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Infineon Technologies is expanding its recently launched CoolMOS P7 technology with a SOT-223 package. The device has been developed as a one-to-one drop-in replacement for DPAK. It is fully compatible with a typical DPAK footprint, according to the vendor. The combination of the new CoolMOS P7 platform with the SOT-223 package is meant for applications such as charger for smartphones, laptop adapters, TV power supply, and lighting.

The new CoolMOS P7 is designed to address needs of the low power SMPS market. It uses Superjunction technology, which results in a reduced overall bill of materials (BOM) on the customer side, according to Infieneon. The SOT-223 package is a DPAK alternative and well established in price sensitive markets. The thermal behavior of the CoolMOS P7 in this package was assessed across several applications. When the SOT-223 was placed on a DPAK footprint, the temperature increased by a maximum of 2-3 degrees C compared to a standard DPAK.

The CoolMOS P7 in SOT-223 is available in 600 V, 700 V, and 800 V devices.