Taiwan's leading backend house ASE Technology and its affiliate Siliconware Precision Industries (SPIL) have obtained major orders for processing Qualcomm's just-unveiled flagship...

TSMC has started pilot production of chips using its N3 process, and is on track to move the 3nm process to volume...

Samsung Electronics has been actively pursuing 3nm GAA chip orders, with speculation that AMD and Qualcomm could be among the first customers of its newer foundry process technology...

TSMC has kicked off pilot production of chips built using N3 (namely 3nm process technology) at its Fab 18 in southern Taiwan, and will move the process to volume production by the...

TSMC's 3DFabric family of 3D silicon stacking and advanced packaging technologies is in the next stage of its development, advancing from system integration to system scaling, according...

The Canada Semiconductor Council unveiled a report with the title "Roadmap to 2050: Canada's Semiconductor Action Plan" in November, trying to come up with a strategy to address the...

TSMC, ASE Technology and other Taiwan-based backend firms are all gearing up for the launch of Nvidia's Ada Lovelace-architecture RTX 40 series GPUs next year, according to industry...

TSMC, Kioxia and Micron Technology are reportedly expected to receive government subsidies in Japan to support their new fabs or expansion projects locally in Japan.

TSMC, United Microelectronics (UMC) and Vanguard International Semiconductor (VIS) are expected to see their combined revenues increase about 4% sequentially in the fourth quarter...

Peripheral backend supply chain players including makers of high-end customized IC testing sockets, wafer probe cards and burn-in boards, apart from ABF substrates, are all gearing...

Taiwan-based IC design houses particularly second-tier players are poised to see their profits eroded by rising foundry costs in 2022, as their customers are increasingly reluctant...

Going beyond Moore's Law has become an important force driving advanced semiconductor technology. Top companies such as TSMC, Samsung Electronics and Intel are all already seeing...

To meet surging demand for heterogeneous chips, TSMC is expected to adopt a more agile mode of cooperation with OSATs...

TSMC has outsourced part of its chip-on-wafer-on-substrate (CoWoS) packaging to OSATs including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and...