TSMC has stepped up its pace of orders with backend equipment suppliers, as the foundry commences its chip-on-wafer-on-substrate (CoWoS) packaging capacity expansion plan, according...
The continuous expansion of TSMC's fab in Taiwan, home to the world's largest pure-play foundry, is essential for preserving the country's supply chain advantages, according to industry...
The global panel industry is currently witnessing a robust resurgence in demand, leading to a significant uptick in operating rates. This positive trend is cascading up the supply...
The Chinese government has recently announced without prior warning that it will control exports of gallium and germanium metals. The announcement has received extensive media coverage,...
Japanese media Nikkan Kogyo reported that TSMC has drawn up a plan to start construction of a second wafer fab in Kumamoto Prefecture, Japan, from April 2024 onwards. The location...
Taiwan-based diode maker Eris Technology has announced the acquisition of a factory in Taiwan from its parent company Diodes, with plans to increase output from its 6-inch wafer ca...
Pure-play foundry Powerchip Semiconductor Manufacturing (PSMC) has reached a deal with SBI Holdings under which the Taiwan-based company will gain the investment firm's support to...
Most Taiwan-based GaAs foundries, including Win Semiconductors and Advanced Wireless Semiconductor (AWSC), have recently seen their 6-inch fab utilization rates rise above 40%.
The industry once rumored that Samsung Electronics postponed the construction of the fourth fab (P4) in Pyeongtaek Park, South Korea, due to the deterioration of the semiconductor...
Pure-play foundry TSMC will see its fab utilization rates, notably for sub-7nm process manufacturing, rise substantially in the second half of this year, according to sources at fab...
Applied Materials has announced its intention to establish a collaborative engineering center in Bangalore, India that will focus on the development and commercialization of semiconductor...
TSMC has readied plans to build new CoWoS (Chip on Wafer on Substrate) capacity at its manufacturing complex in the Central Taiwan Science Park (CTSP) to meet a rapid surge in demand...
Upon implementation of the European Chips Act, TSMC and Intel are enticed to make substantial investments in Europe, whereas Samsung Electronics maintains a wait-and-see attitude...
