for Tesla AI chips via Samsung foundry
Samsung Electro-Mechanics (Semco) is expected to supply ABF substrates for Tesla's next-generation artificial intelligence chips that Samsung Electronics plans to manufacture at its Taylor, Texas foundry, according to Chosun Biz and other Korean media reports.
Thursday 12 March 2026
Nvidia expands GPU market share as AIB shipments rise despite increased costs
Nvidia strengthened its dominance in the add-in-board (AIB) GPU market in the fourth quarter of 2025, capturing a record 94% market share even as overall shipments dipped amid rising memory prices and tariff pressures, according to Jon Peddie Research.
Thursday 12 March 2026
AI demand tightens supply of high-end MLCCs; Nichidenbo sees limited US-Iran impact on tantalum capacitors
Managing director Yao-Kuo Yu of Nichidenbo, a passive component distributor, stated that the AI industry's growing demand for passive components continues to tighten supplies of high-end multilayer ceramic capacitors (MLCCs) and tantalum capacitors, with tantalum capacitor prices rising about 10-20%.