Samsung Electro-Mechanics (SEMCO) is reportedly pulling forward the start-up of its first overseas multilayer ceramic capacitor (MLCC) plant, a move that underscores how an AI-driven scramble for the tiny components is reshaping pricing and investment across the industry.
The rapid expansion of AI infrastructure is reshaping one of the semiconductor industry's most overlooked component markets. Soaring demand for high-end multilayer ceramic capacitors (MLCCs) is prompting suppliers to reallocate production capacity and driving a new round of price increases that extend beyond AI-specific products.
Samsung Electro-Mechanics (Semco) is broadening its collaboration with South Korean materials supplier SoulBrain beyond glass substrate etchants to include copper plating chemicals and chemical mechanical polishing (CMP) slurries, as the companies race to secure key materials for next-generation AI chip packaging.
Japan and South Korea's MLCC suppliers are again raising prices, signaling tighter supply conditions that could affect electronics makers worldwide. The moves, led by major passive component manufacturers, suggest AI-related demand is reshaping a market previously softened by weaker consumer and automotive orders.
Huawei is reportedly working through its domestic supply chain to begin mass production of semiconductor glass substrates in 2027, with plans to adopt the technology in its own AI chips. Industry sources said that if the strategy proceeds successfully, leadership in global semiconductor glass-substrate technology could gradually shift towards China.
Taiwan's display supply chain enters second-quarter earnings season this week, with Coretronic reporting results on July 28, followed by AUO and Radiant Opto-Electronics (ROEC) on July 30 and BenQ Materials (BMC) on July 31.
Printed circuit board (PCB) manufacturer Eiso Enterprise has completed its annual fundraising plan. To strengthen working capital for future operations, repay bank loans, and enhance its financial structure, the company launched a cash capital increase and issued its second domestic unsecured convertible bonds in 2026.
Rising raw material costs and tightening supply of high-end components for AI applications have triggered an unusual round of price increases across the aluminium capacitor industry, with major suppliers in Japan, China and Taiwan moving to protect margins.
China's printed circuit board (PCB) industry is entering a new investment cycle, with more than CNY70 billion (approx. US$10.3 billion) committed in 2026 as AI servers, high-speed optical modules and edge devices lift demand for advanced boards.
