CONNECT WITH US
SEMICON Taiwan 2024
SEMICON Taiwan 2024 runs from September 4-6 at Nangang Exhibition Hall
SEMICON Taiwan is a platform that connects Taiwan and global microelectronics ecosystems and also a bridge that facilitates smooth collaboration between the industry, the government, academia, and research institutions.

DIGITMES Asia provides basic users with unlimited access to toll-free articles. Sign up for free subscription now to continue your reading!

Subscribe Now
IN THE NEWS
Friday 6 September 2024
Dutch engineering expertise drives semiconductor industry forward
At Semicon Taiwan 2024, a group of Dutch companies showcased technologies quietly revolutionizing semiconductor manufacturing and related industries. These firms, many clustered around...
Friday 6 September 2024
Foxconn evaluates European semiconductor packaging plant, continues advanced technology development
Foxconn Chairman Liu Young-way revealed on September 4, 2024, that in addition to their existing investments in IC design and applications, the company is currently evaluating the...
Friday 6 September 2024
SEMICON Taiwan 2024 features first US Pavilion as Taiwanese semiconductors receive global attention
Taiwan's semiconductor industry chain has become a global focal point, and the scale of SEMICON Taiwan 2024 continues to expand. To highlight Taiwan's close collaboration with 56...
Friday 6 September 2024
Semiconductor giants unveil sustainability roadmaps at Semicon Taiwan 2024
Taiwan's semiconductor industry, a linchpin of the global tech supply chain, is grappling with an existential challenge: how to maintain growth while dramatically reducing its environmental...
Friday 6 September 2024
Advanced packaging material sales to skyrocket in 2025, says Topco Scientific
Topco Scientific, a supplier of semiconductor materials, anticipates substantial sales growth for advanced packaging materials in 2025 due to demand generated by AI applications.
Thursday 5 September 2024
UK semiconductor delegation eyes closer collaboration with Taiwan at SEMICON
The British semiconductor delegation, composed of 24 firms led by the UK Government's National Technology Adviser Dave Smith, has made its splash at SEMICON for the second year in...
Thursday 5 September 2024
Zhen Ding highlights growing role of IC substrates at SEMICON Taiwan 2024
Zhen Ding Technology made its debut at SEMICON Taiwan 2024, where the company highlighted the expanding role of IC substrates in advanced semiconductor manufacturing.
Thursday 5 September 2024
CHPT's AI initiative drives revenue growth and innovation in chip-testing solutions
Chunghwa Precision Test Tech (CHPT), a leading provider of chip testing and wafer probing solutions, expects significant growth in revenue and gross margin in the second half of 2024...
Thursday 5 September 2024
PSMC unveils Logic-DRAM and 2.5D interposer
On August 4, Powerchip Semiconductor Manufacturing Company (PSMC) unveiled the Logic-DRAM multi-layer wafer stacking technology and 2.5D interposers to meet rising AI demand.
Thursday 5 September 2024
Two Indian startups showcase innovations at Semicon Taiwan 2024
Two Indian startups, Silizium Circuits and Calligo Technologies, are making their mark at Semicon Taiwan 2024, as they seek to establish a foothold in the global semiconductor mark...
Thursday 5 September 2024
CHPT expects US customers for AI offering
At the SEMICON Taiwan 2024, Scott Huang, president of Chunghwa Precision Test (CHPT), a leading probe card manufacturer, remarked that the second half of 2024 is expected to outperform...
Wednesday 4 September 2024
AI sensors and edge AI take center stage at SEMICON Taiwan 2024
SEMICON Taiwan 2024, which kicked off on September 4, featured a MEMS & Sensors forum that focused on the future of AI. Industry leaders, including STMicroelectronics and Eminent...
Wednesday 4 September 2024
AI chip development still faces interconnect and other tech constraints, says MediaTek CEO
During a recent public discussion with Imec CEO Luc Van den Hove, MediaTek CEO Rick Tsai highlighted that there are still technical barriers to AI chip development, such as chip interconnect...
Wednesday 4 September 2024
IEDC leads economic delegation to Taiwan, opens new office
The Indiana Economic Development Corporation (IEDC), the US state's leading economic development agency, has sent Secretary of Commerce David Rosenberg and an economic delegation...
Wednesday 4 September 2024
FOPLP gains momentum in advanced packaging as AI demand surges
As advanced Chip-on-Wafer-on-Substrate (CoWoS) technology captures the spotlight in the semiconductor industry, fan-out panel-level packaging (FOPLP), another advanced packaging technique,...