Embedded non-volatile memory (eNVM) silicon IP developer eMemory Technology has won adoption of its NeoBit OTP (one-time programmable) technology by US- and Europe-based clients for...
Adoption of copper pillar bump for flip-chip (FC) packaging is expected to increase, with its proportion rising from 10-20% in 2010-2011 to 20-30% in 2015, industry sources quoted...
Taiwan Semiconductor Manufacturing Company (TSMC) continues to see orders heat up for advanced 28nm technology, despite a general slowdown in the semiconductor industry, according...
DRAM chipmakers Powerchip Technology and ProMOS Technologies are reportedly considering selling fabs in order to preserve cash and strengthen their financial structures. Bidders for...
Foundry chipmakers have seen short lead-time orders lose momentum, according to industry sources. Short lead-time orders were a key factor contributing to their revenue growth in...
ARM has announced the opening of a new R&D center at the Hsinchu Science Park, northern Taiwan. The focus of the center will be physical IP development and processor implementation...
Cash-strapped Powerchip Technology reportedly is exploring various options, including selling one of its 12-inch plants, in order to continue gaining support from its creditor banks,...
eMemory Technology, a Taiwan-based provider of embedded non-volatile memory silicon IP and technology, on November 14 announced that it has won 2011 IP Partner Award from Taiwan Semiconductor...
STATS ChipPAC is scheduled to hold an inauguration ceremony for a 12-inch wafer bumping and wafer-level packaging plant in Hsinchu County, northern Taiwan, Thursday (November 17),...
Taiwan Semiconductor Manufacturing Company's (TSMC) board of directors on November 8 approved a capex appropriation of US$1.06 billion specifically for increasing advanced technology...
Qualcomm, MediaTek, Nvidia and Spreadtrum Communications have all increased their wafer starts at Taiwan Semiconductor Manufacturing Company (TSMC) to meet anticipated demand for...
Taiwan Semiconductor Manufacturing Company's (TSMC) sales growth will continue to outperform the industry average in 2012, company chairman and CEO Morris Chang said at an investors...
Xilinx has announced the first shipments of its Virtex-7 2000T FPGA, the first product using 2.5D IC stacked packaging technology. The chip is built on TSMC's 28nm HPL (low power...
Taiwan Semiconductor Manufacturing Company (TSMC) has confirmed recent speculation that the company is suing Mong-Song Liang, a former R&D executive. The company said it is unable...
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