The world's three leading game console vendors Sony, Nintendo and Microsoft have shown mixed sales results amid the supply crunch of some basic chips and components.
Robust AI and HPC processor orders have boosted TSMC's chip-on-wafer-on-substrate (CoWoS) packaging capacity utilization to nearly 100%, according to industry sources.
Texas Instruments (TI) has notified its clients that the supply-demand imbalance for analog chips, particularly power management ICs (PMICs), will ease in the second half of the year,...
US memory vendor Micron Technology is set to move its 1-gamma EUV process technology to volume production at its new fab, A3, in central Taiwan in 2024, and will install the first...
As a whole, the notebook market has seen a reversal in demand, with consumer models bearing the brunt of sales downturn. Shipments of education-use Chromebooks, which played a pioneering...
Pure-play foundries TSMC and Vanguard International Semiconductor (VIS) have both announced record-high sales for May 2022, on the heels of United Microelectronics' (UMC) announcement...
TSMC remains upbeat about its operations in 2022 and the coming decade, while its 3nm process is set to enter volume production later this year, according to company chairman Mark...
TSMC is unwavering in its goal of reaching 30% revenue growth by US dollars in 2022, as demand for automotive and high-performance computing (HPC) chips remains high, according to...
Taiwan-based ASE Technology and Unimicron Technology have both seized flip chip ball grid array (FC-BGA) packaging and related substrate orders for Apple's just unveiled M2 processors,...
Handset chips supply chain players share the view that their 2022 shipments for the segment will at best stay flat at 2021 levels, but HPC chip demand will continue to grow for datacenter,...
China's National Silicon Industry Group (NSIG) has newly disclosed plans to expand production capacity for 12-inch silicon wafers at a total investment of CNY6.79 billion (US$1.017...
United Microelectronics (UMC) reportedly is mulling raising its 2023 quotes by around 6% for 22/28 nm processes that have been in strong demand, despite uncertainties associated with...
TSMC is poised to boost its ties with memory chip vendors including Micron Technology and SK Hynix to strengthen the logic foundry's 3D silicon stacking and other advanced packaging...
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