With its sub-7nm process manufacturing, TSMC has won significant AI chip orders amid surging demand for generative AI applications, according to industry sources.

Taiwan's leading OSAT ASE Technology and its affiliate Siliconware Precision Industries (SPIL) have officially joined the supply chain of silicon photonics high-speed networking chips...

Almost all of TSMC's top-10 customers have readied plans to adopt the foundry's 2nm GAA-FET (gate-all-around field-effect transistor) process technology, to be commercialized in 2025...

I was invited to be a seminar moderator at the 2023 Taiwan Supercomputing Conference themed on AI 2.0, supercomputing, and the new ecosystem, recently organized by Taiwan Web Service...

China's tech giant Huawei and top semiconductor foundry SMIC apparently adopt different approaches against US chip curbs. The former has just announced its successful development...

TSMC has pledged to increase its investment in Japan, as company chairman Mark Liu reportedly has just taken part in a meeting convened by Japanese prime minister Fumio Kishida.

Nvidia has seen a ramp-up in orders for its A100 and H100 AI GPUs, leading to an increase in wafer starts at TSMC, according to market sources.

Most IC design houses and even the entire semiconductor supply chain previously expected business performances to improve quarter by quarter after hitting the bottom in first-quarter...

EDA specialist Synopsys has recently announced its collaboration with TSMC to deliver digital and custom design EDA flows on the foundry's most advanced N2 (2nm) process, aiming to...

Imec, the Belgium-based semiconductor research hub, announced on May 16 that GlobalFoundries, Samsung Electronics, and TSMC have joined its Sustainable Semiconductor Technologies...

NXP Semiconductors and TSMC have jointly announced their collaboration to deliver the industry's first automotive embedded MRAM in 16 nm FinFET technology.

Etron Technology has rolled out its new-generation stream processor unit (SPU) built using TSMC's 28nm process.

Rapidus, Japan's newly created semiconductor champion that seeks to reach 2nm production by 2027, indicated that it has completed the preparatory work of its first EUV lithography...

The adoption of advanced fan-out packaging among handset application processors has been sluggish, according to sources at backend houses.

TSMC will see the baseline 3nm process technology (N3B) dominate 90% of its N3 family capacity in 2023, and nearly 90% of the N3B capacity reportedly has been booked by Apple for...