The iPhone 12series are expected to see significant sales, with Apple likely to increase orders for its ecosystem partners. Apple will reportedly increase SLP orders with its PCB suppliers for the iPhone 12 mini, as the smaller-size model has good sales prospects in Asia. In the semiconductor backend service sector, strong demand for wire bonding capacity is likely to last beyond first-quarter 2020. And Foxconn is gearing up efforts for the electric vehicle market. The EMS giant has unveiled its MIH software/hardware open platform for EV development.
iPhone 12 mini mainboard suppliers may land extra orders: Taiwan's PCB makers Compeq Manufacturing and Unimicron, both now supplying SLP mainboards for iPhone 12 mini and iPhone 12 Pro Max, are likely to land additional orders from Apple as the former model stands a good chance of seeing better-than-expected sales, according to industry sources.
Taiwan IC backend service firms ramping wire bonding capacity: The current tight wire bonding (WB) packaging capacity at Taiwan's IC backend service firms is likely to last beyond the first quarter of 2020 thanks to strong demand from analog and logic IC vendors, according to industry sources.
Foxconn unveils software/hardware open EV development platform: A joint venture newly established by Foxconn Electronics and Yulon Motor has unveiled MIH, a software/hardware open platform for developing electric vehicles (EVs), according to Foxconn.
