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TSMC to triple 16nm chip capacity by end-2016, says co-CEO

Josephine Lien, Taipei; Jessie Shen, DIGITIMES Asia Thursday 28 May 2015 0

TSMC is set to move its 16nm FinFET Plus (16FF+) process to commercial production in the second half of 2015, and plans to introduce a compact version of the 16FF+ process in early 2016, according to president and co-CEO CC Wei. Total production capacity...

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