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Arm and TSMC demo 7nm Arm-based CoWoS chiplets for HPC

Jessie Shen, DIGITIMES, Taipei Friday 27 September 2019 0

Arm and TSMC have announced jointly an industry-first 7nm silicon-proven chiplet system based on multiple Arm cores and leveraging TSMC's chip-on-wafer-on-substrate (CoWoS) advanced packaging solution. This single proof-of-concept chiplet system successfully...

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