OCZ Technology Group recently launched the OCZ PC3-12800 Flex XLC kit featuring OCZ's Flex XLC (Xtreme Liquid Convention) heatsink, extending OCZ's Flex-series of heat sinks to high speed, enhanced latency DDR3.
OCZ's Flex XLC heatsink dissipates heat via a hybrid copper and aluminum design alterable between passive air or water cooling.
This unique "flexible" design gives enthusiasts the option to run the modules passively or water-cooled via an integrated liquid injection system.
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- Silicon photonics set for takeoff (Oct 30) - EE Times
- TikTok founder becomes China's richest man (Nov 1) - BBC News
- Nvidia to take Intel's spot on Dow Jones Industrial Average (Nov 1) - Reuters
- Huawei's latest AI processors were made by TSMC (Oct 22) - Bloomberg
- Arm to scrap Qualcomm chip design license in feud escalation (Oct 23) - Bloomberg
- Embedded World brings 3,500 visitors to 1st US outing (Oct 11) - EE Times
- Preparing electronics engineering students for industry (Oct 8) - EETimes Europe
- Former Apple hardware chief Dan Riccio is retiring (Oct 11) - Ars Technica
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