Microsoft is committing to use chips based on ARM Holdings technology in the machines that run its cloud services, potentially imperiling Intel's longtime dominance in the profitable market for data-center processors.

Taiwan's Foxconn, the world's largest contract electronics maker, is not a favored bidder for Toshiba's memory chip business due to its close ties with China, sources with direct knowledge of the deal said.

Unigroup mobile-design subsidiary Spreadtrum & RDA and the British supplier of chips to Apple's iPhones and iPads are considering a joint venture in eastern China, through which the pair will jointly design communications components.

China has reported its first monthly trade deficit in three years, after imports surged and a slowdown during the Lunar New Year holidays hit output.

Hewlett Packard Enterprise said it would buy data storage provider Nimble Storage Inc for $1.09 billion in cash, to expand its presence in the fast-growing flash storage business.

German-based chipmaker X-Fab Silicon Foundries SE expects to raise about EUR500 million ($530 million) via an initial public offering in order to fund its global production expansion.

Japan's SoftBank is set to sell a roughly $8bn stake in Arm, the UK chip designer it purchased only six months ago, placing 25% of Britain's largest technology company into a new, Saudi-backed $100bn investment fund.

There's a lot of pressure on Apple's next iPhone to deliver, both in product quality and sales.

A Donald Trump campaign sign remains atop a pile of gravel in Harrisburg, Penn, where Foxconn said in 2013 it'd build a $30 million factory. It didn't happen, but more promises have returned. "Foxconn is going to spend a tremendous amount of money on building a massive plant," Trump said, "and probably more than one."

One of a handful of startups aiming to attack Broadcom's dominance in Ethernet switching emerges from stealth mode this week. Nephos spun out of Taiwan's Mediatek and will push packaging technology from TSMC to a new level.

In an attempt to regain its mojo, Toshiba will double down on traditional products that are seen as part of promising growth segments.

Evan Blass is back with information on the Galaxy S8. According to Blass, the device will now release on April 28th. This sets the date back by one week. Reasons for the delay include alleged quality control and production delays for the Snapdragon 835, on both Samsung and Qualcomm's ends. Blass isn't sure about the exact reason though, only that the rumored release will now take place a week later.

Industry watchers predicted SK Hynix may join hands with Taiwanese company Foxconn, also known as Hon Hai Precision Industry, to acquire Toshiba's chip business. Foxconn's Chairman Terry Gou has been "very serious" about bidding for Toshiba's memory chip business.

Under the terms of the deal, Cypress will sell a subsidiary that owns the fab to a startup foundry, SkyWater Technology Foundry, backed by a Minnesota-based holding company. SkyWater will operate the fab, manufacturing wafers for Cypress and for other chip firms, Cypress said.

Apple is developing a new camera with "3D sensing and modeling capabilities" that could "reinvent the user experience" to be included in a redesigned iPhone expected to launch later this year, according to new research from KGI Securities analyst Ming-Chi Kuo seen by Business Insider.

We are hearing that Intel is still struggling with defect/yield issues with this advanced process for High Volume Manufacturing (HVM) release and have not locked down the complete process of records (PORs) to date. While the production ramp target at Fab 28 is 2H17, there are concerns that this ramp could be delayed by 2-3 months.

"We don't expect many projects on our latest high-end chip," Mediatek Co-Chief Operating Officer Jeffrey Ju told reporters in a press briefing Monday at the Mobile World Congress here. "For now, we think less than 10 smartphone models will adopt this high-end X30 chip."

Despite a turbulent past, Windows PCs with ARM are making a grand return later this year, but only with Qualcomm chips. Another big ARM chipmaker, MediaTek, is sitting out the opportunity to put its ARM-based chips in Windows PCs because the company sees it as a limited opportunity.

Lattice Semiconductor has moved a step closer to being acquired by an investment firm backed by China's central government, announcing Tuesday (Feb. 28) that its shareholders have approved the terms of the $1.3 billion deal.

Nexperia has been officially launched as an independent supplier of discrete, logic, and MOSFET devices.

Xiaomi has managed to secure itself a decent shipment of Snapdragon 835 chipsets for use in the company's upcoming high-end smartphone, Mi6.

Intel split the Cyclone 10 into the performance-oriented GX and low-power optimized LP series. The GX series uses TSMC's 20nm process and is geared for a number of uses in the industrial, automotive, and broadcast markets. These include machine vision, robotics, infotainment, Advanced Driver Assistance Systems, and audiovisual applications.

Despite the rumors that Samsung was hogging all the Snapdragon 835s for itself, Sony has brought a device with Qualcomm's top-of-the-line 2017 SoC to MWC.

According to industry sources, SK Hynix is planning to triple its investment in foundry business this year. To this end, SK Hynix recently organized a task force at its M8 foundry plant located in Cheongju, North Chungcheong Province.

Samsung will sell modified versions of the Galaxy Note 7 in emerging markets, including India and Vietnam, according to Hankyung, which claims the move is designed to help Samsung minimise losses and avoid a potential environmental fine.

Intel's modems aren't as good as Qualcomm's, but the company scored a major victory last year when some of its modems began shipping in some models of Apple's iPhone 7.

China's state-backed Tsinghua Unigroup is pushing for an initial public offering of its mobile chip unit, Unigroup Spreadtrum RDA, in 2018, sources told Nikkei Asian Review.

Most of the hand-wringing over the fate of Moore's Law focuses on the ever-shrinking silicon transistor. But increasingly researchers are concerned with another critical part of the infrastructure: the copper wires that connect individual transistors to form complex circuits.

How will this affect Samsung's businesses? For the time being, they seem to flourish or flounder no matter who the company's titular leader is.

Toshiba wants to pick the preferred bidder or bidders for a majority stake in its chip unit by the end of May and will hold the first round of bids next month, a source with knowledge of the plan said.

Toshiba has asked potential bidders for its memory chip business to peg the operations' value at JPY2 trillion (US$17.6 billion) or more, aiming to maximize income from the sale of its crown jewel.

Toshiba is looking to raise at least JPY1 trillion (US$8.8 billion) from the sale of its memory chip business and will aim to complete the transaction by March 2018, according to a person familiar with the matter.

Despite the calamities surrounding Samsung's heir apparent Lee Jae-Yong right now, the shareholders of Harman International have voted to approve the company's merger with Samsung Electronics.

Samsung hopes to avoid another disastrous recall by adding a third battery supplier for its new smartphone.

An upcoming Apple iPhone is likely to have a customized wireless charging system made with Broadcom, according to JPMorgan analyst Harlan Sur.

Infineon does not expect to be able to salvage its $850 million purchase of Cree's Wolfspeed Power, which is under US scrutiny over unspecified government security concerns, the German chipmaker said on Thursday.

TetraVue, a company setting out to arm autonomous cars with ultra high-resolution 3D image-capturing smarts, announced it has raised $10 million from Robert Bosch Venture Capital, Nautilus Venture Partners, Samsung Catalyst Fund, and Foxconn.

Apple will in the coming months start assembling its lower-priced iPhone SE models at a contract manufacturer's plant in the southern Indian technology hub of Bengaluru, an industry source with direct knowledge of the matter said on Friday.

Apple's widely expected 5.8-inch iPhone with an edge-to-edge OLED display will feature a front-facing 3D laser scanner for facial recognition, corroborating previous rumors, according to JPMorgan analyst Rod Hall.

For what Intel's data center chief Diane Bryant called the upcoming "10nm+" node, as well as the 7nm manufacturing node to follow, Intel's data center chips will be first on those lines.