Samsung Electronics and Apple are poised to compete for the high-end smartphone share likely to be relinquished by Huawei, particularly in markets other than China - a race that will...

Apple is gearing up for the launch of its new-generation MacBook and iPad Pro series powered by its own Arm-based processors, which will be fabricated using TSMC's 5nm process technology...

Leading OSAT providers, such as ASE Technology, are expected to see revenues generated from their SiP businesses climb about 30% in 2020, driven by demand for 5G, AI and HPC device...

TSMC, ASE Technology, IC substrate makers including Unimicron Technology as well as international materials and equipment suppliers are all gearing up for the SiP (system-in-package)...

Apple will kick off its 5nm wafer starts at TSMC for its new Apple Silicon processors starting the fourth quarter of 2020, with monthly output estimated at 5,000-6,000 wafers, according...

The potential blacklisting of SMIC, China's largest pure-play foundry, by the US government may shake up the second-tier pure-play foundry market segment.

Materials analysis (MA), reliability analysis (RA) and failure analysis (FA) are increasingly needed by IC designers, wafer foundries and backend houses to support R&D projects...

Taiwan-based pure-play foundries have seen orders for PCs and handsets ramp up in the third quarter of 2020. Nevertheless, orders for PCs and handsets received thus far for the fourth...

Most IC suppliers experienced weaker demand and generally poor sales results in the first half of 2020 due to the coronavirus pandemic and strained US-China trade relations. However,...

System-in-package (SiP) demand will grow further on a wide range of applications enabled by the emerging 5G, AI and HPC technologies in 2021, according to industry sources.

TSMC is fast expanding output for advanced manufacturing nodes. Its 7nm process has already seen output reach 130,000...

Silicon Motion Technology with its PCIe Gen4 SSD controllers has reportedly cut into the supply chain of the world's top-4 notebook vendors for their new Tiger Lake products set for...

TSMC has already scaled up its 7nm process output to 130,000 wafers monthly ahead of schedule, with the monthly production set to climb further to 140,000 units at the end of this...

Ansys has achieved certification of its advanced semiconductor design solution for TSMC's CoWoS with silicon interposer (CoWoS-S) and InFO with RDL interconnect (InFO-R) advanced...

TSMC is set to open its R&D center for 2nm and more advanced manufacturing processes in Hsinchu in 2021, with plans to build its 2nm wafer fab nearby. TSMC has disclosed it is...