FormFactor president Joseph R Bronson speaking at SEMICON West 2006
Vista will change the PC landscape, creating more demand for graphics and system memory,...
Photo: Stephen Taylor, DigiTimes.com
SEMICON West 2006 opens
SEMI president and CEO Stan Myers, incoming SEMI chairman Archie Hwang, outgoing SEMI chairman...
Photo: Stephen Taylor, DigiTimes.com
LogicVision president and CEO Jim Healy speaking at SEMICON West 2006
Improved testing is important, but cost is key. Healy cited Qualcomm as finding no problems...
Photo: Stephen Taylor, DigiTimes.com
SIA president George Scalise talking at SEMICON West 2006
Expect roadmaps to unfold as planned, stated Scalise, adding that energy issues will become...
Photo: Stephen Taylor, DigiTimes.com
SEMI China director of market research Samuel Ni speaking at SEMICON West
Ni said that system level production drives China's IC and TFT-LCD fabs as the government...
Photo: Stephen Taylor, DigiTimes.com
DuPont Electronic Technologies vice president & GM David B Miller speaking at SEMICON West 2006
DuPont Electronic Technologies vice president & GM David B Miller said that people expect...
Photo: Stephen Taylor, DigiTimes.com
SEMI president and CEO Stanley T Myers speaks at SEMICON West 2006
Myers expects steady, but moderate growth through 2009 but warned to keep an eye out for...
Photo: Stephen Taylor, DigiTimes.com
SEMI North America president Victoria Hadfield speaking at SEMICON West 2006, kicks-off press conference
Lots of innovation at SEMICON West 2006: 18% of attendees from R&D; 25% of companies (~200)...
Photo: Stephen Taylor, DigiTimes.com
Cypress introduces USB 2.0 controller for mobile phones
Cypress Semiconductor introduced its USB 2.0 programmable microcontroller, MoBL-USB FX2LP18,...
Photo: Cypress
TSMC: Steady semiconductor industry growth to persist for at least a decade
Kenneth Kin, senior vice president of Taiwan Semiconductor Manufacturing Company (TSMC)'s...
Photo: Andrea Liu, DigiTimes
TSMC chairman Morris Chang shows 300mm wafer technology at SemiTech
TSMC chairman Morris Chang shows a 300mm wafer with copper pad and bumping, made by TSMC,...
Photo: Vyacheslav Sobolev, DigiTimes
300mm wafer from UMC with 11 copper layers
SemiTech Taipei 2006: UMC showcases a 300mm wafer with 11 copper layers, manufactured on...
Photo: Vyacheslav Sobolev, DigiTimes
TSMC showcases world's first 0.13-micron wafer
The world's first 12-inch wafer fabbed using a 0.13-micron process, produced by Taiwan Semiconductor...
Photo: Cage Chao, DigiTimes
Intel shows 12-inch wafer produced using 45nm technology at IDF
Paolo Gargini of Intel's Technology and Manufacturing Group shows a 12-inch wafer produced...
Photo: David Tzeng, DigiTimes
Infineon introduces new VoIP processor
Infineon Technologies recently announced the INCA-IP2, a single-chip Gigabit Ethernet IP...
Photo: Company
