MediaTek has successfully developed its first chip utilizing TSMC's cutting-edge 3nm technology, taping out MediaTek's flagship Dimensity system-on-chip (SoC) with volume production anticipated for next year, according to the companies.
Beginning in the second half of 2024, MediaTek's first flagship chipset utilizing TSMC's 3nm process is expected to power smartphones, tablets, intelligent vehicles, and other devices.
"TSMC's consistent and high-quality manufacturing capabilities enable MediaTek to fully demonstrate its superior design in flagship chipsets, offering the highest performance and quality solutions to our global customers and enhancing the user experience in the flagship market," said MediaTek president Joe Chen in a statement.
In the same statement, TSMC SVP of Europe and Asia sales Cliff Hou noted that "throughout the years, we have worked closely with MediaTek to bring numerous significant innovations to the market and are honored to continue our partnership into the 3nm generation and beyond."
Compared with TSMC's N5 process, TSMC's 3nm technology currently offers as much as 18% speed improvement at same power, or 32% power reduction at same speed, and approximately 60% increase in logic density, the company claimed.
Concerns have been raised about the foundry's ability to secure sufficient orders to achieve the goal, despite TSMC's reiteration that N3 will account for 4-6% of revenue this year. In 2023, the foundry will only offer 3nm processors to Apple.
Nonetheless, TSMC will almost undoubtedly see a substantial increase in 3nm process output as it begins to fulfill more orders, including those from MediaTek, according to market sources.
