CONNECT WITH US
NEWS TAGGED SERVER, IPC, CLOUD COMPUTING, IOT
Thursday 3 September 2026
Auras sees ASIC revenue reaching 50% in 2027, eyes microchannel cooling production in 2028
Cooling specialist Auras Technology is expanding from GPU platforms to ASIC-related products as its next growth driver, amid the ongoing shift toward liquid cooling in AI servers,...
Thursday 3 September 2026
Column: From automation to autonomy—what robotics still needs to make the leap
I visited Automation Taipei 2026 in mid-August, where the show looked lively and occupied a footprint 7% larger than in 2025. Physical AI and vision-language-action (VLA) models dominated...
Thursday 3 September 2026
SB Energy eyes US listing as Nvidia commits US$1.5 billion
SB Energy, the data center and power infrastructure company under SoftBank Group, filed for an IPO with the US Securities and Exchange Commission (SEC) on September 1, planning to...
Thursday 3 September 2026
Thailand AiPASS unlocks premium AI after lessons
Thailand has launched its TH-AI Passport and core AiPASS platform, taking a different path from South Korea's national AI push by buying access to overseas commercial AI tools such...
Thursday 3 September 2026
SEMICON Taiwan 2026: Physical AI drives new demand for multimodal robot sensing
The rise of physical AI is creating a new wave of demand for advanced sensors as robots move from controlled demonstrations toward practical deployment. Industry experts at SEMICON...
Wednesday 2 September 2026
Lam Research exec says automated preventive maintenance key to fabs of the future
A senior Lam Research executive told an industry audience this week that the next major leap in semiconductor manufacturing will not come from removing humans entirely from fabs, but...
Wednesday 2 September 2026
DRAM giants target 3D stacking to break memory wall and power bottlenecks
At a shared stage at Semicon Taiwan 2026, executives from Samsung Electronics, SK Hynix, and Micron agreed that traditional 2.5D high-bandwidth memory (HBM) using interposers is approaching...
Wednesday 2 September 2026
Fresh off Nasdaq listing, Pasqal turns to Taiwan's photonics industry to help it scale
Four days after listing on Nasdaq, Pasqal came to SEMICON Taiwan with an argument aimed squarely at its competitors: the industry's assumption that quantum computing delivers nothing...
Wednesday 2 September 2026
Semicon Taiwan 2026 to test cloud AI investment boom
Cloud AI capital expenditure continues to shatter market expectations, sparking growing concerns over whether the spending surge is overheating and heading toward a bubble. Semicon...
Wednesday 2 September 2026
Wonderful Hi-Tech expands Thailand, Vietnam capacity to capture emerging space data center, physical AI demand
Cable manufacturer Wonderful Hi-Tech announced its financial results for the second quarter and first half of 2026 during an earnings call held on September 1. A ramp-up in high-speed...
Wednesday 2 September 2026
Indium CEO: packaging, cooling and power are next AI bottlenecks
As AI and high-performance computing (HPC) continue to drive semiconductor advances, industry competition is shifting beyond chip performance toward packaging, cooling, assembly, and...
Wednesday 2 September 2026
Operations shake-up: how SpaceX is reengineering its AI data center strategy
Elon Musk has restructured the SpaceX leadership team tasked with constructing the company's AI data centers, replacing several leaders with executives drawn from SpaceX's rocket and...
Wednesday 2 September 2026
Dell says enterprise AI customers accelerated even faster than its record orders suggest
Dell Technologies' quarterly results showed record AI server orders and backlog, but executives used the earnings call's question-and-answer session on September 1 to disclose a more...
Wednesday 2 September 2026
Dell's AI server boom lifts profitability across its whole business
Dell Technologies closed its fiscal second quarter with revenue of US$47.0 billion, up 58% year over year, but the more telling number is what happened below the top line: operating...
Tuesday 1 September 2026
Research insights: AI Fabric optical interconnects move into racks as 400G/lane and CPO maturity emerge as key variables
DIGITIMES observed that as AI systems continued to scale, interconnect requirements inside AI data centers had expanded from chips, packages, and boards to racks, clusters, and eventually...