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U.S. government announces up to $300 million in funding to boost advanced semiconductor packaging

Despite start of new AI server shipments, server ODMs see gross margins fall

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Server component providers welcome new era with Nvidia GB200 mass production

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PCB and CCL firms gearing up for AI server boom

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GB200 peripheral chip suppliers delighted with Blackwell cooling issues addressed

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First Dimensity 9400 AI mobile phone debut; Vivo expects X200 sales to treble

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Home Tech Communications

NTT Docomo to form fabless JV with 5 chip firms

Press release; Jessie Shen, DIGITIMES Asia Wednesday 28 December 2011 0

NTT Docomo has reached a basic agreement with five companies - Fujitsu, Fujitsu Semiconductor, NEC, Panasonic Mobile Communications and Samsung Electronics - to establish a fabless joint venture company by the end of March 2012 to develop and sell semiconductor...

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Colder Products Company

SK Hynix starts mass production of world's first 321-high NAND

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