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Tuesday 1 September 2026
Silergy data center business surges as new products scale up
Silergy said at a recent earnings call that most of its applications, excluding its computing product line, posted quarter-over-quarter growth of more than 20% in the second quarter...
Tuesday 1 September 2026
AI Macs, Part 2: Mac mini, Mac Studio gain enterprise AI ground; Apple still lacks the platform
Apple's AI hardware momentum is forcing an enterprise question it did not plan for. Mac mini and Mac Studio are increasingly being used as local AI infrastructure, but Apple's business...
Monday 31 August 2026
Smart manufacturing, robotics drive renewed growth in industrial PCs
The industrial PC (IPC) industry is entering a new AI-driven recovery cycle as artificial intelligence moves into a broader range of real-world applications. Market research estimates...
Monday 31 August 2026
ASE: CPO scale-out demands deeper supply-chain coordination for mass production
SEMICON Taiwan 2026 kicked off its pre-show program with the Silicon Photonics Global Summit.
Monday 31 August 2026
US weighs limits on China's access to chips in overseas data centers
US restrictions on China's access to advanced computing could expand beyond physical chip shipments to the remote use of computing resources, potentially increasing compliance requirements...
Monday 31 August 2026
OpenAI to pull its models from Cursor, highlighting tension with SpaceX's Elon Musk
OpenAI announced that it will end its contract allowing its models to be used on Cursor due to the latter's acquisition by SpaceX. The development indicates the tense personal relationship...
Monday 31 August 2026
Asus launches physical AI business group, shifting from EMS to humanoid robots
Asustek Computer (Asus) is accelerating its artificial intelligence (AI) transformation plan, announcing the rebranding of its AIoT Business Group into the Physical AI Solutions Business...
Monday 31 August 2026
SiFive BigSky brings RISC-V into data centers with CUDA, Nvidia links and enterprise Linux
SiFive has introduced its BigSky SF-2U870 development server, positioning the 2U rack system as a platform for hyperscalers, software vendors and SoC developers to port server workloads...
Monday 31 August 2026
Musk tackles key AI power bottleneck with in-house turbine foundry
A move by SpaceX to manufacture turbine blades in-house could ease a global bottleneck in AI infrastructure, where power equipment is now as constrained as chips. If successful, the...
Monday 31 August 2026
India roundup: India broadens semiconductor and AI ambitions across manufacturing, design, materials and data centers
India's semiconductor ambitions are expanding from packaging and testing to chip design, materials, mobile devices and data centers. New investments by CG Power, Infineon, Foxconn,...
Monday 31 August 2026
USI advances optical interconnect push with ELSFP laser module
Universal Scientific Industrial (USI), part of ASE Technology Holding, is expanding its optical interconnect footprint for AI data centers. EugenLight Technologies, in which USI holds...
Monday 31 August 2026
Repon to ship Vera Rubin rails in August, ramp ASIC in September
Server rail maker Repon began shipping Nvidia's Vera Rubin rack products in August 2026, with ASIC server rack rails set for mass production in September. The higher average selling...
Sunday 30 August 2026
China writes its first national liquid-cooling standard as AI racks approach 1MW
AI infrastructure is entering a phase in which GPUs are no longer the only constraint. Nvidia's Vera Rubin generation is pushing rack power high enough to force parallel changes in...
Sunday 30 August 2026
Nvidia's US$36 billion cloud commitments expose the limits of vertical influence
As society ushers in the agentic AI era, the AI infrastructure space is simultaneously undergoing intense competition that increasingly tests the limits of technology, as industry...
Saturday 29 August 2026
Samsung bets on JWMT: can glass substrates flip the script for South Korea in advanced packaging?
As artificial intelligence (AI) chips continue to scale up in physical size, semiconductor competition is rapidly extending beyond front-end node scaling into advanced packaging. The...