Sony has entered negotiations with Apple to double its supply of camera components for a new iPhone slated to roll out as early as next year.

Infineon Technologies has projected sales growth in its fiscal second quarter as orders for automotive and identity-checking components rise.

ARM and SMIC have announced an agreement to offer the ARM Artisan physical IP platform for SMIC's 28nm poly SiON process to provide high-performance, high-density and low-power technologies for SoC designs.

Struggling chip-maker Renesas Electronics will withdraw from the market for small liquid crystal displays as part of efforts to turn around its business, an industry source said Saturday.

IBM is exploring a sale of its semiconductor business in what would be its most significant strategic move since it faced a financial crisis in the early 1990s.

Both companies gain access to each other's industry-leading patent portfolios under the agreement, which covers a broad range of products and technologies.

Under the terms of the licensing arrangement, Imagination will receive on-going license fees, and royalty revenues on shipment of SoCs (Systems on Chip) incorporating Imagination's IP.

Cadence Design Systems has entered into a definitive agreement to acquire Forte Design Systems, a provider of SystemC-based high-level synthesis (HLS) and arithmetic IP.

Qualcomm may be hit with a record fine exceeding US$1 billion in a Chinese antitrust probe, raising the specter of harsh penalties for foreign firms facing an increasingly aggressive regulator.

Sir John Buchanan, chairman of ARM, is preparing to step down from the role less than a year after the departure of long-term chief executive Warren East.

The portfolio, comprising approximately 1,400 granted patents and pending patent applications from the US and approximately 1,000 granted patents and pending patent applications from other countries, covers technologies that include fundamental mobile operating system techniques.

Flash memory card maker SanDisk has reported an increase in profits for the fourth quarter, due largely to higher revenues and strong margins.

ASML expects new extreme ultraviolet lithography machines to reach a production standard that satisfies all of its semiconductor-equipment customers by 2017, CEO Peter Wennink said.

AMD on Tuesday said it will be sampling 64-bit ARM system-on-a-chip (SoC) products to customers this quarter and is "on track to launch one of the industry's first 64-bit ARM server SoCs in 2014."

For years, Intel has been battling to replace ARM-based chips used in smartphones and other mobile devices. Now it has partly succumbed to the low-power ARM approach.

The chipmaker announced that it was cutting 1,100 jobs in the US, India and Japan as it moves to "reduce investments in markets that do not offer sustainable growth and returns."

AMD was profitable for the second consecutive quarter, thanks in large part to the success of the gaming consoles from Microsoft and Sony that are powered by the vendor's chips.

Renesas Electronics will slash 5,400 jobs in Japan, or about one quarter of its domestic workforce, reports said Wednesday, as the struggling Japanese chipmaker overhauls its money-losing business.

Chipmaker Intel said Friday it plans to reduce its global workforce by over 5,000 people over the next year.

The slow pace of change in the flash-manufacturing industry means that prices of SSDs will likely hold steady compared to 2013, but price hikes could be in the offing.

Panasonic plans to sell three chip-assembly plants in Southeast Asia to Singapore's United Test and Assembly Center (UTAC), sources familiar with the matter said on Friday, as part of Panasonic's global reorganisation.

South Korea's Samsung has sold its entire stake in British chip maker CSR shortly after the company said it was retreating from the digital camera market.

Intel said it will delay opening a new factory in Arizona amid a slump in demand for PC microprocessors, its main source of revenue.

Marvell Technology might be the next big client for Intel's contract manufacturing operations, said Citigroup's chip analyst Glen Yeung.

Intel will add support for DDR4 memory to its high-end computers in the third quarter of 2014, sources familiar with the company's plans said.

Canon is shifting capacity back to Japan in an apparent vindication of Prime Minister Shinzo Abe's yen-weakening policies, which have made it more profitable for some Japanese manufacturers to produce and export from home.

An explosion and fire at a Mitsubishi Materials chemical plant in central Japan on Thursday afternoon killed five people and injured at least 12 others, Yokkaichi police said.

ARM's chief executive has said the emergence of low-cost smartphones and Apple's move into China will drive sales at the British microchip designer.

MediaTek is demonstrating its first LTE modem platform in its booth at CES 2014 located inside the Venetian Hotel, Las Vegas.

United Microelectronics (UMC) has surpassed 15 million shipments for customer small display driver ICs (SDDI) manufactured using the foundry's 55nm embedded high voltage (eHV) technology.

Qualcomm's CEO said his company has the capabilities to build ARM server chips but was careful not to disclose any product plans at the International CES in Las Vegas.

TSMC and AMD, and other companies have seen more than US$200 million in sales in 2013 for computing components used to create Bitcoins, Wedbush Securities said.

eMemory and Semiconductor Manufacturing International (SMIC) plan to expand the deployment of their current collaboration on SMIC's eNVM platform development. The platform covers both one time programmable (OTP) and multiple times programmable (MTP) eNVM technologies, such as NeoBit, NeoFuse, NeoEE and NeoMTP, across a wide range of technology nodes ranging from 0.35-micron to 40nm.

Toshiba and SK Hynix will begin joint production of next-generation memory chips as early as fiscal 2016, bringing them to market ahead of US firm Micron Technology, The Nikkei learned Wednesday.

The new 358,000 square-foot facility will become TI's seventh assembly/test (A/T) operation. Located on the same property as TI's existing wafer fab in Chengdu, the site will become the company's only end-to-end wafer fabrication and A/T facility.

An executive of SK hynix said Thursday the firm will cooperate with Advanced Micro Devices (AMD) to supply highly-advanced chips for data-intensive devices.