ASE Technology has reportedly grabbed flip-chip packaging orders for Qualcomm's just-unveiled flagship 5G SoC Snapdragon 888, as well as orders for the new integrated X60 5G modem,...
TSMC is expected to move its 3nm process to volume production in second-half 2022, but the foundry house reportedly is planning to launch an enhanced version of the 3nm...
TSMC plans to launch an enhanced version of 3nm process technology in 2023, with Apple being the initial customer adopting the process, according to industry sources.
Taiwan's III-V semiconductor supply chain players are gearing up to deepen deployments in the segment of GaN-based power components and RF modules increasingly applied to 5G handsets...
TSMC has held a ceremony marking the completion of the plant structure for its 3nm fab at the Southern Taiwan Science Park (STSP). The foundry house is expected to kick off commerical...
Photomask supplier Taiwan Mask (TMC) has expressed optimism about its operations in 2021, citing robust demand from 8-inch and 12-inch foundries for mature-node manufacturing.
TSMC has held a topping-out ceremony for a new 3nm fab at its manufacturing base at the Southern Taiwan Science Park (STSP), paving the way for the new facility to kick off commercial...
The world's top-15 semiconductor companies are forecast to see their combined sales increase 13% in 2020, slightly more than twice the expected total worldwide semiconductor industry...
TSMC has decided to build new facilities at its 12-inch fab in Nanjing to satisfy growing demand from the foundry's local customers in China, according to a report by Taiwan's Central...
ASE Technology has turned optimistic about the IC backend industry prospects for the first half of 2021 with high capacity utilization to linger in diverse processes despite the coronavirus...
Samsung Electronics has seen orders demanding 14nm and above processes ramp up from its China-based fabless clients recently, according to industry sources.
TSMC has seen strong demand for both of its advanced and mature manufacturing processes. Its 28nm node supply may become even tighter, as a Korean client is in talks with TSMC seeking...
IC capacity for leading-edge (sub-10nm) processes is expected to grow and become the largest portion of monthly installed capacity across the industry beginning in 2024, according...
Global Unichip Corp. (GUC), the advanced ASIC leader, disclosed today that it has successfully demonstrated the silicon-proven GLink (GUC multi-die interLink) interface using TSMC...
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