Asia Tech Image steps into COB packaging of smartphone CCMs, says paper

EDN, January 16; Adam Hwang, DIGITIMES Asia Friday 17 January 2014 0

Contact image sensor (CIS) module supplier Asia Tech Image has extended operation to COB (chip on board) packaging of smartphone compact camera modules (CCMs) and will start shipments as soon as the end of second-quarter 2014, according to Chinese-language...

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