Driven by robust AI-related demand for advanced packaging and testing, ASE Technology Holding has raised its 2026 capital expenditure...
TSMC is reportedly developing a new advanced chip-packaging technology modeled on Intel's Embedded Multi-die Interconnect Bridge (EMIB),...
AUO's board of directors on July 30 approved a change in senior management, appointing Chief Financial Officer Chang Po-Yi as the company's...
Samsung Electronics' foundry business expects its 2nm project wins to more than double year-on-year in 2026, and the company is in...
Ennoconn Technologies held its 2026 Semiconductor x AI Applications Forum at Google's Asia-Pacific headquarters in Singapore on July...
Samsung Electronics expects the global memory shortage to become more severe in 2027 than in 2026 and to persist through 2028, memory...