Concerns over whether the AI surge is a bubble continue to linger. However, recent indicators—from Nvidia's latest capital initiatives and TSMC Chairman C.C. Wei's assessment of major cloud service provider (CSP) demand, to record capex from US CSPs and surging orders across downstream players like Asus, Gigabyte, and Supermicro—all demonstrate that AI demand is flowing steadily from upstream silicon to servers and data centers, driving concrete gains in revenue, profits, and backlogs.
Nvidia has reached a deal with OpenAI to provide up to US$105 billion in credit guarantees for the AI startup's upcoming 8GW data center campus in Ohio. The support will help OpenAI to secure a lease from SB Energy, while Nvidia will be the facility's exclusive chip supplier.
Nvidia's new Taiwan headquarters will be located in the Beitou-Shilin Technology Park, with construction expected to begin by the end of 2026. As the AI and high-tech ecosystem takes shape around the project, power supply has emerged as a key concern—and one closely watched by Nvidia CEO Jensen Huang.
Niche printed circuit board (PCB) manufacturer Eiso Enterprise has officially opened the second-phase expansion of its new plant in Guishan, Taiwan, which is expected to raise the company's overall monthly production capacity to 1.5 times the previous level.
Taiwan's National Science and Technology Council (NSTC) is preparing the second-phase quantum research program, known as the "Quantum Leap Project," for 2027 to 2031, while a Request for Proposal for the National Center for High-Performance Computing's (NCHC) quantum computing (QC) host is expected soon. The move has raised questions over whether NSTC Minister Wu Cheng-wen's recent US trip could include talks with leading quantum computing companies on potential Taiwan-US cooperation.
MediaTek has reportedly landed major orders for Google TPU products in recent years, even appearing to challenge Broadcom's position. At a recent earnings call, MediaTek also raised its 2027 ASIC market share target to 15% to 20%, and industry watchers largely credit that goal to the breadth of MediaTek's ASIC services.
The intensifying US-China technology rivalry is moving beyond export controls and semiconductor restrictions. What comes next could matter more: the formation of competing international AI ecosystems.
As SpaceX accelerates its push into space-based AI data centers and Nvidia brings Jetson GPUs into lunar exploration missions, the race to build computing infrastructure beyond Earth is moving from proof-of-concept experiments toward actual deployment.
Taiwan Mobile has raised its full-year 2026 operating profit growth outlook to 7% to 9%, excluding the impact of its planned Systex acquisition, as AI applications continue to drive demand for data center computing power and spur the company's AI data center (AIDC) expansion.
Printed circuit board (PCB) drill bit manufacturer Topoint Technology stated during its second-quarter 2026 earnings call that strong demand for artificial intelligence (AI) servers and high-performance computing (HPC) has significantly improved its product structure. High-end coated drill bit products accounted for 56% of product share in the first half of the year, already exceeding the company's original full-year target of 55%.
India's electronics and AI infrastructure ambitions are accelerating, but mounting environmental opposition, tighter Chinese visa curbs, and intensifying competition for semiconductor investment are exposing new challenges. As Google advances a US$15 billion AI data center, Larsen & Toubro (L&T) restructures its cloud business, and Dixon Technologies expands its smartphone OEM business, states are sweetening incentives to strengthen India's position in global technology supply chains.
China is accelerating construction of its national computing network, and a growing share of new capacity is likely to use supernodes. With domestic AI accelerators still trailing leading global chips in single-card performance, Chinese vendors are increasingly relying on larger card counts, high-speed interconnects and system-level optimisation to close the gap.
