Micron Technology has introduced what it calls the industry's first standard low-power compression attached memory module (LPCAMM2), available in capacities ranging from 16GB to 64GB, and provides improved performance, energy efficiency, space-saving, and modularity for PCs. LPCAMM2 is the first disruptive new form factor for client PCs since the introduction of small outline dual inline memory modules (SODIMM) in 1997, and it is currently sampling with production beginning in the first half of 2024.
Micron's LPDDR5X DRAM, when combined with the innovative LPCAMM2 form factor, provides up to 61% lower power and up to 71% better performance for PCMark 10 essential workloads such as web browsing and video conferencing, as well as a 64% space savings over SODIMM options.
As generative AI use cases spread to client PCs, the performance of the memory subsystem becomes increasingly important. LPCAMM2 provides the necessary performance to process AI workloads on PCs and the potential to scale to applications that require a high-performance and low-power solution in a compact and modular form factor, with the ability to upgrade low-power DRAM for the first time as customer needs evolve.
"Micron is transforming the laptop user's experience with the LPCAMM2 product that will deliver best-in-class performance per watt in a flexible, modular form factor," said Praveen Vaidyanathan, VP and GM of Micron's compute products group. "This first-of-its-kind product will enhance the capabilities of AI-enabled laptops, whose memory capacity can be upgraded as technology and customer needs evolve."
Micron's statement also included comments from Intel, Lenovo, and Compal Electronics regarding its LPCAMM2 product.
"Intel and Micron, in close collaboration with key industry PC leaders, are reimagining the client PC space through developing optimized new platform designs powered by Micron's LPCAMM2 form factor. The technical advantages of LPCAMM2 technology enable Intel and its ecosystem partners to advance sustainable low-power memory technology solutions and exciting new PC designs for the age of the AI PC," said Dimitrios Ziakas, VP of memory and IO technology at Intel.
"LPCAMM2 is a dynamic new form factor for the PC ecosystem that enables higher performance, scalable memory capacity, and improved battery life for mobile workstations and thin and light laptops," said Yasumichi Tsukamoto, executive director and distinguished engineer, commercial product solutions development at Lenovo. "We are proud of our strong relationship and joint development effort with Micron to be one of the first to market in bringing this flexible memory offering to our customers."
"The use of large language models and AI applications on edge devices like laptops and mobile workstations is a key focus area for our future customer-focused designs," said Andy Lee, SVP of Compal. "Compal is working closely with Micron to design platforms that will fuel the AI revolution based on the high bandwidth, low power, and high-capacity capabilities of Micron's LPCAMM2 memory solutions."
Micron will also provide end customers with Crucial LPCAMM2 memory offerings, allowing laptop users such as gamers, on-the-go professionals, and content creators to upgrade their own memory. Crucial LPCAMM2 products will be available in the first half of 2024.
