Around the web news tagged Semiconductors

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Displaying links tagged Semiconductors [back to index]

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15 Nov 2004

China Telecom picks Cisco To build Internet network (Nov 12)

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European EMS firm Elcoteq focuses on design to tap surging handset demand (Nov 15)

12 Nov 2004

Taiwan chip giant seeks strong partnerships (Nov 11)

Dell CEO says considering AMD chips for servers (Nov 11)

Agilent's sales below forecast amid chip, ATE slowdown (Nov 11)

Micron strikes deal with US in price fixing probe (Nov 12)

Asian stocks rise, led by Canon, Samsung Electronics, Taiwan Semiconductor (Nov 11)

VIA VPN utility helps build secure Linux gateways, distributed apps (Nov 11)

Bullish analyst comments advance AMD shares (Nov 11)

Samsung to sell US high-speed phone in early 2005 (Nov 11)

Intel readies Centrino-style push for desktops (Nov 11)

Microsoft skips Itanium with new Windows (Nov 10)

Intel board backs Otellini as CEO (Nov 11)

Dell CEO Rollins says considering AMD chips for servers (Nov 12)

11 Nov 2004

Samsung shows 1Gbit 'OneNAND' flash phone memory (Nov 10)

Micron overtakes Hynix in chip sales (Nov 11)

Superfast notebook graphics: NVidia's GeForce Go 6800 (Nov 10)

Leadis Technology announces new CSTN LCD driver IC (Nov 10)

Korea-Japan technology war escalates (Nov 10)

ST debuts megapixel camera chipset for mobile devices (Nov 8)

Freescale claims 90nm lead, sees 65nm tape-out mid-2005 (Nov 10)

10 Nov 2004

AMD and Chartered sign sourcing and manufacturing technology agreements

China mobilizing on 3G IP (Nov 8)

UMC head criticizes rival Chang (Nov 10)

Electronica: Xilinx focuses on low-power (Nov 9)

MRAM, FeRAM offer new levels of performance (Nov 9)

ASML lands lithography order from Matsushita (Nov 9)

The CEO interview: with Intel's Craig Barrett (Nov 9)

STMicroelectronics is set to drive SiC-device competition (Nov 9)

Infineon reports increased revenues and earnings for fourth quarter and fiscal year 2004 (Nov 9)

9 Nov 2004

TI begins producing DSPs using 90-nm technology (Nov 8)

Hurdle looms over Hynix, ProMOS cooperation deal (Nov 8)

STATS ChipPAC expands die stacking technology for high performance leadframe based packages (Nov 8)

STATS ChipPAC has further expanded its die stacking technology to include two leadframe based performance packages, exposed pad Thin QFP (TQFP-ep) and the Quad Flat No Lead (QFN) package family.

Spansion plans new breed of chip (Nov 8)

8 Nov 2004

Copper prices surge as demand picks up in China and the US (Nov 8)

Siemens to buy stake in VA Tech, makes offer for rest (Nov 8)

File-sharing network consumes one third of Internet bandwidth (Nov 8)

Intel preps speedier Pentium 4 (Nov 5)

2005 sales to grow on memory, iSuppli says (Nov 5)

Lead-Free: Managing the changeover (Nov 5)

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