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Infineon promotes cooling solutions for high-voltage power devices

Jay Liu, Taipei; Jessie Shen, DIGITIMES Asia Friday 14 April 2023 0

Credit: Infineon

Infineon is touting its recently released QDPAK and DDPAK top-side cooling (TSC) packages for high-voltage MOSFETs and other power devices, stating the solutions would enable customers to develop differentiated products.

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