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NEWS TAGGED STATS CHIPPAC
Tuesday 20 August 2013
STATS ChipPAC delivers ultra thin PoP solutions with eWLB packaging
STATS ChipPAC has announced it has reduced package-on-package (PoP) height with its ultra thin embedded wafer level ball grid array (eWLB) technology. The eWLB-based PoP solutions...
Friday 12 July 2013
STATS ChipPAC Taiwan 2Q13 sales up over 15%
Wafer probing service provider STATS ChipPAC Taiwan Semiconductor, a subsidiary of Singapore-based STATS ChipPAC, saw its second-quarter sales increase more than 15% sequentially...
Monday 1 July 2013
STATS ChipPAC to close Malaysia plant
STATS ChipPAC, which provides IC assembly and test services to semiconductor companies and electronics OEMs, has unveiled plans to consolidate manufacturing at its production units...
Wednesday 29 May 2013
STATS ChipPAC to pump another US$500 million into expansion in Singapore
STATS ChipPAC has unveiled plans to invest another US$500 million to expand its operations in Singapore, where the IC backend house is headquartered.
Friday 3 May 2013
Worldwide semiconductor assembly and testing revenues up 2% in 2012, says Gartner
The worldwide semiconductor assembly and test services (SATS) market totaled US$24.5 billion in 2012, a 2.1% increase from 2011, according to Gartner.
Tuesday 12 March 2013
IC testing firms post revenue drops in February
King Yuan Electronics (KYEC), Sigurd Microelectronics and STATS ChipPAC Taiwan Semiconductor all suffered sequential revenue decreases in February 2013, due to inventory adjustments...
Tuesday 29 January 2013
STATS ChipPAC, UMC unveil 3D IC developed under open ecosystem model
STATS ChipPAC and United Microelectronics Corporation (UMC) have jointly announced the first demonstration of TSV-enabled 3D IC chip stacking technology developed under an open ecosystem...
Tuesday 29 January 2013
STATS ChipPAC enters into license and settlement agreement with Tessera
STATS ChipPAC announced on January 29 that it has signed a patent license and settlement agreement with Tessera. The agreement results in the dismissal of all claims and counterclaims...
Thursday 24 January 2013
Spreadtrum adopts STATS ChipPAC eWLB packaging for smartphone ICs
Spreadtrum Communications has adopted STATS ChipPAC's embedded wafer-level ball grid array (eWLB) packaging solutions for a number of its mobile chipsets used mainly in smartphones...
Friday 4 January 2013
STATS ChipPAC raises 4Q12 revenue outlook
STATS ChipPAC, a semiconductor test and packaging service provider, has revised upward its fourth-quarter revenue guidance to a 16-18% sequential increase from the 2-8% growth estimated...
Monday 24 December 2012
KYEC, Ardentec 1Q13 sales to drop up to 10%
Taiwan-based IC testing firms King Yuan Electronics (KYEC) and Ardentec are expected to post sales decreases of up to 10% sequentially in the first quarter of 2013, in line with seasonal...
Saturday 22 December 2012
STATS ChipPAC Taiwan 1Q13 sales to buck seasonal trends
Testing house STATS ChipPAC Taiwan Semiconductor, a subsidiary of Singapore-based STATS ChipPAC, is expected to enjoy a particularly strong first quarter of 2013 buoyed by strong...
Wednesday 5 December 2012
iPhone 5 yield rates improving, say sources
Yield rates for the production of iPhone 5 in the supply chain appear to have improved recently, as Apple has shortened the standby period for pre-sale orders in the US and Europe...
Tuesday 20 November 2012
STATS ChipPAC to expand operations in Korea
STATS ChipPAC has announced plans to expand its semiconductor assembly and test operation in South Korea. The Singapore-based backend house added that it has signed a non-binding...
Friday 5 October 2012
STATS ChipPAC to sell stake in China joint venture
STATS ChipPAC has announced plans to sell its 25% stake in a China-based joint venture to co-owner Wuxi China Resources Microelectronics, a wholly-owned subsidiary of China Resources...