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NEWS TAGGED WIRE BONDING
Wednesday 30 March 2022
Smaller OSATs may cut quotes to win wirebonding orders in 2H22
A wirebonding capacity supply glut is arising from fast capacity expansions at OSATs, which may lead them to cut quotes in the second half of 2022 to bolster their capacity utilization,...
Thursday 24 March 2022
China OSAT growing advanced packaging capability
Having hired R&D talent from Huawei's HiSilicon, China's leading OSAT Jiangsu Changjiang Electronics Technology (JCET) has been developing its flip-chip(FC) packaging, 2.5D IC,...
Wednesday 9 March 2022
MediaTek seeing handset AP inventory swell
MediaTek has seen its inventory level for handset application processors (including 4G and 5G ones) swell to 160-180 days from past regular levels of around 100 days, due mainly to...
Monday 7 March 2022
OSATs slowing down wirebonding capacity expansions for 2H22
Taiwan's OSATs are slowing down their logic IC wirebonding capacity expansions as the visibility of orders for processing consumer ICs is still unclear beyond the second quarter of...
Tuesday 14 September 2021
IC packaging materials distributors enjoy strong wire-bonding demand
IC packaging materials distributors continue to see strong demand for wire-bonding operations despite uncertainties facing sales of notebooks, handsets and other end-market devices...
Friday 10 September 2021
Taiwan OSATs install additional wire-bonding equipment
Taiwan OSATs, including ASE Technology, Greatek Electronics, Lingsen Precision Industries and Orient Semiconductor Electronics (OSE), have all begun to install additional wire-bonding...
Tuesday 31 August 2021
Quotes for wirebonding packaging to rise in 1H22
Backend houses are expected to raise their quotes for wirebonding packaging in the first half of 2022 to reflect higher material costs, according to industry sources.
Tuesday 8 June 2021
Taiwan backend capacity tightens further on COVID cluster infections
Taiwan's backend capacity supply is being further constrained by COVID cluster infections at some OSATs including King Yuan Electronics (KYEC) and Greatek Electronics.
Monday 31 May 2021
Epoxy molding compound supply now 20% short of demand
The global supply of epoxy molding compound for backend applications has fallen short of demand by 20% with delivery lead times extended further, according to industry sources.
Thursday 20 May 2021
Backend houses see strong demand for display peripheral ICs
Backend demand for display peripheral ICs, such as T-Con and TDDI chips, has been robust, and major OSATs such as ASE Technology and Greatek Electronics are busy processing such chips...
Thursday 13 May 2021
Global chip shortage to persist until 2Q22, says Gartner
The worldwide semiconductor shortage will persist through 2021, and is expected to recover to normal levels by the second quarter of 2022, according to Gartner.
Thursday 29 April 2021
ASE raises capex projection for 2021
Taiwan's leading OSAT firm ASE Technology Holding will raise its capex budget by 10-15% to up to US$2 billion for 2021, from the previous estimation of US$1.7 billion, according to...
Tuesday 9 March 2021
Fabless IC firms facing quote hikes at backend partners
Taiwan's IC designers are facing increasingly tight capacity and resultant quote hikes at their backend partners though foundry capacity they booked in fourth-quarter 2020 are being...
Thursday 28 January 2021
Backend firms upbeat about demand for MediaTek chips
Backend houses in the supply chain of MediaTek have expressed optimism about demand for the fabless client's 5G, Wi-Fi 6 and automotive chip solutions in 2021, and are ramping up...
Wednesday 27 January 2021
Logic IC packager Greatek to raise quotes later in 1Q21
Greatek Electronics, a Powertech Technology (PTI) subsidiary dedicated to logic IC packaging, plans to raise its quotes between the end of February and the beginning of March to reflect...