VIA ART-3000 embedded box PC
VIA Technologies has announced the VIA ART-3000, a complete, fanless and rugged embedded...
Photo: Company
A technical drawing of Em-ITX board and expansion module
VIA Technologies has announced its latest board form factor for embedded system developers,...
Photo: Company
TSMC unveiled plans to nearly triple its investment in the United States to US$165 billion, a move...
The 2025 Mobile World Congress (MWC 2025) was held in Barcelona, Spain, from March 3 to March 6. A gathering for industry leaders and members of the...
Tesla AI development in EVs and robots
Tesla leads the trend of automakers deploying humanoid robots, with reducing labor workforce as the initial goal.
India 5G market and development, 2025
India is rising to become a major 5G nation and a growth driver for the global telecom market in 2025.
Global investment plans of Japanese IDMs
Geopolitical tensions prompt Japanese IDMs to gather capacities in Japan's Kyushu and Tohoku regions and prioritize their OSAT...
