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REALTIME NEWS
GenAI improves chip design efficiency, says Cadence
Tomorrow's Headlines
4min ago
GlobalWafers bullish about HBM memory demand
Tomorrow's Headlines
12min ago
What's the best design for Apple's foldable device?
Tomorrow's Headlines
23min ago
Handset manufacturers concerned about 2H24 profitability due to rising component costs
Tomorrow's Headlines
54min ago
BYD, China Telecom team up for in-vehicle satellite communication
Tomorrow's Headlines
58min ago
DDI firm Novatek expects TV demand to sustain 2Q24 growth
Tomorrow's Headlines
1h 2min ago
IC backend houses raise 2024 capex
Tomorrow's Headlines
1h 3min ago
May 7, 14:30
Samsung outsources partial sensor production to UMC to compete with Sony
May 7, 14:56
Leapmotor reportedly to partner with Stellantis to sell EVs in India
May 7, 16:03
MediaTek launches new 4nm SoC for flagship smartphones
May 7, 15:27
Apple reported developing in-house AI chip for data centers
LATEST STORIES
7 days news
Samsung reportedly sets up a task force to grab Nvidia HBM3E orders
May 7, 14:52
SEMICONDUCTORS
Lenovo and Huawei's venture into AI PCs adds fuel to replacement wave in China
May 7, 14:40
ICT
Microsoft accelerates data center construction and digital talent cultivation in Southeast Asia due to AI potential
May 7, 14:13
SOUTHEAST ASIA
How Indian fabless startup's affordable new SoC will change India and global chip landscape
May 7, 12:25
SOUTH ASIA
Nvidia backs UK self-driving startup Wayve in US$1 billion round
Amazon commits US$9 billion to double Singapore cloud push
Inside the battle for power in the era of energy wars
Mechatronic Systemtechnik unveils state-of-the-art technology center in Fürnitz
Penang to collaborate with Malaysian federal gov't to attract semiconductor investments
Samsung said to consider Inpria's metal oxide resist for 1c DRAM process
Taiwan's TAIDE AI model goes global: bridging cultures and classrooms
Beyond borders: the rise of transcontinental telecom alliances
Johor surges as top data center hub in Malaysia amid growing multinational interest
Taiwan's tech firms rally for smart manufacturing standardization
Mindgrove unveils first RISC-V MCU developed by Indian startup
Growth for Radiant's telematics development: new Vietnam plant scheduled for mass production in 2025
GaAs foundry AWSC enjoys strong demand for flagship smartphones
What made ASML so successful today: Q&A with Dutch Journalist and author Marc Hijink
WinWay expects strong AI and HPC chip demand to drive growth in 2024
IC design houses upbeat about 2H24 prospects
TV panel prices may begin to fluctuate
Network equipment makers see brighter forecasts for 2H24 and 2025
End of US-China trade war? Cross-strait trade and investment gradually recovering
Huawei's supercharging alliance to push for international standard
MediaTek to embrace growth with strong demand for flagship SoCs
Speculation arises about Apple exploring collaboration with EV startup
DRAM and NAND flash prices unlikely to fall over next 2 quarters, says Team Group exec
iPhone maker Hon Hai hits a record high buoyed by AI, Apple
Toyota, Tata Motors positioned to benefit from hybrid auto boom
SK Hynix denies plan to produce DRAM at M17 site
Apple no longer silent on AI; GenAI major talking point at earnings call
Samsung SDI-Stellantis US joint battery plant reportedly to begin production in November
Cloud giants' data center boom driven by AI innovation
Winbond stays in the red, to raise funds for improvements
Keyboards and screens could see major design shifts as part of changes brought upon by AI PC
Rebound from acquisition setback: Q&A with Qisda chairman Peter Chen
BIZ FOCUS
May 7, 09:54
Navigating the maze: Export compliance in electronics industry
Tuesday 7 May 2024
ABB Technologies at core of Net Zero transition
Tuesday 7 May 2024
STAr Technologies and EDA Industries announce strategic partnership
Tuesday 30 April 2024
Era of earbud compromises now over; Skyline, xMEMS solid-state acoustic vent, enables earbuds that excel in every situation
TOP STORIES
China's chip self-sufficiency dream a 21st Century Great Leap Forward? How much longer can it subsidize?
Intel faces a transition dilemma as foundry business unlikely to break even in 3 years
China-based semiconductor equipment suppliers continue to see explosive growth
Huawei's 7nm chip capability and HBM development reflect China's advanced processes ambition
Qualcomm, MediaTek unfazed by Huawei rebound
MOST-READ 2023
Huawei's NearLink wireless technology signals a decoupled connected world
Intel cuts off manufacturing in IDM2.0, TSMC is expected to benefit
Tesla's humanoid robot 'Optimus' debuts in Taiwan, showcasing AI advancements
ASML reportedly sees first big EUV equipment order cut from TSMC
US, Japanese, and Dutch semiconductor equipment export values to China dropped; more substantial strategies demanded by expert
Next US export ban against China could target advanced packaging
Full list
AI EXPO Taiwan 2024
AI EXPO Taiwan 2024 is organized by DIGITIMES, AI Foundation (AIF), and IC Broadcasting. The event takes place at the Taipei Expo Park from April 24 to 26.
From cloud to edge: GenAI's trillion-dollar market potential and challenges unpacked
AI adds cloud and edge integration; traditional storage faces challenges
AI is ubiquitous in TSMC processes, energy efficiency will be key to chip industry's future
...More
EV
Tuesday 7 May 2024
Huawei's supercharging alliance to push for international standard
Speculation arises about Apple exploring collaboration with EV startup
Tuesday 7 May 2024
Nvidia backs UK self-driving startup Wayve in US$1 billion round
Tuesday 7 May 2024
Leapmotor reportedly to partner with Stellantis to sell EVs in India
Tuesday 7 May 2024
TECH
Tuesday 7 May 2024
Speculation arises about Apple exploring collaboration with EV startup
Qualcomm, MediaTek unfazed by Huawei rebound
Friday 3 May 2024
Intel expanding partnerships with 2nd-tier foundries
Thursday 25 April 2024
TSMC global workforce expanding fast
Wednesday 24 April 2024
ASIA
Tuesday 7 May 2024
How Indian fabless startup's affordable new SoC will change India and global chip landscape
Johor surges as top data center hub in Malaysia amid growing multinational interest
Tuesday 7 May 2024
Leapmotor reportedly to partner with Stellantis to sell EVs in India
Tuesday 7 May 2024
Lenovo and Huawei's venture into AI PCs adds fuel to replacement wave in China
Tuesday 7 May 2024
OPINIONS
Tuesday 7 May 2024
What made ASML so successful today: Q&A with Dutch Journalist and author Marc Hijink
Rebound from acquisition setback: Q&A with Qisda chairman Peter Chen
Monday 6 May 2024
Japan takes ambitious action on advanced packaging technology to capture Chiplet and AI chip opportunities
Friday 3 May 2024
China's chip self-sufficiency dream a 21st Century Great Leap Forward? How much longer can it subsidize?
Friday 3 May 2024
TOPICS
US-CHINA TRADE WAR
THE RISE OF MALAYSIA
IOT
TRENDS IN INDUSTRIAL COMPUTING
SPECIAL REPORTS
Tuesday 7 May 2024
Taiwan notebooks, 1Q 2024
Global notebook shipments made a around 5% sequential decline in the fourth quarter of 2023 before enjoying a minor increase in the first quarter of 2024 thanks primarily to robust orders from the eduction procurement sector
Friday 3 May 2024
Global server market, 1Q 2024
Global server shipments slid slightly from a quarter ago in the first quarter of 2024 and will rise around 2% both sequentially and on-yearly in the second quarter.
Thursday 2 May 2024
In-house AI chip R&D of US, China major CSPs
Chinese and US public cloud providers have invested in self-developed chip projects to achieve cost reduction and service differentiation in cloud services through vertical software and hardware integration
Tuesday 30 April 2024
Liquid and air cooling solutions for AI servers
As air cooling grew insufficient for the heat dissipation of datacenters when running AI applications, L2A and L2L cooling methods are likely to see rising penetration to datacenters in the upcoming years.
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