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Friday 1 July 2022
Specialty PCB maker FHt looks to product diversification for future growth
Taiwan-based First Hi-tec Enterprise (FHt), dedicated to niche-market PCB production, will remain focused on product diversification to drive its future growth, according to company...
Thursday 30 June 2022
IntelliEPI upbeat about InP epi-wafer demand for 5G device apps
Epitaxial wafer supplier Intelligent Epitaxy Technology (IntelliEPI) expects robust InP-based epi-wafer demand for 5G related device applications to drive its revenue growth this...
Tuesday 28 June 2022
IC test interface vendors eyeing new chip solutions as growth engine
Despite lingering handset sales uncertainty, mobile SoC vendors MediaTek and Qualcomm continue to roll out new high-end offerings, while Apple remains keen on developing high-performance...
Monday 27 June 2022
Competition poised to heat up in 3-horse race for 3/2nm processes
Foundry market competitions among TSMC, Samsung Electronics and Intel will heat up significantly as they are advancing to 3/2nm manufacturing nodes, and it seems that Samsung will...
Tuesday 21 June 2022
Taiwan sets tentative rate for 5G private networks
Taiwan's National Communications Commission (NCC) has set a tentative rate of NT$1,360 (US$46.1) per MHz of frequency band for dedicated 5G private networks, according to NCC.
Tuesday 21 June 2022
Macronix, Winbond focus more on non-consumer NOR flash
Macronix International and Winbond Electronics have both put increased sales focus on high-density NOR flash for 5G base stations and automotive electronics, as demand for consumer...
Monday 20 June 2022
Handset PA makers pinning hopes on iPhones for 3Q22 sales
Taiwan's GaAs-based power amplifiers (PA) supply chain players including foundries Win Semiconductors and Advanced Wireless Semiconductor (AWSC) and epi-wafer maker Visual Photonics...
Friday 17 June 2022
Device assemblers keen to expand smart manufacturing amid labor shortage
Labor shortage has become a new normal at manufacturing industries worldwide in the post-pandemic era, and this is driving device assemblers including notebook ODMs and network device...
Friday 17 June 2022
Substrate-free FOPLP technology gaining ground in advanced packaging market
Chip demand for 5G, AI, and automotive applications continues to grow robustly, but substrates needed to process related chips will remain in short supply until at least 2025, which...
Wednesday 15 June 2022
Compal Electronics to demonstrate standardized 5G smart poles via cooperation with InSynerger Technology
Compal Electronics will cooperate with InSynerger Technology, a startup developer of IoT-based smart solutions, to set up a network of 5G smart poles in Asia New Bay Area 5G AIoT...
Tuesday 14 June 2022
IC analysis labs upbeat about 2H22
Taiwan's IC analysis and inspection labs are optimistic about better performance in the second half of 2022 than the first half, bolstered by increasing wafer material analysis (MA)...
Tuesday 14 June 2022
Fully supporting Taiwan networking solution providers, Fibocom applies the sales success formula in 5G era
The 5G industries are ramping up competition to drive innovation and diversify the global telecoms supply market. Surprisingly, in the fierce competition of recent years, Taiwan networking...
Friday 10 June 2022
Largan sees reasons for optimism for smartphone industry
Although smartphone sales are expected to follow a downward trend in 2022 due to various factors, there are still reasons for the smartphone industry to remain optimistic about its...
Friday 10 June 2022
5G just at first generation with much to be desired, says NCC commissioner
A recent global survey by telecom equipment vendor Ericsson found that many people are disappointed with 5G because no killer applications are in sight, which, however, can be attributed...
Thursday 9 June 2022
Apacer, Asus Cloud jointly promote info security solution for IPC systems
Memory module vendor Apacer Technology has teamed up with Asus Cloud to provide an information security solution for IPC-based industrial control systems. The solution is said to...