The rising popularity of generative AI is spurring demand for high-performance computing. This in turn fuels demand for edge system components and related applications, all of which bring along stringent testing requirements. Chroma ATE, an industry leader in the power test & measurement industry, has also secured a prominent position in the increasingly critical field of semiconductor component testing. To address the continually rising testing needs of domestic and international customers, Chroma recently hosted the Chroma ATE Semiconductor Test Seminar in Hsinchu, Taiwan, one of Asia's premier tech hubs. The event focused on sharing Chroma's next-generation solutions for GaN and RF component testing, all set to provide customers with exceptional test performance.

Chenbro, recognized as a global leader in server chassis products and solutions, achieved two Gold Awards at the 2023 MUSE Design Awards together with three Gold Awards at the 2023 TITAN Innovation Awards, in recognition of its innovative product design of Tri-load high-density storage server chassis series.

Munich, Germany and Durham, N.C. – January 23, 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a global semiconductor leader in power systems and IoT, and Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon carbide technology, today announced the expansion and extension of their existing long-term 150mm silicon carbide wafer supply agreement, originally signed in February 2018. The extended partnership includes a multi-year capacity reservation agreement. It contributes to Infineon's general supply chain stability, also with regard to the growing demand for silicon carbide semiconductor products for automotive, solar and EV applications and energy storage systems.

The AI wave continues to sweep across industries worldwide. The NVIDIA Jetson, an AI computing platform that can provide powerful computing for edge devices, boasts a full product line, high performance, and a robust ecosystem. It has become a top choice for optimizing operational efficiency in many vertical fields, and it is already leaving its mark in smart cities, industrial manufacturing, healthcare, retail logistics, and systems of other fields.

SK Hynix Inc. (or "the company", www.skhynix.com) announced today that it recorded an operating profit of KRW346 billion in the fourth quarter of last year amid a recovery of the memory chip market, marking the first quarter of profit following four straight quarters of losses.

With the global development of AI technology, there is a significant increase in demand for high-performance servers in both cloud computing and data center applications. Chenbro has proudly introduced next-generation server chassis solutions tailored for the latest Intel and AMD platforms to meet market demand. The cutting-edge enclosure solutions support cloud servers equipped with Gen5, providing a transmission speed twice as fast as Gen4 servers for achieving the highest levels of system performance. Additionally, Chenbro offers various hard-drive configuration options that support the complex growth of cloud-computing and hyper-scale data centers for customers worldwide.

Rugged embedded computing brand – Cincoze continues to deepen its embedded computer range. Two newly launched industrial computers (P2202 Series and P1201), released in 2023, have been widely favored by customers for their thin and light design, especially in mobile devices (AGV/AMR), control cabinets, and other space-constrained applications. Among their striking designs, the One Computer / Two Purposes function has attracted particular attention. They are not only slim embedded computers but, through the patented CDS (Convertible Display System, Patent no. M482908) technology, can also be transformed into panel PCs. They provide performance, screen size, display ratio, and touch options for various application environments, thereby creating diverse and flexible HMI and KIOSK applications.

In 2019, Amazon, Apple, Google, and Zigbee Alliance members came together to form Project Connected Home over Internet Protocol (CHIP), a working group building a new standard that enables IP-based communication across smart home devices, mobile apps, and cloud services, and ultimately unites the smart home.

iCatch Technology, a leading AI image processing IC design company, announced today a collaboration with Valens Semiconductor, a world leader in high-performance connectivity solutions, on an innovative AI-enhanced multi-channel surround view monitoring system based on Valens Semiconductor's MIPI A-PHY high-speed and long-range sensor connectivity technology. The live demonstration of this system will be featured at Automotive World Tokyo 2024 Booth E42-20 from January 24 to 26.

CXL, an advanced interconnect technology, facilitates high-bandwidth, low-latency connections between host processors and devices like accelerators and memory buffers. It addresses the "memory wall" challenge, ensuring consistency between CPU/GPU memory and connected device memory, enhancing heterogeneous computing performance. CXL, built upon PCIe interfaces, supports memory expansion beyond DIMM slots, overcoming the latency gap between main memory and SSD storage. It is crucial for AI applications, offering increased memory capacity and bandwidth, and contributing to high-performance computing.