Foxconn is expanding its footprint in France with two projects spanning artificial intelligence infrastructure and semiconductor packaging, as the Taiwanese electronics manufacturer deepens its role in Europe's efforts to build advanced computing and chip capabilities.

Compeq Manufacturing Co. told shareholders on May 28 that AI infrastructure demand has transformed the printed circuit board industry and will push high-end PCB manufacturing complexity, reliability requirements and product gross margins higher, leading the firm to expect significant revenue and profit growth in 2027 and 2028. The company held its 2026 annual shareholders meeting where executives outlined the strategic shift toward AI servers, high-end switches, satellite communications and optical communications as core growth drivers.

PCB maker Zhen Ding said AI is driving a structural shift in electronics, redefining the role of printed circuit boards from passive signal connections to critical platforms for high-performance computing and system integration. Chairman Charles Shen made the remarks at the company's 2026 annual shareholders' meeting.

After Nvidia CEO Jensen Huang wrapped up his "trillion-dollar banquet" for Taiwan AI supply-chain giants, GTC Taipei is set to become a highlight of Computex 2026. Nvidia will also host its first "South Korean partners night" in Taiwan.

Nvidia chief executive Jensen Huang said the artificial intelligence industry is entering a rapid growth phase that could keep revenue rising sharply into 2027, while supply-chain bottlenecks are likely to persist as demand continues to outstrip capacity.

Taiwan-based Actron Technology expects stronger growth in its automotive semiconductor business as demand for its high-efficiency diode products has exceeded expectations amid tightening global emissions standards and resilient hybrid vehicle demand.

Flexium Interconnect held its 2026 annual shareholders meeting on May 28 and outlined a strategic shift toward technology upgrades, higher-value products and improved operational efficiency as the company pursues a transformation expected to accelerate in the second half of 2026. Executives said global macroeconomic and geopolitical uncertainties persist, but management forecast that initiatives begun this year will start to deliver results later in the year.

AuthenX is preparing to showcase a detachable 2D fiber-array unit at COMPUTEX 2026, as the Taiwanese optical-communications company seeks to address packaging and alignment challenges in co-packaged optics.

Niching Industrial Corp. said on May 28 that it will acquire an 82% stake in Ming Chun Yuan Precision Technology for NT$508 million, with the transaction expected to close on July 1 after the required legal procedures are completed.

WinWay Technologies, a major test interface provider, followed ASE Holdings in holding a groundbreaking ceremony for its new plant at the Renwu Industrial Park in southern Taiwan. The company plans to invest NT$3.5 billion (US$111.1 million) in the facility construction.

Facing memory shortages and Sharp's plan to shut down its Guishan K2 plant by the end of 2026, GIS chairman Hsien-Ying Chou said the company faces greater operational challenges in the second half of 2026. However, its transformation strategy is accelerating. Among its new businesses, optical waveguide products used in AI glasses and other applications began small-volume shipments in the first quarter of 2026, while its optical communications business is targeting advanced optical source packaging and testing services. Both new application areas are expected to gradually ramp up in 2027, creating new growth momentum for revenue and gross margins.

Nan Ya Plastics announced at its May 29 shareholders meeting that it would pivot into three new business areas — medical materials, semiconductor materials, and comprehensive power solutions — as part of a broader transformation planned for 2026 and 2027. Chairman Chia-Chau Wu said the move aims to raise the share of electronic materials in group revenue from just over 50% today to about 60% by 2026, driven by demand from AI infrastructure and high-performance computing.

The global AI boom is pushing supply-chain pressure beyond memory chips and CPUs into optical communications, creating shortages across a less visible but increasingly critical layer of data-center infrastructure.

Innolux plans to accelerate its transformation in 2026, with chairman and CEO Jim Hung pointing to three priorities: advanced semiconductor packaging, smart cockpits, and higher-margin panel applications.

Foxconn chairman Young Liu said the company is preparing to break ground on its advanced packaging plant in France while continuing to explore sovereign-AI opportunities in Africa, as the electronics manufacturer looks beyond AI servers for its next phase of growth.

Unimicron said it will push advanced substrate and AI system-board upgrades in 2026 to capture accelerating demand for AI-related ASICs and switches, aiming for record revenue that would exceed its 2022 peak. The IC substrate and printed circuit board maker announced the strategy at its annual shareholders' meeting at the end of May, citing a shift in demand away from GPUs and CPUs toward ASICs, switches, and high-performance computing applications.

AI demand for high-performance chips is driving up orders for semiconductor silicon capacitors, or Si-Caps, with Samsung Electro-Mechanics and several Taiwanese memory makers emerging as key names to watch. Supply-chain sources say the shift could reshape who captures future demand for advanced packaging.

Copper clad laminate (CCL) maker Iteq held its 2026 annual general meeting on Thursday, with Chairman Dennis Chen saying that the continued deepening of generative AI applications, faster cloud computing and data center expansion, and steady growth in demand from new energy-related industries are boosting demand for high-end electronic materials and high-frequency, high-speed printed circuit board (PCB) markets.

ChangXin Memory Technologies (CXMT), China's top DRAM maker, has been cleared by China's securities regulator for its highly anticipated IPO, which could raise funds worth CNY29.5 billion (approx. US$4.4 billion) for the company. The Shanghai Stock Exchange said on May 27 that it had cleared a listing review for its STAR Board.

Sino-American Silicon Products (SAS) held its shareholders meeting on May 26 and completed a full board overhaul, with founder Mingguang Lu stepping down as a director and Hsiu-lan Hsu being re-elected chairwoman. Lu will continue supporting the group as honorary chairman as SAS deepens its generational transition and diversified growth strategy.

Passive component manufacturer Yageo held its 2026 annual shareholders meeting on May 27. In a post-meeting interview, chairman Pierre Chen confirmed that the world's two largest multilayer ceramic capacitor (MLCC) makers, Japan's Murata Manufacturing and South Korea's Samsung Electro-Mechanics (Semco), have recently issued price increase notices to customers and distributors.

Sino-American Silicon Products (SAS) is turning to AI-based power management as Taiwan's green-power shortage persists, and electricity demand from advanced chipmaking and AI data centers continues to rise.

US efforts to rebuild its semiconductor supply chain are exposing a critical gap in domestic packaging and testing capacity, a bottleneck that industry sources expect to ease only after 2028 as the US OSAT ecosystem gradually takes shape.