Taiwan-based IC design houses are expected to enjoy a particularly robust fourth-quarter 2020, thanks to a strong pull-in of short lead-time orders from their China-based clients,...
TSMC is likely to make another upward adjustment to its capex outlook this year, due to strong demand for 7nm and 5nm process manufacturing, according to industry sources.
Charles Kau, formerly president for Taiwan's Nanya Technology, has stepped down as executive VP of global operations for Tsinghua Unigroup as his five-year contract with the China-based...
For the world, 2020 has been a roller-coaster year, but that has not dampend the prospects of some new tech applications such as mini LED backlighting which are expected to begin...
Many Taiwan-based IC design houses affiliated with United Microelectronics (UMC) are facing the pressure of being marginalized in scrambling for the firm's foundry support, as major...
The global IC foundry industry output is forecast to increase 17% to US$70 billion in 2020, and rise another 6.8% in 2021, according to Digitimes Research's latest report.
Increasingly tight 8-inch and 12-inch foundry capacity and resultant foundry quote hikes have posed mixed impacts on chip vendors in Taiwan, with second-tier ones struggling to get...
TSMC is expected to cumulatively purchase about 55 sets of EUV lithography equipment by the end of 2021, as the foundry is stepping up its EUV process manufacturing development, according...
Taiwan's IC design services providers has seen orders ramp up significantly so far this year from Chinese clients who are eager to develop ASICs, according to industry sources.
TSMC is on track to enter 3nm chip production with monthly output set to reach 55,000 wafers in the second half of 2022, according to sources familiar with the matter. The 3nm process...
TSMC is fast advancing its manufacturing processes, and it has already disclosed a plan to build a 2nm fab in Hsinchu, northern Taiwan. And if demand is strong, it may have to expand...
ASE Technology has already seen its chip-first FOCoS (fan-out chip-on-substrate) production yield reach 95-96%, and plans to introduce its chip-last FOCoS packaging technology with...
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