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2016
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2018
2017
2016
2015
Special reports
13 Dec 2016
China smartphone market and industry – 3Q 2016
2 Dec 2016
China smartphone AP shipment 4Q forecast
30 Nov 2016
Taiwan handsets - 3Q 2016
23 Nov 2016
Taiwan notebooks - 3Q 2016
2 Sep 2016
Taiwan handsets – 2Q 2016
31 Aug 2016
China smartphone AP shipments - 2Q 2016
26 Aug 2016
China smartphone market and industry – 2Q 2016
17 Aug 2016
Taiwan notebooks - 2Q 2016
27 May 2016
China smartphone AP shipments – 1Q 2016
26 May 2016
Taiwan handsets – 1Q 2016
25 May 2016
China smartphone market and industry - 1Q 2016
9 May 2016
Taiwan notebooks – 1Q 2016
1 Mar 2016
Taiwan handsets – 4Q 2015
6 Feb 2016
China smartphone touch-panel industry 2016 forecast
5 Feb 2016
China smartphone market and industry - 4Q 2015
5 Feb 2016
China smartphone AP shipments - 4Q 2015
2 Feb 2016
Taiwan notebooks – 4Q 2015
27 Jan 2016
2016 global AP demand forecast
A-la-carte reports (single reports)
1 Apr 2016
Taiwan server shipment forecast and industry analysis, 2016
22 Jan 2016
Global tablet shipment forecast, 2016
21 Jan 2016
Global notebook shipment forecast, 2016 and beyond
BIZ FOCUS
May 7, 09:54
Navigating the maze: Export compliance in electronics industry
Tuesday 7 May 2024
ABB Technologies at core of Net Zero transition
Tuesday 7 May 2024
STAr Technologies and EDA Industries announce strategic partnership
Tuesday 30 April 2024
Era of earbud compromises now over; Skyline, xMEMS solid-state acoustic vent, enables earbuds that excel in every situation
TOP STORIES
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China's chip self-sufficiency dream a 21st Century Great Leap Forward? How much longer can it subsidize?
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Speculation arises about Apple exploring collaboration with EV startup
China-based semiconductor equipment suppliers continue to see explosive growth
Qualcomm, MediaTek unfazed by Huawei rebound
Taiwan fab toolmakers eyeing orders from Malaysia
Apple unveils M4 iPad Pro, setting new benchmark for AI notebooks
GenAI can improve chip design efficiency, says Cadence
IC backend houses raise 2024 capex
Intel joins forces with Japanese firms to automate chip packaging by 2028
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