During the ongoing 3GSM World Congress 2007 in Barcelona, Chi Mei Communication Systems (CMCS), an affiliate of Hong Kong-listed Foxconn International Holdings (FIH), showcased its first smartphone, the iPaq 510, built for Hewlett-Packard (HP).
The iPaq 510 is built around the Texas Instruments (TI) OMAP 850 platform, supports integrated quad band GSM/GPRS/EDGE, and features built in Wi-Fi and VoIP as well as push email support.
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- Silicon photonics set for takeoff (Oct 30) - EE Times
- TikTok founder becomes China's richest man (Nov 1) - BBC News
- Nvidia to take Intel's spot on Dow Jones Industrial Average (Nov 1) - Reuters
- Huawei's latest AI processors were made by TSMC (Oct 22) - Bloomberg
- Arm to scrap Qualcomm chip design license in feud escalation (Oct 23) - Bloomberg
- Embedded World brings 3,500 visitors to 1st US outing (Oct 11) - EE Times
- Preparing electronics engineering students for industry (Oct 8) - EETimes Europe
- Former Apple hardware chief Dan Riccio is retiring (Oct 11) - Ars Technica
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