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Globalfoundries demos 3D TSV capabilities on 20nm

Press release; Jessie Shen, DIGITIMES Asia Wednesday 3 April 2013 0

Globalfoundries on April 2 announced the accomplishment of a key milestone in its strategy to enable 3D stacking of chips for next-generation mobile and consumer applications. At its New York fab, the foundry has demonstrated its first functional 20nm...

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