Samsung Electronics' newly unveiled foldable phones Galaxy Fold5/Flip5, as well as Galaxy Tab S9 series are all equipped with the Qualcomm's "Snapdragon 8 Gen2 for Galaxy" APs, which...

Semiconductor materials distributor Wah Lee Industrial has enjoyed robust orders catering to customers' advanced packaging needs, such as TSMC's CoWoS, as a result of the AI server...

TSMC has announced that it will invest alongside Robert Bosch, Infineon Technologies, and NXP Semiconductors in European Semiconductor Manufacturing Company (ESMC) in Dresden, Germany...

Despite the raging US-China technology conflict, neither Nvidia nor TSMC can afford to give up the enormous business opportunities presented by the Chinese market. However, the top...

German media Handelsblatt reported on August 7 that TSMC is nearly finalizing its plan to build a fab in Dresden to produce chips for automotive applications. The report...

Intel has struck a deal with the US Department of Defense to develop and manufacture chips with its 18A (18-angstrom or 1.8nm) process technology under the DoD's Rapid Assured Microelectronics...

All the new iPhone series for 2023 are very likely to feature Dynamic Island display technology, but Taiwanese partners in the supply chain, such as camera modules...

While India is making solid strides toward developing its semiconductor manufacturing industry, more must be done on the product side to grow the ecosystem, according to Satya Gupta,...

Having just celebrated the inauguration of its Global R&D Center building in Hsinchu, TSMC has made clear that Taiwan will remain the core hub of its innovation and advanced-node...

Recognizing the strategic importance of semiconductor packaging technology, the South Korean government is reportedly initiating a major packaging technology R&D project aimed...

Leading lawmakers of Japan's ruling party revealed their willingness to offer lucrative subsidies to woo TSMC's investments as the chipmaking giant is reportedly looking to set up...

The expansion of TSMC's fabs abroad may be hampered by strong labor unions in the US and Europe, according to industry sources.

TSMC has recently initiated a new round of orders with advanced packaging equipment suppliers including Apic Yamada, Disco, Gudeng Precision Industrial and Scientech, according to...

AMD plans to incorporate TSMC's 3D SoIC (system on integrated circuits) stacking and chiplet packaging technology into its gaming notebook processors, following the company's implementation...

Global Unichip, an IC design services provider partnering mainly with TSMC, has lowered its revenue growth forecast for 2023 to a single-digit percentage, according to a report by...