More China-based firms have become keen on in-house development of new-generation CPUs and GPUs, allowing Taiwan IC design service providers, especially those associated with TSMC,...

In addition to its tight 7nm chip supply, with delivery lead times extending to over six months, pure-play foundry TSMC has seen its supply of 16nm, 12nm and 10nm chips also fall...

Arm and TSMC have announced jointly an industry-first 7nm silicon-proven chiplet system based on multiple Arm cores and leveraging TSMC's chip-on-wafer-on-substrate (CoWoS) advanced...

Demand for 7nm manufacturing capacity at TSMC is so strong that long lines have been formed trying to secure supply from the foundry house for the advanced process. As supply is tight,...

Taiwan Semiconductor Manufacturing Company's heavy investments in advanced wafer-fab technology are set to pay off significantly for the world's largest silicon foundry as it continues...

TSMC has advised its clients to book foundry capacity well in advance for their 7nm chip demand for the entire 2020, according to industry sources.

AMD's second-generation EPYC server processors have landed significant orders from major IT players such as Dell, IBM and Nokia recently, with the chip vendor standing a good chance...

M31 Technology has announced its series of developments geared to optimize IP solutions for TSMC's specialty processes.

Unsatisfactory clock speeds are the cause of AMD delaying launch of its 16-core Ryzen 9 3950X processor, which has nothing to do with support from its foundry partner TSMC, according...

In the era of heterogeneous chips integration, Taiwan Semiconductor Manufacturing Company (TSMC) is expected be among global top-3 players in the advanced 3D IC packaging field along...

Entegris and Gudeng Precision Industrial, both of which have received ASML certification for their reticle pods for high-volume IC manufacturing using extreme ultraviolet (EUV) lithography,...

TSMC is expected to move its more advanced 5nm process technology to volume production as early as March, according to industry sources.

Intel has started placing equipment and materials orders for EUV fabrication processes since August, and is stepping up its pace of orders, according to industry sources.

The global semiconductor sector will experience constant quantitative and qualitative changes in the next 20-30 years, and heterogeneous integration will not be confined to CPU and...

TSMC has already kicked off 3nm process R&D, according to Philip Wong, VP of corporate research at the pure-play foundry. And with the evolution of Moore's Law, the company could...