CONNECT WITH US
NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Thursday 26 December 2024
SustainaCircuits: Japan's Elephantech unveils general-purpose multilayer PCBs
Elephantech Inc., a Tokyo-based printed electronics manufacturer, has announced a breakthrough in developing general-purpose multilayer printed circuit boards (PCBs). The company's...
Wednesday 25 December 2024
FCCL firm Taiflex expects 2025 growth from advanced packaging materials
Flexible copper-clad laminate (FCCL) maker Taiflex Scientific expects to gain growth momentum from new product lines in 2025 though the consumer electronics market will only see mild...
Wednesday 25 December 2024
Chinese MCU makers pivot to AI chips for growth
Chinese microcontroller unit (MCU) manufacturers are ramping up their presence in the edge AI sector, following the trajectory of global leaders in AI MCU development.
Tuesday 24 December 2024
Hyundai restructures Semiconductor Strategy Group, pivots to in-house autonomous chip strategy
Hyundai Motor Group has reportedly disbanded its Semiconductor Strategy Group (the Group), a key division tasked with driving the company's in-house development of automotive semiconductors...
Tuesday 24 December 2024
Nan Ya PCB targets AI transformation and double-digit revenue growth for 2025
Nan Ya PCB, one of Taiwan's top trio of substrate manufacturers, has capitalized on a strategic opportunity in the latter half of 2024 by launching new high-end substrate products...
Friday 20 December 2024
Topoint's Thailand plant on track for volume production in 2025
Topoint Technology, a manufacturer of PCB drill bits, is preparing to commence mass production at its new factory in Thailand in 2025. This facility will provide drilling services...
Thursday 19 December 2024
Chin Poon expects flat 2025 amid potential US gasoline vehicle demand rebound
Automotive PCB manufacturer Chin Poon is maintaining a cautious outlook for 2025, projecting flat market conditions amid the global automotive market slowdown and client pessimism...
Wednesday 18 December 2024
Onsemi's dual focus on automotive electrification and AI data centers sharpens with China push
Amid shifting dynamics in the power semiconductor market, Onsemi is leveraging China as a key growth driver for its dual focus on automotive electrification and AI data centers. Celebrating...
Wednesday 18 December 2024
Ventec new Thailand plant set for volume production in 1Q26
Following other PCB firms' expansion moves, niche copper-clad laminate (CCL) specialist Ventec announced plans in November for a production base in Thailand, which will begin volume...
Wednesday 18 December 2024
Toppan participates in US-JOINT for advanced packaging technologies
In a press release dated December 10, Toppan, a subsidiary of Toppan Holdings, announced its participation in the US-JOINT initiative. This initiative is a consortium between the...
Tuesday 17 December 2024
Compeq to begin mass production at new Thailand plant in 1Q25
Taiwan-based tier-1 high-density interconnect (HDI) board maker Compeq Manufacturing has opened its first production base in Southeast Asia located in Thailand. The facility will...
Tuesday 17 December 2024
Advantest unveils testing solutions for AI and advanced chips
Japanese semiconductor testing equipment firm Advantest has announced its latest testing solutions for advanced applications such as high-end memory, 5G, AI, and high-performance...
Monday 16 December 2024
Compeq sees bright future with LEO expansion and Thai plant launch
Taiwan-based HDI board manufacturer Compeq experienced robust revenue performance in November, driven by the heightened demand for tablets and notebooks, steady shipments of low Earth...
Thursday 12 December 2024
Phoenix Pioneer sees a bright outlook for 2025 amid its transition to advanced packaging substrates
Innovative IC substrate manufacturer Phoenix Pioneer Technology is undergoing a strategic transformation into advanced packaging. The company is developing cutting-edge xQFN lead...
Wednesday 11 December 2024
NCHC launches simulation platform to streamline PCB design optimization
Taiwan's National Center for High-Performance Computing (NCHC) unveiled its "Printed Circuit Board Assembly (PCBA) Cloud Analysis Platform" at a press conference on December 10. The...
filusch fiore kommunikations.design GmbH
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research