Samsung 512Mb MCP PRAM
Samsung Electronics has announced what it claims is the industry's first multi-chip package...
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Hynix 44nm 2Gb DDR2 for mobile applications
Hynix Semiconductor has developed 2-gigabit (2Gb) low-power DDR2 DRAM for mobile applications...
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As Microsoft transitions from a software giant to a cloud leader, with its cloud business now accounting...
TSMC founder Morris Chang's second autobiography volume unveils a tapestry of milestones, including his influential comeback, rekindled alliances with...
CSP in-house development of ASIC accelerators
Google TPUs will see a share of over 70% in the in-house developed cloud ASIC accelerator market in 2024; an all-optical network...
AI chip market outlook 2023-2028: Insights from demand and supply perspectives
The growing demand for AI computational power is accelerating advancements in hardware and chip technology, necessitating innovation...
Automotive CIS tech development, 2024
The popularization of autonomous driving is boosting demand for automotive CIS with LFM and HDR being mainstream development...
