Samsung Electronics has announced the availability of its latest application processor (AP),...

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Congatec's Conga-TR4 COM Express Type 6 module is based on the new AMD Ryzen Embedded V1000...

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Intel has introduced the new Intel Xeon D-2100 processor, a system-on-chip (SoC) processor...

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SK Hynix has announced the company completed recently the development of enterprise SATA...

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Samsung Electronics has introduced the 860 PRO and 860 EVO solid state drives (SSD), the...

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Micron Technology has launched the Micron 5200 series of SATA solid state drives (SSD). Built...

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Samsung Electronics has begun mass producing the second generation of 10nm-class (1y-nm),...

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STMicroelectronics' PWD13F60 system-in-package (SiP) contains a complete 600V/8A single-phase...

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Alfamation has announced a new test system for manufacturing quality control of in-car wireless...

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Micron Technology's new 32GB NVDIMM-N offers twice the capacity of existing NVDIMMs, providing...

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Infineon Technologies has launched the IRPS5401, a five-output point of load (POL)...

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Samsung Electronics has introduced two new ISOCELL image sensors: 1.28-micrometer 12-megapixel...

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Samsung Electronics has introduced the industry's first embedded Universal Flash Storage...

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Kemet has launcheds KPS-MCC C0G high temperature 200 degrees Celsius bulk capacitance solution...

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Texas Instruments (TI) has developed a new 0.2-inch DLP2000 chipset and US$99 DLP LightCrafter...

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