"...this JV will drive global adoption of contactless smart card applications in mobile phones using near-field communication...NXP and Sony will continue to offer chips and applications based on their respective technology platforms MIFARE and FeliCa, while developing NFC technologies jointly"

"...a semiconductor analyst at Jefferies is saying that AMD is negotiating the sale of Fab 38 (previously Fab 36, 200mm) to TSMC...one start-up engineer at Fab 38 said that a small tool set was being installed at Fab 38 to assist in the qualification of AMD’s 45nm process...No mention that executives could be in talks to sell the fab..."

"...will produce DRAM in Taiwan using 66nm process technology in a strategic partnership with Taiwan-based ProMOS...it will churn out the advanced chips from 1Q08...it has already reported the plan to the South Korean government and is positive about getting government approval..."

"...Samsung sold LCD TVs, DVD players, MP3 music players and other items in Japan via the Internet, but stopped at the end of October. It had ceased sales in retail outlets in August last year...Samsung will sell flat screen computer monitors directly to businesses and will continue to sell components such as memory and LCDs. The company will also keep supplying mobile phone handsets to Softbank..."

"...Hynix is planning to produce 66nm DRAM chips in Taiwan through ProMOS Technologies and it is already producing the same chips at Wuxi, China...designates less than 80nm semiconductor technology as a core technology that needs government protection..."

"...Elpida CEO said if a Taiwanese chipmaker such as ProMOS or Nanya were to join them, combined production may exceed Samsung's...Nanya spokesman said the company is very honored by Sakamoto's comments. ProMOS spokesman said an alliance with Elpida would make sense...a Samsung spokesman in Seoul declined to comment...Spokesman at Powerchip said the Taiwanese chipmaker and Elpida will jointly make decisions on the Japanese chipmaker's strategy and expansion in Taiwan..."

"...the IBM-led Common Platform plans to step up its investment in semiconductor packaging technology to pave the way to 32nm devices... Although Amkoris part of the alliance, the group has not yet fully engaged in advanced packaging issues with them..."

"...During our fourth quarter, price pressure continued in the DRAM industry with spot and contract prices declining to new lows...we are confident that we will have more than 50 percent conversion to 80nm and 75nm in December 2007...."