TSMC has introduced 3DFabric as its comprehensive family of 3D silicon stacking and advanced packaging technologies. 3DFabric complements the foundry's advanced semiconductor techn...

TSMC is working closely with a major client to accelerate its 2nm R&D and facilitate related investment procedure, the foundry disclosed at its online technology symposium on...

TSMC has unveiled its N12e process, a technology now in risk production optimized for edge AI applications.

TSMC is fast advancing its manufacturing processes. With volume production for 3nm node planned for second-half 2022, TSMC has disclosed that it has already obtained land in Hsinchu...

Government-developed Southern Taiwan Science Park (STSP) expects its revenues for 2020 to grow 15.7% on year to NT$860 billion (US$29.3 billion), mainly driven by TSMC ramping up...

TSMC plans to build its 2nm wafer fab in Hsinchu, where land has already been obtained for the facility, according to YP Chin, senior vice president for operations at the foundry...

TSMC has stepped up its expansion at the Southern Taiwan Science Park (STSP), having acquired several factory buildings, with the latest being a plant from an LCD panel maker.

TSMC has been devoting a lot of efforts to developing packaging technology in line with its efforts to extend the validity of Moore's Law. The foundry house's packaging...

TSMC is expected to continue its advanced packaging development focus on 3D SoIC (system on integrated chips) technology and organic interposer in 2021, although it has fabricated...

Taiwan's IC designers have benefited the most from China's de-Americanization campaign, but they will have to brace for new competition pressure from Chinese chipmakers aggressively...

Taiwan-based Trusval Technology swung to net profits of NT$45.19 million (US$1.54 million) in the second quarter from losses in the prior quarter, with gross margin climbing 18.76pp...

TSMC has marked the manufacture of the one-billionth good die on the foundry's 7nm technology, which means one billion functional, defect-free 7nm chips.

Samsung is stepping up its deployments in the 3D IC packaging field, looking to compete against TSMC starting 2022 for advanced chip packaging in-house, according to industry obser...

TSMC is going to disclose more about the development of its sub-3nm manufacturing processes and SoIC at its upcoming technology...

TSMC has announced the acquisition of a factory building and related facilities owned by E-Ton Solar Tech at the Southern Taiwan Science Park (STSP) for NT$860 million (US$29.2 million),...