Wiwynn Corporation said AI server shipments will overtake general-purpose server shipments in the third quarter of 2026, with the two expected to account for roughly half each, while the company also expects a stronger fourth quarter as ASIC momentum builds.
Chinese CPU maker Loongson recently announced a CNY2.3 billion (approx. US$342.7 million) capital increase, with the funds mainly going into information technology chips and core CPU and GPU technologies. More than CNY1.4 billion is allocated to CPU-related projects, making it the largest investment area in the fundraising plan.
Samsung Electronics' Indian unit has reportedly started cutting jobs in its TV and home-appliance businesses as higher memory-chip prices, currency weakness, and soft consumer demand squeeze margins across its local electronics operations.
Sumitomo and its IT subsidiary SCSK are partnering with Japanese AI startup Sakana AI to expand the use of domestically developed AI among Japanese companies, leveraging Sumitomo's broad customer base to reach businesses of various sizes.
Taiwan's hardware strength gives it a firm place in the global technology supply chain, but industry leaders say its next opportunity lies in open source. Jonathan Bryce, executive director of cloud and infrastructure at the Linux Foundation, said the most effective way for Taiwan to gain greater influence is for local developers to contribute code and help guide projects.
Google said it will invest EUR13 billion (US$15.11 billion) in Finland over the next two years, underscoring how data center growth, clean power, and local skills investment are becoming increasingly intertwined for global technology users, businesses, and energy markets. The company said the expansion will support its core services and deepen its long-running presence in the country.
Driven by sustained artificial intelligence (AI) demand, global semiconductor capacity expansion is accelerating. According to the 2026 Semiconductor Industry Talent Report released by 104 Job Bank, monthly job openings in Taiwan's semiconductor sector reached 47,000 in 2026, a year-over-year surge exceeding 20%.
Arm unveiled its second-generation mobile Compute Subsystem (CSS), Arm CSS for Mobile 2, at its annual Arm Everywhere China event in Shanghai on September 8, further integrating AI computing capabilities across the CPU, GPU, and system interconnect while strengthening its presence in the Chinese market.
Nvidia's Vera Rubin platform is entering its production ramp, and although server ODM shipments are still expected to ramp further, server ODMs delivered strong operating results in August. Industry sources said demand remains robust for both the H-series and GB-series products.
Flex has recently agreed to buy US power conversion specialist EPC Power for US$4.4 billion, a move that highlights how competition in AI infrastructure is extending beyond servers and racks into grid-side power, cooling, and energy management. The acquisition is expected to deepen Flex's role as rising compute density pushes data centers toward higher-voltage architectures.
Hiwin Technologies has signed a supply contract with Semes, Samsung Electronics' semiconductor equipment arm, for a single-axis positioning stage being tested in hybrid bonding equipment, signaling a potential opening in South Korea's advanced packaging supply chain. The deal complements Hiwin's push to broaden its co-packaged optics (CPO) business and move into higher-value semiconductor equipment components.
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