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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Tuesday 24 December 2024
Hyundai restructures Semiconductor Strategy Group, pivots to in-house autonomous chip strategy
Hyundai Motor Group has reportedly disbanded its Semiconductor Strategy Group (the Group), a key division tasked with driving the company's in-house development of automotive semiconductors...
Tuesday 24 December 2024
Nan Ya PCB targets AI transformation and double-digit revenue growth for 2025
Nan Ya PCB, one of Taiwan's top trio of substrate manufacturers, has capitalized on a strategic opportunity in the latter half of 2024 by launching new high-end substrate products...
Friday 20 December 2024
Topoint's Thailand plant on track for volume production in 2025
Topoint Technology, a manufacturer of PCB drill bits, is preparing to commence mass production at its new factory in Thailand in 2025. This facility will provide drilling services...
Thursday 19 December 2024
Chin Poon expects flat 2025 amid potential US gasoline vehicle demand rebound
Automotive PCB manufacturer Chin Poon is maintaining a cautious outlook for 2025, projecting flat market conditions amid the global automotive market slowdown and client pessimism...
Wednesday 18 December 2024
Onsemi's dual focus on automotive electrification and AI data centers sharpens with China push
Amid shifting dynamics in the power semiconductor market, Onsemi is leveraging China as a key growth driver for its dual focus on automotive electrification and AI data centers. Celebrating...
Wednesday 18 December 2024
Ventec new Thailand plant set for volume production in 1Q26
Following other PCB firms' expansion moves, niche copper-clad laminate (CCL) specialist Ventec announced plans in November for a production base in Thailand, which will begin volume...
Wednesday 18 December 2024
Toppan participates in US-JOINT for advanced packaging technologies
In a press release dated December 10, Toppan, a subsidiary of Toppan Holdings, announced its participation in the US-JOINT initiative. This initiative is a consortium between the...
Tuesday 17 December 2024
Compeq to begin mass production at new Thailand plant in 1Q25
Taiwan-based tier-1 high-density interconnect (HDI) board maker Compeq Manufacturing has opened its first production base in Southeast Asia located in Thailand. The facility will...
Tuesday 17 December 2024
Advantest unveils testing solutions for AI and advanced chips
Japanese semiconductor testing equipment firm Advantest has announced its latest testing solutions for advanced applications such as high-end memory, 5G, AI, and high-performance...
Monday 16 December 2024
Compeq sees bright future with LEO expansion and Thai plant launch
Taiwan-based HDI board manufacturer Compeq experienced robust revenue performance in November, driven by the heightened demand for tablets and notebooks, steady shipments of low Earth...
Thursday 12 December 2024
Phoenix Pioneer sees a bright outlook for 2025 amid its transition to advanced packaging substrates
Innovative IC substrate manufacturer Phoenix Pioneer Technology is undergoing a strategic transformation into advanced packaging. The company is developing cutting-edge xQFN lead...
Wednesday 11 December 2024
NCHC launches simulation platform to streamline PCB design optimization
Taiwan's National Center for High-Performance Computing (NCHC) unveiled its "Printed Circuit Board Assembly (PCBA) Cloud Analysis Platform" at a press conference on December 10. The...
Wednesday 11 December 2024
Onsemi to acquire SiC JFET tech to strengthen power portfolio for AI data centers
Onsemi announced on December 9, 2024, that it has agreed to acquire Qorvo's Silicon Carbide Junction Field-Effect Transistor (SiC JFET) technology business, including the United Silicon...
Tuesday 10 December 2024
SK Hynix restructures CIS organization seemingly to replicate HBM success model
Despite the low profitability of SK Hynix's CMOS image sensor (CIS) business, the company has decided to retain this segment and reorganize its CIS development team under the Future...
Tuesday 10 December 2024
Taiwanese PA makers eye LEO product potential for smartphones
Smartphone shipments underperformed in the second half of 2024, particularly with Android momentum in China slowing compared with the first half of the year. As a result, Taiwanese...