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Winbond secures NT$7.7 billion loan

Press release, June 4; Esther Lam, DIGITIMES Asia Wednesday 4 June 2008 0

Winbond Electronics announced that it has signed a NT$7.7 billion (US$254 million) five-year syndicated loan agreement to fund its expansion plan and technology upgrade of its 12-inch wafer fab in the Central Taiwan Science Park (CTSP).

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