AI semiconductor company DEEPX (CEO: Lokwon Kim) has been steadily increasing its global marketing efforts since introducing sample chips for international customer evaluation. Now, DEEPX is ramping up the supply of mass-production chips, paving the way for broader commercial opportunities across global markets.
Last month at CES 2025 - one of the world's largest electronics trade shows - DEEPX was recognized as a "must-visit company" by the event's organizer, the Consumer Technology Association (CTA), shining a spotlight on the global market. During the show, over 16,000 visitors stopped by the DEEPX booth, resulting in more than 100 requests for mass-production chip samples—strong indicators of the company's expanding commercial prospects.
During CES, DEEPX showcased various applications of its chips in edge devices for smart cities, smart factories, and robotics, as well as in industrial equipment and edge servers for global enterprises. Demonstrations and on-site meetings were held with a wide range of customers and partners from the United States, Taiwan, Japan, and Europe. In addition, major Korean corporations, government officials, and investors visited the booth on tours to get a firsthand look at DEEPX's technological strengths.
Among the highlights, DEEPX successfully ran its first-generation mass-production chips using AI algorithms developed by:
–Hyundai-Kia Motor Robotics Lab (robot platform)
–Inventec (smart factory)
–POSCO DX (smart factory & logistics automation)
–LG U+ (industrial and urban security)
This demonstration underscored the critical role of on-device AI semiconductors - beyond cloud-based approaches - in ushering in a new era of AI.
DEEPX also directly compared its solution to NVIDIA's Jetson Orin, a GPU-based edge platform, demonstrating approximately 10 times the power efficiency and 20 times the price/performance efficiency of its own NPU-based product. By also conducting a 'butter benchmark' test against other leading global NPU technologies, DEEPX demonstrated its advantage in power efficiency, thermal management, and operational stability - critical factors for on-device AI.
To illustrate its broad compatibility, DEEPX showcased integrations with application processor (AP) systems-including NXP, Renesas, TI, Broadcom, Rockchip, and Intel-as well as small form factor computing solutions such as the popular Raspberry Pi. The company also demonstrated interoperability with partner industrial PCs and leading workstation and server systems from HP, Dell, Supermicro, Lenovo, Inventec, and others, highlighting the versatility and scalability of its solution.
Looking ahead, DEEPX will partner with LG U+ at MWC (Mobile World Congress) in Barcelona from March 3 to demonstrate on-device AI solutions powered by its first-generation chip. DEEPX will also host its own booth to showcase the roadmap for its DX-M2 on-device AI semiconductor, designed for large language models.
Following MWC, DEEPX will head to Embedded World on March 11 in Nuremberg, Germany, where its products will be showcased at partner booths - including Micron, Raspberry Pi, AAEON, DFI, Portwell, SEEED, Biostar, Advantech, and Network Optix - as well as DEEPX's own stand. The company will conduct additional live demos and meet with potential customers to explore new business opportunities.
Article edited by Jack Wu
